Abstract
Various methods of nondestructive testing, including active infrared thermography, are used to detect latent subsurface defects in the contact of layers in multilayer products. One of the main difficulties using this method consists in processing and interpreting the thermal image data. The peculiarity of investigated defects of bimetal plate layers continuity violation is that the depth of defect location is known and the main task is to determine its size. Some methods are used for this purpose including analysis of spatial temperature profiles. Aim. To analyse the use of various approaches to determining the transverse dimensions of a delamination between metals in simulating active thermal non-destructive testing of steel-aluminium plates. Materials and methods. Mathematical and computer simulating methods, numerical differentiation are used. The delamination size is determined by projections of half the height of the amplitude signal and the extremum of the derivative of the temperature signal function. Calculations and graphical constructions are performed using the mathematical package GNU Octave. Results. Numerical simulation is carried out for different values of heat flow power, heating and cooling time. The temperature signal distribution over the surface of a multilayer bimetallic plate has been plotted. The values of the defect radius according to the projections of the characteristic points are determined. Conclusion. The results of simulation allow us to conclude that using the projection of the extremum of the temperature signal derivative function allows us to accurately estimate the defect size, while in the case of the point projection cor¬responding to half of the signal amplitude height, the result is underestimated. The obtained results can be used for further experimental studies of processes of active thermal non-destructive testing of products made of multilayer bimetallic materials.
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More From: Bulletin of the South Ural State University. Ser. Computer Technologies, Automatic Control & Radioelectronics
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