In this paper, the threshold voltage characteristics of silicon nanowire metal–oxide–semiconductor field-effect transistor (MOSFET) with a double-layer gate structure are presented. This type of device is considered to be the most promising application of nanodevice in ultralarge-scale integration, due to several advantages such as similar operation principle as the junctionless nanowire transistor, the screening effect of the upper gate (UG) to shield the lower gate MOSFETs from external electromagnetic disturbance, the tradeoff between the short channel and the thick-gate oxide layer, and the compatible fabrication process with the conventional MOS technology. In this paper, the relations of threshold voltage versus the gate length, the UG bias, the substrate bias, the drain bias, and the temperature are measured and analyzed. Moreover, the penetration effect of the UG electric field is proposed to interpret the short-channel characteristics of the device, and a piecewise curve model is presented to reveal the underlying physics of the relation of the threshold voltage versus the drain bias. The double-layer gate structure technology enables the design of many devices, such as small-signal analog circuit units, single-electron devices, and quantum bit cells.