Whisker Initiation Research Articles

Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth

The implementation of the Restriction of Hazardous Substances (RoHS) European Union (EU) Directive in 2005 resulted in the introduction of pure tin as an acceptable surface finish for printed circuit boards and component terminations. A drawback of pure tin surface finishes is the potential to form tin whiskers. Tin whiskers are a metallurgical phenomenon that is associated with tin rich/pure tin materials and has been a topic of intense industry interest. The acceptance and usage of pure tin by the electronics industry component fabricators is understandable as the pure tin surface finishes are inexpensive, are simple plating systems to operate and have reasonable solderability characteristics. However, high performance/harsh environment electronics typically have product life cycles that are measured in decades and therefore are much more susceptible to the potential long term threat of tin whiskers. The GEIA-STD-0005-2 “Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems” established the definition of the term “Pb-free tin” as : “Pb-free Tin is defined to be pure tin or any tin alloy with <3% lead (Pb) content by weight. A functional definition of “pure tin” was necessary so that the electronics industry could establish tin whisker risk protocols against a known acceptable target value in terms of soldering materials and processes. An investigation was conducted to determine the influence of 1% - 5% elemental lead (Pb) content in tin plating on tin whisker initiation and growth. The investigation results were used in the revision of the GEIA-STD-0005-2 “Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems” specification technical discussions.

Alkali Silicate Glass Coatings for Mitigating the Risks of Tin Whiskers

Alkali silicate glass (ASG) coatings were investigated as a possible method for inhibiting tin whisker initiation and growth. The aqueous-based ASG formulations used in this study were deposited with equipment and conditions that are typical of those used to apply conventional conformal coatings. Processes for controlling ASG coating properties were developed, and a number of ASG-based coating combinations were applied to test components with pure tin surfaces. Coatings were applied both in a laboratory environment at Rockwell Collins and in a manufacturing environment at Plasma Ruggedized Solutions. Testing in elevated humidity/temperature environments and subsequent inspection of the test articles identified coating combinations that inhibited tin whisker growth as well as other material combinations that actually accelerated tin whisker growth. None of the coatings evaluated in this study, including conventional acrylic and Parylene conformal coatings, completely prevented the formation of tin whiskers. Two of the coatings were particularly effective at reducing the risks of whisker growth, albeit through different mechanisms. Parylene conformal coating almost, but not completely, eliminated whisker formation, and only a few tin whiskers were found on these surfaces during the study. A composite of ASG and alumina nanoparticles inhibited whisker formation to a lesser degree than Parylene, but did disrupt whisker growth mechanisms so as to inhibit the formation of long, and more dangerous, tin whiskers. Additional testing also demonstrated that the conformal coatings had relatively little effect on the dielectric loss of a stripline test structure operating at frequencies over 30 GHz.

Kinetics of Sn whisker nucleation using thermally induced stress

We have simultaneously measured the evolution of stress and formation of whiskers/hillocks in Sn layers using stress induced by thermal-expansion mismatch. The formation kinetics suggest that whisker initiation is controlled by a nucleation process. We use measurements of the nucleation rate at different stresses and temperatures to determine quantitatively how the activation barrier for nucleation is decreased by the stress in the layer.

Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin–Copper Coating on Copper Leadframes

To evaluate the contribution of coating stress to whisker initiation from IC package leads, the stress distribution in the coating was investigated by finite-element analysis (FEA). Two different leadframe samples, which were composed of the same tin-copper coating on two different copper-leadframe materials, namely, copper-iron (hereafter, CUFE; corresponding to CDA number C19400) and copper-chromium (CUCR; CDA number C18045), were used to examine the whisker-initiation behavior on the coating surfaces. The two samples showed significantly different tendencies of whisker initiation from the coating. That is, after long-term storage at room temperature, no whisker initiation was observed on the coating on the CUCR sample, whereas long whiskers (with a maximum length of more than 200 μm) were formed from the coating on the CUFE sample. The FEA calculation on the leadframe samples revealed that the coatings had a two-directional stress gradient, namely, one gradient toward the surface and another toward the base leadframe material. It also indicated a difference between the stress distributions in the two samples. The gradient of normal stress on the coating's grain boundaries (GBs), toward the surface of the CUFE sample, was found to be larger than that in the CUCR sample. This result implies that the tin-atom flux along a GB in the coating on the CUFE sample was larger than that on the CUCR sample because the atom flux along the GB was proportional to the stress gradient. It agrees with the above-mentioned whisker-initiation behaviors in the samples. We thus conclude that in the CUFE sample, a whisker initiates either from a surface grain immediately on top of a GB or from surface grains located on both sides of the same GB. To confirm this conclusion, the correlation between the tin-diffusion sites and whisker formation sites was investigated. Simulation of atom diffusion by molecular dynamics indicated that the dominant tin-diffusion site is a GB when compressive stress is applied in the direction normal to the GB. Investigation of the correlation between the whisker roots and coating microstructures of the CUFE sample showed that the whisker roots were located on top of GB intersections in the coating. These results indicate that whisker-initiation sites are correlated with dominant tin-diffusion sites and that each whisker initiates either from a surface grain located immediately on top of a GB or from surface grains located on both sides of the same GB.

Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

The effects of temperature and humidity on tin whisker growth were investigated through a collaborative project sponsored by the International Electronics Manufacturing Initiative (iNEMI) and its member companies. A broad range of testing conditions was adopted to test a variety of components with matte tin (Sn) plating and copper (Cu)-based leadframes. The primary goal of the study was to collect data that could be used to develop mathematical models (acceleration functions) that describe the dependence of tin whisker growth and corrosion on temperature and humidity. This paper describes the background, experimental design, data collection and reports results. Part II of the study (J. W. Osenbach et a. ?Tin whisker test development-Temperature and humidity effects part II: Acceleration model development,? Electronics Packaging Manufacturing, Vol. 33, no. 1, pp., Jan. 2010) discusses in the data analyses and acceleration model development. Storage testing was performed over a wide range of temperature and humidity conditions from 30?C to 100?C and from 10% to 90% relative humidity (RH). Commercially produced components with both 3 ?m and 10 ?m thicknesses from three sources were evaluated. For components with the 10 ?m-plating, the plating was evaluated in both the as-plated and reflowed (260?C) conditions. These variations resulted in a large experimental matrix that included 13 different Sn platings, aged at ten different temperature and humidity combinations. Further, the aging test was done at five different laboratories with inspections performed at eight different laboratories. The data collected include 1) corrosion incubation time, 2) tin whisker incubation time, and 3) dependence of the maximum whisker length on storage time at each temperature/humidity condition. Data suggest that corrosion is not a unique driving force for whisker initiation and growth. Whisker formation differs in corroded and non-corroded regions. Due to the scope of this work, it is broken down into two papers. The data and experimental observations are discussed in this paper. The mathematical model development, discussion of results and conclusions are included in Part II of this study.

Tin Whisker Nucleation and Growth on Sn-Pb Eutectic Coating Layer Inside Plated Through Holes With Press-Fit Pins

It has been long believed that residual stress is the root cause for tin whisker formation on pure tin-plated component leads. However, tin whisker formation could be observed on the surface of other tin-based alloys under certain conditions. In this study, the whisker formation was reported on a coating layer of Sn-Pb eutectic hot air solder leveling (HASL), which was under compression stress conditions due to the inserted compliant pins. In-Situ scanning electron microscopy was used to monitor the nucleation and growth of whiskers. In addition, a mechanical experiment and non-linear contact finite element analysis were used to estimate the magnitude of the stress in the HASL coating layer. It was found that the tin whisker formation with whisker size of more than 10 mum could occur on the surface of 60Sn-60Pb plating within less than 30 min at an ambient temperature under compressing stress conditions. The tin whisker initiation and growth were further studied at an elevated temperature of 70 degC to check if a higher temperature effects Tin whisker formation. It is believed that establishment of a quantitative relationship of whisker formation/growth under compressive stress and elevated temperature conditions could lead to better scientific methods for risk and reliability assessment and smooth transitions to lead-free assemblies.

Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe

Tin/copper (Sn/Cu) coatings on Cu leadframes (CUFE), in which Fe atoms are doped as a minor element, showed whisker initiation at room temperature over a long period of 47 months. By means of the planar slice method and electron back scattering pattern (EBSP) measurement, the whisker roots were consistently found to be located at the intersections of grain boundaries in the coating. Whisker roots were also located above the peaks and ridge lines of intermetallic compound (IMC) Cu6Sn5, which was formed with a pyramid-shaped configuration between the Sn/Cu coating and Cu leadframe. Using finite element analysis (FEA), we calculated stress distribution in the coating. The results indicated that compressive stress normal to the grain boundary was induced with a gradient toward the surface in the coating. Therefore, the compressive stress gradient induced by the pyramid-shaped IMC is thought to be the root cause of whisker initiation in Sn/Cu coatings on Cu leadframes. When the Cu leadframe with a minor doped element of Cr atoms (CUCR) was used as the substrate with the same Sn/Cu coating, no whisker initiation was observed even after a longer storage time of 65 months. Through field-emission scanning transmission electron microscopy (FE-STEM) and field-emission transmission electron microscopy (FE-TEM) microstructural observations of vertical sections of each sample, the shape of the IMCs formed between the coating and the leadframe in the Sn/Cu-CUFE sample was found to be different from that in the Sn/Cu-CUCR sample. The difference in whisker initiation tendency can therefore be explained by the difference in compressive stress depending on the shape of the Cu-Sn IMCs, because stress distribution in the coating of the Sn/Cu-CUCR sample calculated using FEA revealed a smaller stress gradient than that in the Sn/Cu-CUFE sample.

Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating

Drastically different tendencies of whisker initiation have been observed from the same Sn/Cu coating electrodeposited on two different Cu leadframe materials, CUFE and CUCR. After long-term storage at room temperature, no whisker initiation was observed on the coating on CUCR, whereas long whiskers with a maximum length of more than 200 μm were formed on the coating on CUFE. FE-STEM and FE-TEM microstructural observations of vertical sections of each Cu leadframe with the coating showed that the cross-sectional morphologies of Cu-Sn intermetallic compounds (IMCs) formed at the interface between the coating and the leadframe were as follows: a wedge-shaped structure for the Sn/Cu- CUFE sample and a comb-tooth structure for the Sn/Cu-CUCR sample. Energy dispersive X-ray (EDX) analysis results confirmed that the formation morphologies of the Cu-Sn IMC were affected by minor elements in the Cu leadframes. Fe particles with a large diameter of mainly 50-200 nm precipitated nonuniformly in the CUFE leadframe, which had Fe, Zn, and P as minor elements. Conversely, very small Cr-rich particles, 10-20 nm in diameter, were precipitated in the CUCR leadframe, which had Cr, Sn, and Zn as minor elements. The Fe particles suppressed the growth of the Cu-Sn IMC by acting as obstacles to IMC formation, whereas grain boundaries in the Sn/Cu coating acted as preferential IMC formation sites. The combination of these two effects is thought to produce the wedge-shaped cross-sectional structure of the IMC. On the other hand, the Cr-rich particles did not have such a prominent suppression effect on Cu-Sn IMC growth: only the grain boundaries in the Sn/Cu coating affected the IMC formation site. As a result, IMC with a comb-tooth structure was formed in the Sn/Cu- CUCR sample. The difference in whisker initiation tendency was inferred to be due to the difference in compressive stress on the basis of the Cu-Sn IMC formation morphology in the Sn/Cu coating. Therefore, the stresses were finally measured by X-ray diffraction to determine the correlation between whisker initiation tendency and the morphology of Cu-Sn IMC formation. Based on the results, a model for controlling whisker initiation in Sn/Cu-coated Cu leadframe systems is presented.

Theory of Tin Whisker Growth: “The End Game”

Previous theories of the tin whisker growth proposing various dislocation mechanisms have been largely disproved. This paper presents a new and different theory for the mechanism of tin whisker growth. The theory addresses the fundamental requirements for Sn to diffuse to the base of the whisker grain and proposes a mechanism for whisker initiation and growth. Part of this is a theoretical proposal as to what makes the whisker grain different. The role of oxidation in whisker growth is also briefly addressed. Using this theory, attempts are made to illustrate how different whisker shapes are created. Finally, a proposed potential solution to tin whisker growth is presented, assuming that this theory is correct

Stress-Induced Tin Whisker Initiation Under Contact Loading

As electronic components become smaller, tin whiskers have an increasingly adverse effect on the assessment of the reliability of the components. In particular, the contact between components brings about whisker initiation near the contact area. Although a number of spontaneous tin whisker models have been proposed, a model of tin whisker initiation by contact loading has not yet been established. In this paper, the behavior of stress-induced tin whiskering by contact load was examined in a tin plating based on multiaxial creep theory. Creep properties were measured using a nanoindentation creep technique. The creep rate of Sn-10Pb is higher than that of Sn and affects the generation of compressive stresses after stress relaxation. Nonlinear finite-element analysis (FEA) reveals that the multiaxial compressive stress state appears after stress relaxation. The axial compressive stress increases even though the contact stress decreases. When multiaxial stresses are applied, not only axial stress but also the difference between stresses, affects the behavior of whisker formation. The axial compressive stress depends on the structures of the contact bodies, and the contact stress depends on the creep properties of the plating

339 外力によるSn系メッキのウィスカ発生評価に関する研究(GS1(6) 変形,破壊挙動,疲労,クリープ,衝撃)

339 外力によるSn系メッキのウィスカ発生評価に関する研究(GS1(6) 変形,破壊挙動,疲労,クリープ,衝撃)

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous chemical reaction of the Sn layer and the Sn5Cu6 layer. The Sn layer is assumed to be an elasto-plastic material. The results presented herein is useful in understanding why the compressive stress in the Sn layer can initiate a tin whisker near the weak spot of a SnOx layer.

Studies of zinc whiskers formation and growth from bright zinc electrodeposits

SUMMARYZinc whiskers growing from bright electroplated zinc have been observed on electrical components. Some whiskers were up to 3cm in length and others capable of carrying a continuous current of 5 mA. In consequence a programme has been carried out aimed at studying the formation and growth of the zinc whiskers, which could readily be grown from bright zinc electrodeposits. Techniques used to study the growth are described and zinc whisker growth was monitored over a prolonged time period under ambient conditions. The bulk properties and the influence of brighteners are recorded. Results demonstrate that the presence of brightening agents cause whisker initiation and growth and that growth is probably related to electrodeposits microstress. Both passivated and non-passivated bright deposits produce whisker growth. Dull zinc deposits from cyanide baths, without organic additives, do not produce zinc whiskers.