Abstract
The effects of plating factors on the magnetic properties of electrodeposited Co-P have been investigated using a Cu substrate in chloride baths containing NaH2PO2 at 50°C under galvanostatic conditions. The coercive force (Hc), the residual magnetization (Mr), and the Mr/Ms ratio measured along in-plane (||) and perpendicular (⊥) directions to the Co-P film plane changed with variations in the NaH2PO2 concentration in the bath, organic additives, and current density. Under conditions where the c-axis of hexagonal crystals deposited was oriented perpendicular to the film plane, the Mr (⊥) and the Mr/Ms (⊥) increased, and the Mr (||) and the Mr/Ms (||) decreased. The Hc was dependent on the crystal grain size of deposited Co-P. The Hc increased with a decrease in the grain size of deposits in the range of 15 to 31nm, while the Hc decreased with a decrease in the grain size in a range no longer than 15nm. On the other hand, the Hc also tended to increase when the c-axis of hexagonal crystals deposited was oriented perpendicular to the film plane.
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