Экспериментальное изучение нагревания подложки при распылении сэндвич-мишени медь–титан

Abstract

The article is devoted to the study of We investigate the previously unknown features of thermal processes accompanying the involved in sputtering of a copper-titanium sandwich target. The target contained two plates fixed on the same axis with a gap of 1 mm. The inner 4-mm thick copper plate was cooled by running water. An external 1-mm thick titanium plate was operated in a hot mode, being cooled by means of radiation and thermal conductivity of the fasteners. To study the heat flux that heat heating the substrate, a thermocouple sensor with a sensitive element made of a copper disk with an area of 100 mm2 was used. The element heating kinetics were measured at a discharge current of 1.0…3.0 A and an argon pressure of 2…6 mTorr. It was found that, under these conditions, the kinetic curves of heating the sensitive element of the sensor were established to have inflection points at times time points that are proportional to the discharge current density and argon pressure. This feature is due to the finite value of the target heating time constant. In addition, the study showed that the stationary temperature of the substrate and the time constant of its heating are proportional to the discharge current and argon pressure. The influence of the target on the substrate heating kinetics is taken into account in the analytical description by introducing a factor in the form of an exponential function of time.