電子システムの熱レイアウト設計における解析手法と最適化手法の融合によるファースト・オーダー・デザイン(システム最適化)

Abstract

Until now, the analysis method and the optimization method, which were used in design, were evolving independently. However, when designed combining them, coexistence of time and precision was difficult. Then, we aimed at constructing the high-speed first order design method by the modularizing model and integration of first order analysis and optimization method based on boundary conditions between modules as the dynamic behavior of the design object. It designed using the thermal layout problem (all 16 parameters, design space about 6*10^<24>) of four device modules as a virtual design object. As a result, for 600s, the design time could search about 2*10^7 counts of evaluation for the proper solution, and enabled the very high-speed first order design.