Ultra-compact Bandpass Filter Research Articles

Ultracompact Bandpass Filter Based on Slow Wave Substrate Integrated Groove Gap Waveguide

This article presents an ultracompact bandpass filter (BPF) realized by slow wave substrate integrated groove gap waveguide (SW-SIGGW). The SW-SIGGW is composed of two layers of the dielectric substrate, in which periodic mushroom-type electromagnetic band-gap (EBG) unit cells are employed as packaging structures. The gap layer is realized by the upper substrate, and the via-patch mushrooms are designed on the lower substrate. Due to the slow wave structure in the form of periodical metallic via-holes designed on the lower substrate, the guided wavelength is reduced by about 52.8% compared with normal SIGGW. A dual-band resonator and a cascaded second-order BPF are designed based on SW-SIGGW. Compared with the conventional second-order SIGGW BPF, the proposed SW-SIGGW BPF achieves a 62.6% reduction in the area. By adopting vertical stacking technology, the area of the SW-SIGGW BPF is further miniaturized. The final area of the stacked SW-SIGGW BPF is only 18.7% of the conventional filter based on normal SIGGW without slow wave and stacked structure, which is very competitive for the room-limited applications. A prototype of the stacked SW-SIGGW BPF with 5.4% and 7.4% fractional bandwidths at 11.8 and 18 GHz is fabricated and measured. A good agreement between the measured and simulated results verifies the validity of the miniaturized design of SW-SIGGW BPF.

Design of an Ultracompact On-Chip Bandpass Filter Using Mutual Coupling Technique

In this paper, design of an ultracompact bandpass filter (BPF) in GaAs technology without compromising its electrical performance is investigated by means of both theoretical analysis and electromagnetic simulation. In particular, the relationship between the external quality factor and the coupling coefficient of the second-order BPF is formulized to better understand the principle of the mutual coupling effect. To prove the concept, the designed filter is implemented in a commercial 0.1- <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> GaAs technology. A step-by-step design guideline is elaborated. The BPF has not only the merits of ultracompactness, but also remarkable insertion loss (IL) compared with other state-of-the-art on-chip designs. The measurement results show that the 1-dB bandwidth of the BPF is from 28 to 36 GHz, while the IL is less than 1 dB at 29.5 GHz. In addition, more than 40-dB rejection is achieved from 56 to 69 GHz. The size of the filter is only <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$230 \times 280\,\,\mu \text{m}^{\mathrm {\mathbf {2}}}$ </tex-math></inline-formula> , excluding the pads, which is equivalent to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$0.074 \times 0.09\,\,\lambda \text{g}^{\mathrm {\mathbf {2}}}$ </tex-math></inline-formula> at 28 GHz. To the best of our knowledge, the proposed design is known to be the most compact one in the open literature using GaAs technologies.

Ultra-compact high-performance filters based on TM dual-mode dielectric-loaded cavities

Ultra-compact band-pass filters with Nth-order pseudoelliptic response are presented allowing dramatic volume and mass savings (up to about 90%) compared to conventional filters at the price of a modest Q-factor reduction. TM dual-mode cavities loaded with high-permittivity (εr &gt; 30) ceramic cylinders are employed, while non-resonating modes are used to create N transmission zeros symmetrically or non-symmetrically located in the pass-band. A single cavity behaves as a generalized doublet generating two transmission poles and two transmission zeros and is used as a basic building block for N-pole and N-zero filters with symmetric or asymmetric response. To prove the effectiveness of the approach, a very compact fourth-order filter with 4.35 GHz center frequency, four transmission zeros has been designed, fabricated, and tested showing an unloaded Q close to 2000. It is finally shown that the filter response can be shifted in frequency by simply replacing the dielectric material with another having different εr, so that the same metal enclosure can be used to realize various filters operating at different frequency bands.

Ultra-Compact WiMAX Bandpass Filter Embedded Into a Printed Circuit Board With a ${\rm SrTiO}_{3}$ Composite Layer

An ultra-compact bandpass filter has been developed for 2.3-2.7 GHz worldwide interoperability used for microwave access applications. The proposed filter was fully embedded into a multilayered printed circuit board (PCB) with a high dielectric strontium titanate (SrTiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) composite film layer. In order to reduce the size of the filter and to avoid unwanted 3-D electromagnetic coupling between the embedded passive filter circuit elements, the proposed filter was designed using J-inverter transformation technology. Two grounding via inductors and a single grounding capacitor were also utilized to generate three independent finite transmission zeros to enhance the rejection characteristics at the proper frequency bands. Since the J-inverter transformed filter circuit elements could be designed with relatively small inductance and large capacitance values, the high dielectric composite film was highly effective in reducing the size and improving the performance of the filter. The high dielectric film exhibited a dielectric constant of 17, a tangent loss of 0.01, and a capacitance density of 12.2 pF/mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at 1 GHz. The measured maximum insertion loss in the passband ranged from 2.3 to 2.7 GHz was better than 1.8 dB, with a minimum value of 1.58 dB at 2.6 GHz. The return loss was higher than 15 dB in the passband. The transmission zeros occurred at 1.71 and 5.1 GHz, and provided suppressions of 45 dB at 1.71 GHz, and 54 dB at 5.1 GHz, respectively. The measured group delay was less than 0.8 ns in the passband. The embedded bandpass filter had a volume of 2.6 × 2.6 × 0.55 (H) mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> , which is the smallest one found, compared to previously reported devices, the filter, embedded into the eight-layered packaging substrate with the high dielectric composite layer, dramatically reduced the size up to 56%, and its performance was also much improved in comparison to the one embedded into a conventional six- layered PCB.

Design of ultra-compact metallo-dielectric photonic crystal filters

Filter characteristics of metallo-dielectric photonic crystal slabs are analyzed using the Multiple Multipole Program combined with the Model-Based Parameter Estimation technique. This approach takes losses and material dispersion into account and provides highly accurate results at short computation time. Starting from this analysis, different ultra-compact band pass filters for telecommunication wavelengths are designed. The filters consist of five silver wires embedded in a waveguide structure. By applying stochastic and deterministic techniques the filter structures are optimized to obtain the desired characteristics.