Ultra-wide Bandgap Semiconductor Research Articles

Photoluminescence and Raman spectroscopy of wide bandgap semiconductors damaged by deep-UV laser irradiation

The effects of a pulsed, focused, deep-UV (4.66 eV) laser on wide and ultra-wide bandgap semiconductors were investigated with photoluminescence (PL) and Raman spectroscopy. Three semiconductor single crystals were studied: silicon carbide (6H-SiC), gallium nitride (GaN), and gallium oxide (β-Ga2O3). Atomic emission lines from neutral Ga or Si were observed during the laser-damage process. For all three semiconductors, PL mapping (3.49 eV laser excitation) of the damaged material revealed visible emission bands in the 2.6–2.8 eV range, attributed to point defects. Raman spectra (2.33 eV excitation) showed a reduction in the Raman peak intensities in the damaged region, along with weak PL bands around 1.9–2.1 eV.

Design and research of high voltage β-Ga2O3/4H-SiC heterojunction LDMOS

Abstract In recent years, gallium oxide (Ga2O3), one of the ultra-wide band-gap semiconductor materials, has been regarded as one of the most promising materials in the field of high-voltage and high-power electronic devices in the future because of its unique electrical properties and low preparation cost. However, it is difficult for β-Ga2O3 materials to form effective P-type doping, so the PN junction is not formed in most of its power devices, which greatly limits the improvement of its voltage resistance. A novel lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOS) is proposed to realize a junction β-Ga2O3 power device and improve the voltage resistance performance of β-Ga2O3 power devices. In this device, a β-Ga2O3 power device with a junction is realized by using P-type 4H-SiC to form a PN junction with N-type β-Ga2O3, and the voltage resistance of the β-Ga2O3 power device is improved. Sentaurus TCAD software was used to simulate the device structure and electrical performance. The device is optimized by adjusting the length of the drift zone, drift zone concentration, SiC channel concentration, and gate oxide thickness. Optimized, the device exhibits a positive threshold voltage of 3.42 V, a breakdown voltage of 2203 V, a specific on-resistance of 7.80 mΩ·cm2, and a power figure of merit of 622 MW cm−2. The results show that the heterojunction device is significant for realizing high-performance junction β-Ga2O3 power devices.

Zr-Doping Strategy of High-Quality Cu2O/β-Ga2O3 Heterojunction for Ultrahigh-Performance Solar-Blind Ultraviolet Photodetection.

β-Ga2O3, as an ultrawide band gap semiconductor, has emerged as the most promising candidate in solar-blind photodetectors. The practical application of β-Ga2O3, however, suffers from intrinsic defects and suboptimal crystal quality within the devices. In this work, high-quality β-Ga2O3 was successfully synthesized by employing the Zr-doping strategy, which has facilitated the development of ultrahigh-performance solar-blind photodetectors based on Cu2O/β-Ga2O3 heterostructures. Structural analyses indicate that the strong Zr-O covalent bond effectively stabilizes the material, thereby eliminating oxygen vacancy defects. The Cu2O/β-Ga2O3 heterostructure photodetector demonstrates an ultrahigh responsivity and detectivity coupled with an external quantum efficiency. Furthermore, the device exhibits a photocurrent-to-dark current ratio of 3 × 105, showcasing its superior capability in detecting low-intensity deep ultraviolet signals, markedly surpassing previous heterostructure ultraviolet photodetectors. These exceptional performances are attributed to the effective elimination of oxygen vacancy defects in β-Ga2O3 and the variation of band alignment at the interface, which facilitate rapid separation of photogenerated electron-hole pairs under reverse bias. This study not only provides an enhanced and easy route to mitigate oxygen vacancy defects in oxide materials but also propels further exploration into the next generation of flexible, high-performance, solar-blind ultraviolet photodetectors.

Machine Learning Enabled High‐Throughput Screening of 2D Ultrawide Bandgap Semiconductors for Flexible Resistive Materials

AbstractThe 2D ultrawide bandgap (UWBG) semiconductors have attracted great attentions for the next generation of electronics and optoelectronics, owing to their superiority on material flexibility, device stability, and power consumption. However, few 2D UWBG semiconductors have been discovered, impeding their prosperous developments and widespread applications. Here, a high‐throughput workflow is constructed to screen 2D UWBG semiconductors assisted by machine learning, and 507 potential candidates are obtained. Moreover, by learning, predicting, and screening Young's modulus and Poisson's ratio, 31 flexible 2D UWBG semiconductors are identified. Then the generation and the diffusion of anion vacancies, as well as the corresponding electronic properties are investigated by using the first‐principles calculations, and 3 of them are demonstrated as the most promising candidates for the flexible resistive materials. The facile interface tunneling and the increased material conductance caused by the anion vacancies will contribute to the transition from high resistive state to low resistive state. This work provides an efficient high‐throughput screening protocol to enrich the family of 2D UWBG semiconductors and is expected to foster their practical applications.

Giant Colloidal Quantum Dot/α-Ga2O3 Heterojunction for High Performance UV-Vis-IR Broadband Photodetector.

Broadband optoelectronics, which extend from the UV to IR regions, are crucial for imaging, autonomous driving, and object recognition. In particular, photon detection efficiency relies significantly on semiconductor properties, such as absorption coefficients and electron-hole pair generation rate, which can be optimized by designing a suitable p-n junction. In this study, we devise giant PbS colloidal quantum dots (G-PbS CQDs) that exhibit high absorption coefficients and broadband absorption. To leverage these exceptional optical properties, we combine G-PbS CQDs with an ultrawide-bandgap semiconductor, α-Ga2O3, and create an efficient G-PbS CQD/α-Ga2O3 heterojunction photodetector that exhibits high performance across the UVC-vis-NIR spectrum range. The resultant heterojunction facilitates efficient electron-hole pair separation at the G-PbS CQD/α-Ga2O3 heterojunction. Furthermore, we utilize transparent graphene electrodes to overcome the limitations of conventional transistor-type device structures and the substantial optical losses induced by opaque metal electrodes. This strategy maximizes the light-collection area and results in an approximately 3-orders of magnitude higher responsivity (55.5 A/W) and specific detectivity (1.66 × 1013 Jones) compared to devices with opaque metal electrodes.

Deep-ultraviolet transparent conducting SrSnO3 via heterostructure design.

Exploration and advancements in ultrawide bandgap (UWBG) semiconductors are pivotal for next-generation high-power electronics and deep-ultraviolet (DUV) optoelectronics. Here, we used a thin heterostructure design to facilitate high conductivity due to the low electron mass and relatively weak electron-phonon coupling, while the atomically thin films ensured high transparency. We used a heterostructure comprising SrSnO3/La:SrSnO3/GdScO3 (110), and applied electrostatic gating, which allow us to effectively separate charge carriers in SrSnO3 from dopants and achieve phonon-limited transport behavior in strain-stabilized tetragonal SrSnO3. This led to a modulation of carrier density from 1018 to 1020 cm-3, with room temperature mobilities ranging from 40 to 140 cm2 V-1 s-1. The phonon-limited mobility, calculated from first principles, closely matched experimental results, suggesting that room temperature mobility could be further increased with higher electron density. In addition, the sample exhibited 85% optical transparency at a 300-nm wavelength. These findings highlight the potential of heterostructure design for transparent UWBG semiconductor applications, especially in DUV regime.

Effect of Substrate Thinning on Temperature Rise in Ga2O3 Rectifiers

The low thermal conductivity of β-Ga2O3 is a concern for the high-power switching applications envisaged for this ultra-wide bandgap semiconductor. In this work, we examine the effect of substrate thinning to reduce the temperature rise in rectifiers under high power conditions and also reduce the on-resistance. The Ga2O3 substrates on which the rectifiers were fabricated were thinned from the original thickness of 630 μm to a lowest value of 50 μm and transferred to a brass heat sink. Experimentally, we observed that the on-resistance was reduced from 5.66 to 5.17 mΩ.cm2 when thinning to 50 μm, in excellent agreement with simulations. The calculated peak temperature rise was roughly halved for rectifiers on such thin substrates over a broad range of power densities (500–1500 W.cm2), a result supported by thermal imaging.

2D Embedded Ultrawide Bandgap Devices for Extreme Environment Applications.

Ultrawide bandgap semiconductors such as AlGaN, AlN, diamond, and β-Ga2O3 have significantly enhanced the functionality of electronic and optoelectronic devices, particularly in harsh environment conditions. However, some of these materials face challenges such as low thermal conductivity, limited P-type conductivity, and scalability issues, which can hinder device performance under extreme conditions like high temperature and irradiation. In this review paper, we explore the integration of various two-dimensional materials (2DMs) to address these challenges. These materials offer excellent properties such as high thermal conductivity, mechanical strength, and electrical properties. Notably, graphene, hexagonal boron nitride, transition metal dichalcogenides, 2D and quasi-2D Ga2O3, TeO2, and others are investigated for their potential in improving ultrawide bandgap semiconductor-based devices. We highlight the significant improvement observed in the device performance after the incorporation of 2D materials. By leveraging the properties of these materials, ultrawide bandgap semiconductor devices demonstrate enhanced functionality and resilience in harsh environmental conditions. This review provides valuable insights into the role of 2D materials in advancing the field of ultrawide bandgap semiconductors and highlights opportunities for further research and development in this area.

Composition analysis of β-(In x Ga1-x )2O3 thin films coherently grown on (010) β-Ga2O3 via mist CVD

ABSTRACT This study investigates the compositional analysis and growth of β-(In x Ga1-x )2O3 thin films on (010) β-Ga2O3 substrates using mist chemical vapor deposition (CVD), including the effects of the growth temperature. We investigated the correlation between In composition and b-axis length in coherently grown films, vital for developing high-electron-mobility transistors and other devices based on β-(In x Ga1-x )2O3. Analytical techniques, including X-ray diffraction (XRD), reciprocal space mapping, and atomic force microscopy, were employed to evaluate crystal structure, strain relaxation, and surface morphology. The study identified a linear relationship between In composition and b-axis length in coherently grown films, facilitating accurate composition determination from XRD peak positions. The films demonstrated high surface flatness with root-mean-square roughness below 0.6 nm, though minor relaxation and granular features emerged at higher In compositions (x = 0.083) at the growth temperature of 750°C. XRD results revealed that lattice relaxation were observed at a growth temperature of 700°C despite low In composition. In contrast, at 800°C, the In composition was higher than at 750°C, and coherent growth was achieved. The surface morphology was the flattest at 750°C. These findings indicate that the growth temperature plays a crucial role in the mist CVD growth of β-(In x Ga1-x )2O3 thin films. This study offers insights into the relationship between In composition and lattice parameters in coherently grown β-(In x Ga1-x )2O3 films, as well as the effect of growth conditions, contributing to the advancement of ultra-wide bandgap semiconductor device development.

A Radial Distribution Function Based Recognition Algorithm of Point Defects in Large-Scale β-Ga2O3 Systems.

The atomic configurations and concentrations of intrinsic defects profoundly influence the electrical and optical properties of the semiconductor materials. This influence is particularly significant in the case of β-Ga2O3, which is a highly promising ultrawide bandgap semiconductor characterized by highly complex intrinsic defect configurations. Despite its importance, there is a notable absence of an accurate method to recognize these defects in large-scale atomistic computational modeling. We design an effective algorithm for the explicit identification of various intrinsic point defects in the β-Ga2O3 lattice, which constitutes the integration of the particle swarm optimization (PSO) and K-means clustering (K-MC) methods. Our algorithm attains the recognition accuracy exceeding 95%. Finally, the algorithm is applied to dynamic simulations, where the feasibility of dynamic real-time detection is explored.

Extremely Low Thermal Resistance of β-Ga2O3 MOSFETs by Co-integrated Design of Substrate Engineering and Device Packaging.

Gallium oxide (Ga2O3) emerges as a promising ultrawide bandgap semiconductor, which is expected to surpass the performance of current wide bandgap materials, like GaN and SiC, in electronic devices. However, widespread application of Ga2O3 is hindered by its extremely low thermal conductivity and lack of effective device-level thermal management strategies. In this work, Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) are fabricated by conducting co-integrated design of substrate engineering with layer transferring and device packaging. 3D Raman thermography is introduced as a novel method to analyze the temperature distribution within the device, which provides valuable insights into their thermal performances. A high-quality Ga2O3-SiC heterogeneous integrated material is successfully fabricated with an extremely low interface thermal resistance of 6.67 ± 2 m2·K/GW. Compared to the homoepitaxial Ga2O3 MOSFETs, the degradation of Ion/Ioff in Ga2O3-SiC MOSFETs is decreased by 1.5 orders of magnitude, and that of Ron is decreased by 31%, showing the great thermal stability of Ga2O3-SiC MOSFETs. With the additional device packaging, a significant one order-of-magnitude reduction in the thermal resistance of the Ga2O3-SiC MOSFET is achieved, reaching a record-low value of 4.45 K·mm/W in the reported Ga2O3 MOSFETs. This work demonstrates an efficient strategy for device-level thermal management in next-generation Ga2O3 power and RF applications.

Growth of water-insoluble rutile GeO2 thin films on (001) TiO2 substrates with graded Ge x Sn1−x O2 buffer layers

Rutile GeO2 (r-GeO2) is an ultrawide bandgap semiconductor with the potential for ambipolar doping and bulk single-crystal growth. In this study, we investigated r-GeO2 thin films grown on (001) TiO2 substrates with graded Ge x Sn1−x O2 buffer layers. GeO2 grown on bare TiO2 substrates via mist chemical vapor deposition exhibited water-soluble amorphous and/or α-quartz phases alongside the rutile phase. In contrast, the insertion of graded Ge x Sn1−x O2 buffer layers on the TiO2 substrate allowed the growth of single-phase water-insoluble r-GeO2 thin films. This study contributes to the development of water-insoluble r-GeO2 thin films for various applications.

Ultrawide-Bandgap Semiconductors for High-Frequency Devices

Ultrawide-Bandgap Semiconductors for High-Frequency Devices

High responsivity and detectivity β-Ga2O3 solar-blind photodetectors optimized by oxygen vacancy engineering

Solar-blind photodetectors (SBPDs) are core essential components for many critical applications such as precision guidance, fire warning, and space communications. Ultra-wide bandgap semiconductor β-Ga2O3 is considered to be an ideal material for the fabrication of SBPDs. However, synthetizing β-Ga2O3 with high quality factor while simultaneously in situ modulation of electronic and optoelectronic properties to enhance performance has been challenging. Here, pulsed laser deposition (PLD) technology is used to synthesize high-quality β-Ga2O3 thin films on a sapphire substrate. The oxygen vacancy engineered β-Ga2O3 films can achieve in situ precise control of their surface morphology, optical parameters, and optoelectronic properties by simply adjusting the oxygen pressure. Meanwhile, the optimal thickness of the β-Ga2O3 film for the developing high-performance SBPD is ∼221 nm, determined by fitting and analyzing the optical parameters measured by the ellipsometry. Subsequently, the influence of oxygen pressure on the performance of β-Ga2O3 SBPD is thoroughly explored, considering the optimization of electrode size and deposition time. When the oxygen pressure is set to 15 Pa, the β-Ga2O3-based SBPD achieves highly competitive responsivity (R) and detectivity (D*) at 250 nm, with values of 1080 A·W−1 and 1.4 × 1016 cm·W−1·Hz1/2, respectively. Additionally, the noise component of the β-Ga2O3 SBPD is further studied to calibrated the traditional device performance results. This work introduces a simple and straightforward approach to in situ tuning of the optoelectronic properties of β-Ga2O3, which is important for advancing β-Ga2O3 film growth technology and fabricating high-performance photodetectors.

Structural design and electronic performance at MOx/diamond (M = Hf, Zr, Ti, Al, Sc, Y) interfaces for MOS device applications

The ultra-wide bandgap semiconductor diamond represents a promising potential for advancement and innovation in the field of electronic device development. Utilizing first-principles calculations, a thorough investigation has been performed on the structural and electronic characteristics of MOx/diamond (MOx = HfO2, ZrO2, TiO2, Al2O3, Sc2O3, Y2O3) heterostructures. The concentration of charge transfer at the high-κ oxide/diamond interfaces leads to obvious interface polarity localization characteristics. The studied MOx/diamond heterojunctions feature insulating interfaces without any gap states. The MOx/diamond supercells exhibit the ability to effectively confine holes on the diamond surface owing to the large band offsets (>1 eV), showing typical electronic properties of “type II” staggered energy band configurations. These findings demonstrate that the high-κ oxide MOx/diamond can serve as highly promising diamond gate dielectrics, and provide theoretical insights into the interfacial engineering of diamond MOS devices.

Lateral NiO/AlN Heterojunction Rectifiers with Breakdown Voltage >11 kV

Lateral NiO/AIN heterojunction diodes (HJDs) with breakdown voltage up to 11.6 kV and Ni/Au/AlN Schottky barrier diodes (SBDs) with VB of 8.6 kV were fabricated on layers grown on sapphire substrates by metalorganic chemical vapor phase deposition. The power figure-of-merits VB 2/RON where RON is the on-resistance were 0.31 MW·cm−2 for HJD and 0.16 MW·cm−2 for SBD. The lowest turn-on voltages were ∼2.03 and 1.91 V for HJDs and SBDs, respectively, with ON/OFF ratios up to 102. The maximum field before breakdown was 0.45 MV·cm−1 in HJDs and 0.31 MV·cm−1 in SBDs. These correspond to <3% of the critical field in AlN of ∼15 MV·cm−1. This work demonstrates there is still significant optimization to be done in the overall quality of the AlN, including purity, crystal perfection, and defect density to realize the potential of this material as an ultra-wide bandgap semiconductor for efficient multi-kV power switching applications. Our results also demonstrate the promise of NiO as a p-type conducting oxide for forming heterojunctions with AlN.

High Field Transport in (Ultra) Wide Bandgap Semiconductors: Diamond Versus Cubic GaN

High Field Transport in (Ultra) Wide Bandgap Semiconductors: Diamond Versus Cubic GaN

Probing room temperature indirect and minimum direct band gaps of h-BN

Hexagonal boron nitride (h-BN) has attracted considerable interest as an ultrawide bandgap (UWBG) semiconductor. Experimental studies focused on the detailed near band-edge structure of h-BN at room temperature are still lacking. We report a direct experimental measurement of the near band-edge structure performed on h-BN quasi-bulk wafers via photocurrent excitation spectroscopy (PES). PES resolved the band-to-band transitions near M- and K-points in the Brillion zone (BZ), from which the room temperature indirect band gap of EgMK ∼6.02 eV, minimum direct bandgap at M-point of EgM=6.36eV and next lowest direct energy bandgap at K-point of EgK=6.56eV, have been simultaneously determined for the first time experimentally. The measured energy differences between K- and M-points in the conduction band minimum (CBM) and valence band maximum (VBM) are Δ ECMK=0.54eV and Δ EVMK = 0.34 eV, respectively, in good agreement with the calculation results. Significantly differing from its III-nitride wurtzite counterparts, in which only electrons and holes in the conduction and valence band extremes at the Γ-point are predominantly involved in the optical and transport processes, the results highlighted that charge carriers associated with both M- and K-valleys control to the optical excitation, recombination and charge transport processes in h-BN.

Epitaxial Growth of Ga2O3: A Review.

Beta-phase gallium oxide (β-Ga2O3) is a cutting-edge ultrawide bandgap (UWBG) semiconductor, featuring a bandgap energy of around 4.8 eV and a highly critical electric field strength of about 8 MV/cm. These properties make it highly suitable for next-generation power electronics and deep ultraviolet optoelectronics. Key advantages of β-Ga2O3 include the availability of large-size single-crystal bulk native substrates produced from melt and the precise control of n-type doping during both bulk growth and thin-film epitaxy. A comprehensive understanding of the fundamental growth processes, control parameters, and underlying mechanisms is essential to enable scalable manufacturing of high-performance epitaxial structures. This review highlights recent advancements in the epitaxial growth of β-Ga2O3 through various techniques, including Molecular Beam Epitaxy (MBE), Metal-Organic Chemical Vapor Deposition (MOCVD), Hydride Vapor Phase Epitaxy (HVPE), Mist Chemical Vapor Deposition (Mist CVD), Pulsed Laser Deposition (PLD), and Low-Pressure Chemical Vapor Deposition (LPCVD). This review concentrates on the progress of Ga2O3 growth in achieving high growth rates, low defect densities, excellent crystalline quality, and high carrier mobilities through different approaches. It aims to advance the development of device-grade epitaxial Ga2O3 thin films and serves as a crucial resource for researchers and engineers focused on UWBG semiconductors and the future of power electronics.

Crystal Lattice Recovery and Optical Activation of Yb Implanted into β-Ga2O3.

β-Ga2O3 is an ultra-wide bandgap semiconductor (Eg~4.8 eV) of interest for many applications, including optoelectronics. Undoped Ga2O3 emits light in the UV range that can be tuned to the visible region of the spectrum by rare earth dopants. In this work, we investigate the crystal lattice recovery of (2¯01)-oriented β-Ga2O3 crystals implanted with Yb ions to the fluence of 1 ×1014 at/cm2. Post-implantation annealing at a range of temperature and different atmospheres was used to investigate the β-Ga2O3 crystal structure recovery and optical activation of Yb ions. Ion implantation is a renowned technique used for material doping, but in spite of its many advantages such as the controlled introduction of dopants in concentrations exceeding the solubility limits, it also causes damage to the crystal lattice, which strongly influences the optical response from the material. In this work, post-implantation defects in β-Ga2O3:Yb crystals, their transformation, and the recovery of the crystal lattice after thermal treatment have been investigated by channeling Rutherford backscattering spectrometry (RBS/c) supported by McChasy simulations, and the optical response was tested. It has been shown that post-implantation annealing at temperatures of 700-900 °C results in partial crystal lattice recovery, but it is accompanied by the out-diffusion of Yb ions toward the surface if the annealing temperature and time exceed 800 °C and 10 min, respectively. High-temperature implantation at 500-900 °C strongly limits post-implantation damage to the crystal lattice, but it does not cause the intense luminescence of Yb ions. This suggests that the recovery of the crystal lattice is not a sufficient condition for strong rare-earth photoluminescence at room temperature and that oxygen annealing is beneficial for intense infrared luminescence compared to other tested environments.