Abstract
(Ti, Al) N films possessing various composition ratios of Ti and Al were deposited onto slide glass and a hard alloy substrate by rf sputtering. The power was supplied from a single electric power source which was spilt by a variable coupling capacitor. A series of (Ti, Al) N specimens was obtained by changing the electric power distribution to Ti and Al targets in argon-nitrogen gas mixtures. The film compositions was measured by EDX and EPMA, and X-ray diffraction method was studied by the structure of the films. The corrosion rate of (Ti, Al) N films was judged from weight loss after immersion in 5% H2SO4 solution at 70°C.The results showed that all the (Ti, Al) N films possess homogeneous distribution of Ti and Al elements. X-ray patterns revealed formation of TiN for concentrated Ti side and AIN formation for Al riched side. The film phase having Ti-to-Al ratios approximating 1:1 was TiAIN. The corrosion resistance of films for concentrated Ti side showed better properties than that for Ti to Al ratios about 1:1. Hardness of (Ti, Al) N films of Ti to Al composition ratio about 1:1 was approximately Hv 1200.
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