Системный подход по внутрисхемной диагностике и проектированию печатных плат для локомотивов

Abstract

In the conditions of microminiaturization of electronic equipment, the issues of design of switching structures are becoming increasingly relevant. The classic solution for the switching structure of functional modules of electronic equipment (EE) are multilayer printed circuit boards - printed circuit boards consisting of several layers of dielectric with conductive patterns between the layers and on the outer sides. The main task in the design of multilayer printed circuit boards is to ensure a reliable design, as well as high quality of the transmitted signal. The relevance of research is due to the fact that today more and more electronic devices have a considerable number of elements used and strict restrictions on the dimensions of the device, which leads to the need to use multilayer printed circuit boards, including in the RF range. When designing the layers of the printed circuit board, the sequence of the arrangement of the layers of the printed tracks is established; a decision is made: which of them should be solid layers of power and earth; the value of the dielectric constant of the substrate and the distance between the printed layers are taken into account; the required dimensions of the printed tracks and the minimum width of the gaps between them are calculated. It is worth noting the influence of the choice of manufacturing technology on the design of a multilayer printed circuit board.