Use In Military Systems Research Articles

ARTIFICIAL INTELLIGENCE AND ARMS CONTROL

The emergence of artificial intelligence has brought new challenges and opportunities to the global arms control regime. Integration of AI into military systems can complicate states’ security matrix, due to its speed and accuracy, with additional problems of distinguishability, integration, and accountability. AI can be a useful tool to enhance transparency in verification measures for an effective arms control treaty. Arms control for the regulation or limiting use in military systems is as important as the use of AI for improving the arms control regime. The integration of AI in arms control is not without its pitfalls; it offers several new opportunities. Its use could help address some of the anxieties that prevent states from willingly engaging in an arms control agreements. These developments are important because of the shortcomings in global arms control treaties, and regional rivals like India and Pakistan. AI intergration could incentive the South Asian nuclear neighbours to maintain strategic stability.

Improving HFI within systems acquisition: methods, tools and future directions

Recent years have seen an increased recognition of the role of the human operator in both the development and use of military systems. Human Factors Integration (HFI), the structured management process for ensuring the capture and accommodation of human capabilities and limitations in design has, however, a mixed record of success within military system developments. This paper describes research conducted by the HFI Defence Technology Centre (HFI DTC) to identify and address the barriers to HFI through the development of processes, methods and tools. Future changes in the operational context and military doctrine are also discussed in terms of the likely adaptations to the HFI process.

Development of test vehicles for evaluating plastic-encapsulant reliability and improving thermal conductivity of encapsulant materials

Abstract Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and electrical stability on deposited elements and integrated-circuit devices. Reliability evaluations in screen tests and various temperature/humidity/bias environments are also essential prior to use in advanced packaging. Encapsulant reliability evaluation requires a test vehicle (MCM-C and MCM-L) to identify these key performance characteristics to assure environmental and mechanical protection because no complete multichip test vehicle, however, is available for use. An encapsulant test vehicle in previous work was modified by substituting a Sandia ATC04 chip and a silver-comb-pattern array with varying feature sizes, using only a single nichrome-resistor network, and adding a deposited comb pattern. The unpassivated resistor and a silver-comb pattern offer both a go/no-go and quantitative test for screening encapsulants and the Sandia chip facilitates stress measurements on the die as well as thermal dissipation evaluation with resistance heaters on the chip. An industry-standard encapsulant, Hysol® FP 4450, was modified to improve thermal conductivity. Exact filler selection and loading were optimized, balancing dispensability, wear, and flow characteristics. Control materials (Hysol® FP 4450) and improved, thermally conductive versions were exposed to short-term screen tests, long-term humidity, and elevated temperature storage testing. Thermal conductivity of Hysol® FP 4450 was improved by approximately 200% and both materials were comparable in temperature/humidity/bias and highly accelerated stress testing as well as thermal cycling and elevated temperature storage.

Large format fabrication—a practical approach to low cot MCM-D : GEORGE WHITE, ERIC PERFECTO, DALE MCHERRON, THOMAS DEMERCURIO, THOMAS REDMOND and MAURICE NORCOTT. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 37 (February 1995)

Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and electrical stability on deposited elements and integrated-circuit devices. Reliability evaluations in screen tests and various temperature/humidity/bias environments are also essential prior to use in advanced packaging.Encapsulant reliability evaluation requires a test vehicle (MCM-C and MCM-L) to identify these key performance characteristics to assure environmental and mechanical protection because no complete multichip test vehicle, however, is available for use. An encapsulant test vehicle in previous work was modified by substituting a Sandia ATC04 chip and a silver-comb-pattern array with varying feature sizes, using only a single nichrome-resistor network, and adding a deposited comb pattern. The unpassivated resistor and a silver-comb pattern offer both a go/no-go and quantitative test for screening encapsulants and the Sandia chip facilitates stress measurements on the die as well as thermal dissipation evaluation with resistance heaters on the chip.An industry-standard encapsulant, Hysol® FP 4450, was modified to improve thermal conductivity. Exact filler selection and loading were optimized, balancing dispensability, wear, and flow characteristics. Control materials (Hysol® FP 4450) and improved, thermally conductive versions were exposed to short-term screen tests, long-term humidity, and elevated temperature storage testing. Thermal conductivity of Hysol® FP 4450 was improved by approximately 200% and both materials were comparable in temperature/humidity/bias and highly accelerated stress testing as well as thermal cycling and elevated temperature storage.

System level hardware module generation : MANI B. SRIVASTAVA, BRIAN C. RICHARDS and ROBERT W. BRODERSEN. IEEE Transactions on Very Large Scale Integration (VLSI), 3(1), 20 (March 1995)

Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and electrical stability on deposited elements and integrated-circuit devices. Reliability evaluations in screen tests and various temperature/humidity/bias environments are also essential prior to use in advanced packaging.Encapsulant reliability evaluation requires a test vehicle (MCM-C and MCM-L) to identify these key performance characteristics to assure environmental and mechanical protection because no complete multichip test vehicle, however, is available for use. An encapsulant test vehicle in previous work was modified by substituting a Sandia ATC04 chip and a silver-comb-pattern array with varying feature sizes, using only a single nichrome-resistor network, and adding a deposited comb pattern. The unpassivated resistor and a silver-comb pattern offer both a go/no-go and quantitative test for screening encapsulants and the Sandia chip facilitates stress measurements on the die as well as thermal dissipation evaluation with resistance heaters on the chip.An industry-standard encapsulant, Hysol® FP 4450, was modified to improve thermal conductivity. Exact filler selection and loading were optimized, balancing dispensability, wear, and flow characteristics. Control materials (Hysol® FP 4450) and improved, thermally conductive versions were exposed to short-term screen tests, long-term humidity, and elevated temperature storage testing. Thermal conductivity of Hysol® FP 4450 was improved by approximately 200% and both materials were comparable in temperature/humidity/bias and highly accelerated stress testing as well as thermal cycling and elevated temperature storage.

Thermal resistance simulation of IC packages using a three-dimensional boundary element method : Toshiki Sotaet al. Proceedings of the 22nd Symposium on Reliability and Maintainability, Tokyo, Japan. Union of Japanese Scientists and Engineers, 5 (June 1992)

Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and electrical stability on deposited elements and integrated-circuit devices. Reliability evaluations in screen tests and various temperature/humidity/bias environments are also essential prior to use in advanced packaging.Encapsulant reliability evaluation requires a test vehicle (MCM-C and MCM-L) to identify these key performance characteristics to assure environmental and mechanical protection because no complete multichip test vehicle, however, is available for use. An encapsulant test vehicle in previous work was modified by substituting a Sandia ATC04 chip and a silver-comb-pattern array with varying feature sizes, using only a single nichrome-resistor network, and adding a deposited comb pattern. The unpassivated resistor and a silver-comb pattern offer both a go/no-go and quantitative test for screening encapsulants and the Sandia chip facilitates stress measurements on the die as well as thermal dissipation evaluation with resistance heaters on the chip.An industry-standard encapsulant, Hysol® FP 4450, was modified to improve thermal conductivity. Exact filler selection and loading were optimized, balancing dispensability, wear, and flow characteristics. Control materials (Hysol® FP 4450) and improved, thermally conductive versions were exposed to short-term screen tests, long-term humidity, and elevated temperature storage testing. Thermal conductivity of Hysol® FP 4450 was improved by approximately 200% and both materials were comparable in temperature/humidity/bias and highly accelerated stress testing as well as thermal cycling and elevated temperature storage.

The microcircuit pacemaker. Space age spin-off to achieve reliability and long life : T. P. Adams AND M. D. Fasano Jr.Proc. Reliability and Maintainability Symp., Washington D. C., p. 360, 28–30 January, 1975

Plastic-encapsulated microcircuits (PEMs) are proposed for use in military systems to reduce cost and eliminate long-lead items such as packages and lids. Encapsulant materials must be evaluated for compatibility with devices and fine-wire bonds, and electrical stability on deposited elements and integrated-circuit devices. Reliability evaluations in screen tests and various temperature/humidity/bias environments are also essential prior to use in advanced packaging.Encapsulant reliability evaluation requires a test vehicle (MCM-C and MCM-L) to identify these key performance characteristics to assure environmental and mechanical protection because no complete multichip test vehicle, however, is available for use. An encapsulant test vehicle in previous work was modified by substituting a Sandia ATC04 chip and a silver-comb-pattern array with varying feature sizes, using only a single nichrome-resistor network, and adding a deposited comb pattern. The unpassivated resistor and a silver-comb pattern offer both a go/no-go and quantitative test for screening encapsulants and the Sandia chip facilitates stress measurements on the die as well as thermal dissipation evaluation with resistance heaters on the chip.An industry-standard encapsulant, Hysol® FP 4450, was modified to improve thermal conductivity. Exact filler selection and loading were optimized, balancing dispensability, wear, and flow characteristics. Control materials (Hysol® FP 4450) and improved, thermally conductive versions were exposed to short-term screen tests, long-term humidity, and elevated temperature storage testing. Thermal conductivity of Hysol® FP 4450 was improved by approximately 200% and both materials were comparable in temperature/humidity/bias and highly accelerated stress testing as well as thermal cycling and elevated temperature storage.