Abstract
중고온용 열전 소재로 우수한 특성을 나타내는 <TEX>$CoSb_3$</TEX>계 소재의 열전 소자 제조를 위해 방전플라즈마 소결법을 이용하여 소결 및 Cu-Mo 전극 소재와의 접합을 동시에 실시하였다. <TEX>$CoSb_3$</TEX> 내부로의 Cu 확산을 방지하기 위해 Ti을 중간층으로 삽입하였으며 열팽창계수의 조절을 위해 Cu : Mo = 3 : 7 부피비 조성을 선택하였다. 삽입된 Ti과 <TEX>$CoSb_3$</TEX>는 <TEX>$TiSb_2$</TEX> 이 차상을 형성하면서 접합이 진행되었지만 접합 온도 및 접합 시간의 증가에 따라 TiSb 및 TiCoSb 등의 상의 형성에 의해 접합 계면에서 균열이 발생되어 접합 특성을 악화시키는 것으로 밝혀졌다. <TEX>$CoSb_3$</TEX>-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of <TEX>$CoSb_3$</TEX> powder and joining of <TEX>$CoSb_3$</TEX> to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into <TEX>$CoSb_3$</TEX> and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and <TEX>$CoSb_3$</TEX> was effective to join <TEX>$CoSb_3$</TEX> to Cu-Mo by forming an intermediate layer of <TEX>$TiSb_2$</TEX> at the Ti-<TEX>$CoSb_3$</TEX> boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/<TEX>$CoSb_3$</TEX> and intermediate/intermediate layers.
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