Abstract
In the field of ultra precise positioning, such as semiconductor lithograph machine, an active isolation system is generally installed. In a present lithograph manufacturing machine, the scanning type is a main current, furthermore the main structure supported projection lens is separated from wafer stage which can be freely moved in the stage stroke, and the stage is supported by independent isolation system on the base. When wafer stage move, its reaction force is caught by mechanical supported structure (reaction frame) to avoid exciting the surface plate of the wafer stage. At this time, reaction frame is vibrating due to its natural frequency, and this remaining vibration transfer to surface plate directly or through floor. Still more the accuracy of the machine get worse. In this paper, when wafer stage moved and its reaction force excite the reaction frame, it is introduced that the improvement of vibration reduction method by using active mass damper. Eventually it is able to improve the enough performance for vibration disturbance.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Transactions of the Japan Society of Mechanical Engineers Series C
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
