Nano-Ag paste is a popular material in power electronic packaging, while its microstructure is unstable at high temperatures and suffers from electrochemical migration. In this work, Ag-Pd nanoalloy film has been prepared by the pulsed laser deposition, and been sintered at low temperature for packaging. The thermal stability is significantly improved at 300 ℃ when Ag is alloyed with Pd. The Pd addition significantly increased the diffusion activation energy of Ag atoms and reduced the diffusion coefficient. The Ag-Pd sintered layer exhibited a stable microstructure at 300 °C or even 500 °C, which indicated that Ag-Pd nanoalloy had the potential to serve at high temperatures. Ag-Pd nanoalloy will preferentially generate a PdO passivation film and cover the anode surface, thereby slowing down the dissolution of the Ag and improving its resistance to electrochemical migration. This work provides theoretical studies and insights into the applications of Ag-Pd nanoalloys in high-reliability power electronics.
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