Ultra-thick Photoresists Research Articles

Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists

A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of −0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of −0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification −0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors.

Magnetic Induction Micromachine—Part II: Fabrication and Testing

This paper presents the realization of a magnetic induction machine. The development of this machine is part of an ongoing project to create high-power density electric microgenerators for use in portable-power applications. The results reported here focus on testing a first-generation nonlaminated electromagnetic actuator, a metrology device designed for exploring and characterizing the fabrication process and the operating behavior of the magnetic induction micromachine. Achieving high power density requires large electrical currents and magnetic fluxes, which necessitate thick, multilayered microstructures that are difficult to fabricate. The batch-fabrication schemes developed as part of this work are based on low-temperature micromolding that makes extensive use of various ultra-thick photoresists and electroplating of electrical conductors (Cu) and ferromagnetic materials (Ni-Fe 80%-20%), resulting in the successful fabrication of a multilayer two-phase planar stator and a planar rotor. To evaluate the performance of the complete machine (stator plus rotor), a 4-mm-diameter, 500-/spl mu/m-thick electroplated Ni-Fe rotor is tethered to a series of flexible structures that prevent it from making a complete revolution, but allow accurate torque performance extraction. The tethered induction micromotor studied here exhibits torque production as high as 4.8 /spl mu/N/spl middot/m.