ウェットエッチングによる特殊形状加工プロセスの新展開 : 単結晶シリコンの微細3次元加工の研究(<小特集>第1回マイクロ・ナノ工学シンポジウム)

Abstract

Advanced bulk micromachining using aqueous pure and Triton X-100 [C_<14>H_<22>O(C_2H_4O)_n, n=9-10] added 25wt% tetramethylammonium hydroxide (TMAH) solutions is presented in order to extend the range of MEMS structures realized by wet etching. Fabrication processes include two-step wet etching, local oxidation of silicon (LOCOS), and silicon direct wafer bonding. A wide range of both fixed and freestanding MEMS structures are fabricated. The fixed structures such as rectangular and circular corrugations, square and circular shapes trays, etc. contain perfectly sharp edges and corners. The freestanding structures such as cantilever, microfluidic channels, etc. are fabricated using thermal oxide and single crystal silicon as materials.