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Abstract
The process of automated placement of elements on a rigid-flex printed circuit board is considered. A technique has been developed for automated placement of elements on a rigid-flexible printed circuit board of an electronic device, taking into account thermal and electromagnetic compatibility based on a two-level genetic algorithm. Research was carried out aimed at determining the weight coefficients for two levels of the developed methodology for automated placement of elements on a rigid-flex printed circuit board. The work of the developed method for automated placement of elements on a rigid-flexible printed circuit board is considered using a practical example. A comparative analysis of the results of solving the problem of placing elements on a rigid-flexible printed circuit board in manual and automated modes was carried out.
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