Abstract
The effects of the addition to organic acid baths for displacement solder plating of surfactants used as leveling agents and oxidation inhibitors used as bath stabilizers were investigated. The most effective surfactants were found to be isolated systems of Triton X-100 and laurylpyridinium chloride for the hydrophile-lipophile balance of the surfactants and a mixture of laurylamine and Triton X-100 for a decrease in foaming. o-Aminophenol and o-phenylenediamine, which are conjugated-system compounds of 1, 2-substituted benzenes and have moderate reducing power, showed good properties as oxidation inhibitors.
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