Zinc-blende GaN Layers Research Articles

Influence of Xe+ and Ga+ milling species on the cathodoluminescence of wurtzite and zincblende GaN

III-nitride materials, such as GaN and its alloys, are essential for modern microelectronics and optoelectronics due to their unique properties. Focused ion beam (FIB) techniques play a crucial role in their prototyping and characterization at the micro- and nanoscale. However, conventional FIB milling with Ga ions presents challenges, including surface amorphization and point defect introduction, prompting the exploration of alternative ion sources. Xenon-based inductively coupled plasma or plasma FIB has emerged as a promising alternative, offering reduced damage and better sample property preservation. Despite extensive research on FIB-induced damage in GaN, systematic comparisons between Ga and Xe ion milling on the luminescence characteristics of GaN remain limited. This study aims to fill this gap by evaluating and comparing the extent of FIB-induced damage caused by Ga and Xe ions in wurtzite and zincblende GaN through cathodoluminescence measurements. Our findings indicate that Xe ion milling yields higher integrated intensities compared to Ga ion milling, attributed to shallower implantation depths and reduced lattice disorder. We also observe a decrease in integrated intensity with increasing ion beam acceleration voltage for both wurtzite and zincblende GaN layers. This study provides valuable insights into optimizing FIB-based sample preparation techniques for III-nitride materials, with implications for enhancing device performance and reliability.

Molecular beam epitaxy as a growth technique for achieving free-standing zinc-blende GaN and wurtzite AlxGa1-xN

Currently there is a high level of interest in the development of ultraviolet (UV) light sources for solid-state lighting, optical sensors, surface decontamination and water purification. III-V semiconductor UV LEDs are now successfully manufactured using the AlGaN material system; however, their efficiency is still low. The majority of UV LEDs require AlxGa1-xN layers with compositions in the mid-range between AlN and GaN. Because there is a significant difference in the lattice parameters of GaN and AlN, AlxGa1-xN substrates would be preferable to those of either GaN or AlN for many ultraviolet device applications. However, the growth of AlxGa1-xN bulk crystals by any standard bulk growth techniques has not been developed so far.There are very strong electric polarization fields inside the wurtzite (hexagonal) group III-nitride structures. The charge separation within quantum wells leads to a significant reduction in the efficiency of optoelectronic device structures. Therefore, the growth of non-polar and semi-polar group III-nitride structures has been the subject of considerable interest recently. A direct way to eliminate polarization effects is to use non-polar (001) zinc-blende (cubic) III-nitride layers. However, attempts to grow zinc-blende GaN bulk crystals by any standard bulk growth techniques were not successful.Molecular beam epitaxy (MBE) is normally regarded as an epitaxial technique for the growth of very thin layers with monolayer control of their thickness. In this study we have used plasma-assisted molecular beam epitaxy (PA-MBE) and have produced for the first time free-standing layers of zinc-blende GaN up to 100μm in thickness and up to 3-inch in diameter. We have shown that our newly developed PA-MBE process for the growth of zinc-blende GaN layers can also be used to achieve free-standing wurtzite AlxGa1-xN wafers. Zinc-blende and wurtzite AlxGa1-xN polytypes can be grown on different orientations of GaAs substrates - (001) and (111)B respectively. We have subsequently removed the GaAs using a chemical etch in order to produce free-standing GaN and AlxGa1-xN wafers. At a thickness of ∼30µm, free-standing GaN and AlxGa1-xN wafers can easily be handled without cracking. Therefore, free-standing GaN and AlxGa1-xN wafers with thicknesses in the 30–100μm range may be used as substrates for further growth of GaN and AlxGa1-xN-based structures and devices.We have compared different RF nitrogen plasma sources for the growth of thick nitride AlxGa1-xN films including a standard HD25 source from Oxford Applied Research and a novel high efficiency source from Riber. We have investigated a wide range of the growth rates from 0.2 to 3µm/h. The use of highly efficient nitrogen RF plasma sources makes PA-MBE a potentially viable commercial process, since free-standing films can be achieved in a single day.Our results have demonstrated that MBE may be competitive with the other group III-nitrides bulk growth techniques in several important areas including production of free-standing zinc-blende (cubic) (Al)GaN and of free-standing wurtzite (hexagonal) AlGaN.

Doping of free-standing zinc-blende GaN layers grown by molecular beam epitaxy

Currently there is high level of interest in developing of vertical device structures based on the group III nitrides. We have studied n- and p-doping of free-standing zinc-blende GaN grown by plasma-assisted molecular beam epitaxy (PA-MBE). Si was used as the n-dopant and Mg as the p-dopant for zinc-blende GaN. Controllable levels of doping with Si and Mg in free-standing zinc-blende GaN have been achieved by PA-MBE. The Si and Mg doping depth uniformity through the zinc-blende GaN layers have been confirmed by secondary ion mass spectrometry (SIMS). Controllable Si and Mg doping makes PA-MBE a promising method for the growth of conducting group III-nitrides bulk crystals.

Molecular beam epitaxy as a method for the growth of freestanding zinc-blende (cubic) GaN layers and substrates

The authors have studied the growth of bulk, freestanding zinc-blende (cubic) GaN layers by plasma-assisted molecular beam epitaxy (PA-MBE). They have established that the best structural properties of freestanding zinc-blende GaN can be achieved with initiation under Ga-rich conditions but without Ga droplet formation. It is difficult to initiate the growth of zinc-blende GaN, but it is even more difficult to sustain the growth of the pure zinc-blende polytype in thick layers without any wurtzite inclusions. In order to grow high quality freestanding cubic GaN layers, it is necessary to maintain the same growth conditions for about 1week. The best quality zinc-blende phase GaN was achieved in the first 10μm of the GaN layers. The authors have produced zinc-blende GaN substrates from our thick bulk GaN layers and they used the side previously attached to the GaAs substrate as the episide of these zinc-blende GaN substrates. They have demonstrated the scalability of the process by growing zinc-blende GaN layers on 2 and 3in. diameter wafers. The growth of freestanding bulk GaN layers has allowed them to refine the value for the lattice parameter of zinc-blende GaN as 4.510±0.005Å. They have demonstrated that the PA-MBE process developed has allowed them to grow freestanding AlxGa1−xN wafers.

Magnetic and structural properties of Gd-implanted zinc-blende GaN

Zinc-blende GaN layers grown by molecular beam epitaxy were uniformly focused-ion-beam implanted with 300keV Gd3+ ions for doses ranging from 1×1012to1×1015cm−2, and their structural and magnetic properties were studied. The implanted samples were not subjected to any annealing treatment. Only Gd incorporation into zinc-blende GaN was observed by x-ray diffraction. Magnetic investigations using superconducting quantum interference device magnetometry reveal a (super)paramagneticlike behavior with an ordering temperature around 60K for the sample with the highest implantation dose. Our experimental studies indicate that the spontaneous electric polarization in wurtzite GaN is the crucial mechanism for its ferromagneticlike behavior upon Gd doping.

Substrate Nitridation Effects on GaN Grown on GaAs Substrates by Molecular Beam Epitaxy Using RF-Radical Nitrogen Source

The initial substrate nitridation effects on the crystal structure of GaN epitaxial layers grown on GaAs substrates by gas source molecular beam epitaxy using RF-radical N2 as a nitrogen source were investigated. The crystal structure of GaN grown on (100) GaAs substrates was critically influenced by substrate nitridation time, that is, zincblende GaN was grown on the substrate without nitridation, and wurtzite GaN was grown on the nitrided substrate (longer than 120 s). The substrate misorientation effects on surface morphology and X-ray full width at half-maximum of zincblende GaN layers were also studied. A featureless smooth surface was obtained for a layer grown under the high V/III beam flux ratio condition.