Abstract
In this study, the bonding characteristics of epoxy solder joints for the manufacture of highly reliable medical electronic devices were investigated. A total of 2000 cycles of thermal shock tests were performed by simulating the heat generation of electronic devices on specimens manufactured using eutectic solders (SAC305 and Sn58Bi) and epoxy solders (SACE and Sn58BiE). After the thermal shock, the formation of internal cracking owing to the difference in the thermal expansion coefficients of dissimilar material solder joints and the deterioration of the bonding properties of the solder joints was analyzed. Consequently, in the case of the epoxy solder, the epoxy was cured outside the solder joint, suppressing thermal stress owing to a difference in thermal expansion coefficients and suppressing the internal cracking of the solder joint, thereby improving the bonding characteristics of the solder joint.
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