Tunable Replica Circuit Research Articles

Postsilicon Voltage Guard-Band Reduction in a 22 nm Graphics Execution Core Using Adaptive Voltage Scaling and Dynamic Power Gating

In high volume manufacturing, conventional approach to deal with inverse-temperature dependence (ITD) and aging is to add a postsilicon flat voltage guard band to all dies based on testing a small random sample of dies. Although this scheme guarantees error-free operation, it significantly degrades energy efficiency, as it penalize all dies for the maximum delay degradation due to ITD and aging as seen by the worst case die, while also assuming maximum aging condition. In this paper, a graphics execution core implemented in 22 nm trigate process uses per-die tunable replica circuit (TRC) to monitor delay degradation due to ITD and actual aging conditions. TRC triggers adaptive voltage scaling to dynamically adjust $V_{\mathrm {CC}}$ as needed during run time to maintain correct operation at minimum additional voltage. Measured data show up to 33% (14%) energy savings at 0.4 V (0.8 V) compared with baseline scheme. The TRC is also utilized in a dynamic power gating (DPG) scheme to lower energy overhead due to fast droop guard band. DPG introduces a load line effect during normal operation, thus saving energy, while deactivating this load line upon droop detection by the TRC to maintain ISO performance as baseline. Silicon data show that DPG can improve energy efficiency by 14.5% (7%) at 0.8 V (0.6 V).

A Self-Adjustable Clock Generator With Wide Dynamic Range in 28 nm FDSOI

This work demonstrates a self-adjustable clock generator that closely tracks the voltage dependence of the critical path delay in a microprocessor. A tunable replica circuit (TRC) composed of inverter cells from the standard-cell library performs real-time frequency modulation to reduce the response time to a single cycle, and a digital controller quantizes the clock frequency by selecting appropriate phases of a delay-locked loop (DLL) that generates 16 phases of 2 GHz output. A watchdog unit continuously monitors the clock output to guard against metastability arising from the asynchronous path between the controller and the DLL. The proposed design is implemented in a 28 nm UTBB FDSOI technology and occupies an area of 1120 $\mu \text {m}^{2}$ with 2.7 mW power consumption. The generator has a wide tuning range of 550–2260 MHz at 1 V, functions at 35 MHz at 0.4 V, and can continuously synthesize the clock signal for arbitrary voltage waveforms between 0.4 V and 1 V.

Enabling Wide Autonomous DVFS in a 22 nm Graphics Execution Core Using a Digitally Controlled Fully Integrated Voltage Regulator

A digitally-controlled fully integrated voltage regulator (IVR) enables wide autonomous DVFS in a 22 nm graphics execution core. Part of the original power header is converted into a hybrid power stage to support digital low-dropout (DLDO), and switched-capacitor voltage regulator (SCVR) modes, in addition to the original bypass and sleep modes. Using voltage sensing, tunable replica circuit, or a core warning signal, the IVR detects and quickly responds to fast voltage droops to support fast dynamic workload changes without performance degradation. In a prototype, a 3D graphics execution core is powered up by the proposed hybrid IVR demonstrating measured 26% and 82% reduction in core energy in the turbo and the near-threshold voltage (NTV) modes, respectively. The total area overhead of the proposed hybrid IVR is 4% of the core compared to 2% from the original power header. Our digitally assisted control for the droop response shows ${\sim}$ 75% core frequency improvement at 0.84 V.

All-Digital Circuit-Level Dynamic Variation Monitor for Silicon Debug and Adaptive Clock Control

A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital converter, and multiplexers to measure circuit delay or frequency changes with less than a 1% measured resolution error while capturing clock-to-data correlations. In validating the DVM with microprocessor maximum clock frequency (FMAX) measurements, an on-die noise injector circuit induces a supply voltage (VCC) droop at a particular cycle in the test program. The FMAX measurement is then repeated for over a thousand iterations while shifting the droop placement to a different cycle per iteration. Silicon measurements demonstrate the DVM capability of tracking the worst case FMAX reduction to within 1% for a wide range of VCC droop profiles. Furthermore, silicon measurements reveal that FMAX is highly sensitive to the placement and magnitude of a high-frequency VCC droop during program execution, thus highlighting the value of the DVM for silicon debug. In addition, the DVM interfaces with an adaptive clock control circuit to dynamically adjust the clock frequency by changing the divide ratio in the phase-locked loop in response to persistent variations, enabling the microprocessor to adapt to the operating environment for maximum efficiency.

A 45 nm Resilient Microprocessor Core for Dynamic Variation Tolerance

A 45 nm microprocessor core integrates resilient error-detection and recovery circuits to mitigate the clock frequency (F <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CLK</sub> ) guardbands for dynamic parameter variations to improve throughput and energy efficiency. The core supports two distinct error-detection designs, allowing a direct comparison of the relative trade-offs. The first design embeds error-detection sequential (EDS) circuits in critical paths to detect late timing transitions. In addition to reducing the Fclk guardbands for dynamic variations, the embedded EDS design can exploit path-activation rates to operate the microprocessor faster than infrequently-activated critical paths. The second error-detection design offers a less-intrusive approach for dynamic timing-error detection by placing a tunable replica circuit (TRC) per pipeline stage to monitor worst-case delays. Although the TRCs require a delay guardband to ensure the TRC delay is always slower than critical-path delays, the TRC design captures most of the benefits from the embedded EDS design with less implementation overhead. Furthermore, while core min-delay constraints limit the potential benefits of the embedded EDS design, a salient advantage of the TRC design is the ability to detect a wider range of dynamic delay variation, as demonstrated through low supply voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CC</sub> ) measurements. Both error-detection designs interface with error-recovery techniques, enabling the detection and correction of timing errors from fast-changing variations such as high-frequency V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CC</sub> droops. The microprocessor core also supports two separate error-recovery techniques to guarantee correct execution even if dynamic variations persist. The first technique requires clock control to replay errant instructions at 1/2F <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CLK</sub> . In comparison, the second technique is a new multiple-issue instruction replay design that corrects errant instructions with a lower performance penalty and without requiring clock control. Silicon measurements demonstrate that resilient circuits enable a 41% throughput gain at equal energy or a 22% energy reduction at equal throughput, as compared to a conventional design when executing a benchmark program with a 10% V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CC</sub> droop. In addition, the microprocessor includes a new adaptive clock control circuit that interfaces with the resilient circuits and a phase-locked loop (PLL) to track recovery cycles and adapt to persistent errors by dynamically changing Fclk f°Γ maximum efficiency.