Отсекающий УФ-светофильтр для предотвращения отрицательного наклона стенок мастер-штампа мягкой литографии

Abstract

The general-purpose polymers formation issues are solved using micro- and nanoelectronic technologies of new generation, for example a nanoimprint lithography. One of its subspecies, soft lithography, includes topology formation using soft master die fabricated by hard mold imprint. Therefore, engineering study of possibility of hard molds self-dependent fabrication for the purposes of optoelectronic data bus formation for new generation printed circuit boards using general-purpose polymer materials is a priority. In this work, to rationalize the purchasing cost of an expensive hard mold of soft lithography, an original technological process for a hard mold fabrication based on the SU-8 photoresist has been developed and implemented. During the performing of the proposed technological process, the reason for the negative slope (T-topping) formation of soft lithography hard mold walls made of SU-8 photoresist was determined. A series of cut-off UV filters for optical wavelengths less than 350 nm has been developed and fabricated to eliminate T-topping. Based on the UV radiation intensity experimental measurements data from the i-line mercury lamp of the automated alignment and exposure system EVG620 NT, the UV radiation intensity attenuation dependences on the functional layer thickness of the developed optical UV filter for 365 and 400 nm wavelengths are plotted. The developed UV filters application effectiveness has been proven due to T-topping elimination during the technological process of producing the soft lithography hard mold test topology. The use of soft lithography will make it possible in the future to create a new generation printed circuit boards with a built-in optoelectronic data bus in the form of a polymer planar optical waveguides array and optical input / output elements.