Abstract

본 논문에서는 향상된 전기적 특성과 면적효율을 갖는 새로운 구조의 ESD 보호회로를 제안한다. 제안된 회로는 기존의 3-STACK LVTSCR과 비교하여 높은 홀딩전압과 낮은 트리거전압 특성, 향상된 Ron 저항 특성을 갖는다. 제안된 ESD 보호회로는 기존 보호회로 대비 35% 정도의 작은 면적, 35V의 트리거 전압과 8.5V의 홀딩전압을 갖는다. 또한 제안된 ESD 보호회로의 래치-업 면역특성을 향상시키기 위해 기생 바이폴라 트랜지스터들의 유효 베이스 길이를 설계변수로 설정하여 설계하였고 시놉시스사의 TCAD 시뮬레이션을 통하여 제안된 ESD 보호회로를 검증하고 전기적 분석을 실행하였다. This paper presents the ESD protection circuit with improved electrical characteristic and area efficiency. The proposed ESD protection circuit has higher holding voltage and lower trigger voltage characteristics than the 3-Stacking LVTSCR. In addition, it has only two stages and has improved Ron characteristics due to short discharge path of ESD current. We analyzed the electrical characteristics of the proposed ESD protection circuit by TCAD simulator. The proposed ESD protection circuit has a small area of about 35% compared with 3-Stacking LVTSCR, The proposed circuit is designed to have improved latch-up immunity by setting the effective base length of two NPN parasitic bipolar transistors as a variable.

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