Abstract
The development of lead-free solders is urgent from an environmental point of view. In this work the wettability and contactability of eutectic Sn-Bi and Sn-Bi-Ag solders on Cu plates were studied and compared with those of the conventional eutectic Sn-Pb solder. Four kinds of fluxes were used. The wettability was esti-mated by measuring the spreading area of solders. Best wettability was gained by using H-flux which con-tains a fair amount of chlorine. Poorer wettability of Sn-Bi solders as compared with Sn-Pb solder may be caused by a dendritic growth of Cu-Sn compound (ε-phase) interior of the solder bulk from the solder/copper interface. The wettability of the Sn-Bi solder was slightly improved by the addition of silver.
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