With the wide application of SAC305 solders in electronic packaging, it is important to examine their reliability. In this study, uniaxial ratcheting experiments were carried out on SAC305 solders with varying loading rates, mean stresses, and stress amplitudes at room temperature. Based on the unified creep–plasticity constitutive model applicable to SAC305 solders, a nonlinear continuum damage mechanics model was established to simulate the whole-life ratcheting behavior. The damage variable was extracted from the elastic modulus decline of the unloading section during the cyclic loading process, and its evolution was based on the damage dissipation potential, which was derived from the theory of continuum damage mechanics. In addition, the normalized life was used to correct the evolution of the damage variable. For a more accurate description of their evolution, the energy method was used to modify the damage evolution parameters under different loading conditions. Finally, the uniaxial ratcheting behavior of SAC305 solder could be accurately described by the modified damage-coupled constitutive model under different loading conditions.
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