Abstract
The physical and technological features of the die installation on a temporary carrier in the technology of internal mounting have been studied. A reasonable choice of material from various solutions of polyamide acids (PAA) was carried out for fixing silicon dies with the active side down on a temporary carrier. The experimental dependence of the adhesion strength of silicon dies on the lifetime of PAA solutions has been established. Possible defects appeared during imidization of PAA in the process of creating highly integrated micro-assemblies, multi-chip modules and electronic modules of the system-in-case level were shown.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
