Thermal Conductivity Properties Research Articles

Achieving enhanced thermal conductivity and mechanical properties in Mg-Zn-Gd-Zr alloys via regulation microstructure characteristics

It is well known that the microstructure of metallic materials determines the mechanical properties. However, the effect of microstructure on thermal conductivity lacks an accurate quantitative description of this relationship. In this work, the mechanism of variation in mechanical and thermal conductivities with microstructure was revealed by the characterization of cast, heat-treated, and extruded Mg-xZn-yGd-0.6Zr (wt%) alloys: ZV66, ZV62, and ZV26. The contributions of solution atoms, second phases, grain size, and dislocations to the yield strength and thermal conductivity were quantitatively calculated, and their effects on the plasticity and work-hardening behavior were qualitatively analyzed. The results show that hot extrusion promotes the precipitation of nanoprecipitates, such as MgZn2, Mg4Zn7, and Mg5Gd, resulting in the reduction of Zn and Gd solute atoms and the introduction of high-density dislocations and grain boundaries. The extruded ZV66 alloy exhibits excellent mechanical properties and thermal conductivity (a tensile yield strength of 232 MPa, an elongation of 22 %, and a thermal conductivity of 127.6 W/(m·k)); these values are better than those reported for similar products. The achievement of high strength and thermal conductivity is attributed to the precipitation of solute atoms to improve thermal conductivity in addition to grain boundary strengthening and work-hardening strengthening to improve strength. These findings provide new insights into achieving excellent strength–thermal conductivity property amalgamations in magnesium alloys by tailoring their microstructure.

Bioinspired green fabricating design of ultra-breathable and moisture wicking fabric via a sustainable route

Functional textiles with breathability, thermal conductivity and moisture wicking performance are critical to achieving human comfort and reducing energy consumption. However, conventional finishing processes used for fabricating moisture wicking fabrics are usually highly polluting and exhibit poor durability as well as low recyclability, which may be detrimental to environmental sustainability. Inspired by the shorebird's beak with a conical-shaped liquid pathway for transporting liquid drops, a novel biomimetic porous fabric is proposed by using natural cotton fibers through industrial and eco-friendly knitting technology, featuring ultra-breathability, thermal conductivity and moisture wicking properties. Moreover, the effects of the pore size and arrangement on the thermal conductivity and air resistance are investigated. Obvious linearities can be obtained (R2 = 0.99). In addition, the synergistic effects of basic pore and biomimetic pore can create surface energy gradients, which result in the asymmetric pressure and water transport. As a result, when the biomimetic pore distances are 3 mm and 5 mm, respectively, high linearities of 0.99 between biomimetic pore diameter and the wicking height can be found. More importantly, the resultant biomimetic pore fabric exhibits good water absorption rate of 350%, an outstanding water vapor transmission (>10000 g/m2/24 h) and high recyclability. The green fabricating design of biomimetic porous fabric opens up a pathway to develop air, thermal, moisture regulating fabric through a sustainable route for more diverse applications, e.g., athletic apparel, industrial workwear and medical garments.

Epoxy/Graphene Nanoplatelet (GNP) Nanocomposites: An Experimental Study on Tensile, Compressive, and Thermal Properties

This paper presents an experimental investigation of nanocomposites composed of three ratios of epoxy/graphene nanoplatelets (GNPs) by weight. The 0.1, 0.2, and 0.3 wt.% specimens were carefully manufactured, and their mechanical and thermal conductivity properties were examined. The tensile strength and modulus of epoxy/GNPs were enhanced by the large surface area of graphene nanoplatelets, causing crack deflection that created new fracture fronts and friction because of the rough fracture surface. However, the compressive strength was gradually reduced as GNP loading percentages increased. This was probably due to severe plastic yielding on the epoxy, leading to catastrophic axial splitting caused by premature fractures. Furthermore, the highest thermal conductivity was 0.1283 W/m-K, representing a 20.92% improvement over neat epoxy (0.1061 W/m-K) when 0.3 wt.% GNPs were added to the epoxy. This was because of efficient heat propagation in the GNPs due to electron movement through percolative paths. The tensile failure mode in epoxy/GNP nanocomposites showed a few deflected and bifurcated rough cracks and brittle, dimple-like fractures. Contrarily, compressive failure mode in GNP-added epoxy showed plastic flexural buckling and brittle large-axial splitting. The epoxy/GNP nanocomposites were considered a damage-tolerant material.

Developing a Novel Hybrid Nanofluid Preparation Method Using the Droplet Generation Method: Predicting the Thermal Conductivity, Viscosity, and Magnetic Properties Compared to the Conventional Two-Step Method

Developing a Novel Hybrid Nanofluid Preparation Method Using the Droplet Generation Method: Predicting the Thermal Conductivity, Viscosity, and Magnetic Properties Compared to the Conventional Two-Step Method

Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction

HighlightsA composite thermal interface material with three-dimensional hybrid carbon network-reinforced polydimethylsiloxane was proposed.The cooperative regulation of thermal conductivity and mechanical properties was achieved by controlling the assembly process of micro-nano scale unit carbon materials.The orthotropic continuous carbon structure endowed the composites with in-plane and out-of-plane thermal conductivities of up to 113.61 and 24.37 W m−1 K−1, respectively.The excellent compressibility and adhesion properties cooperatively improved the effective thermal conductivity by more than an order of magnitude.

Machine learning aided understanding and manipulating thermal transport in amorphous networks

Thermal transport plays a pivotal role across diverse disciplines, yet the intricate relationship between amorphous network structures and thermal conductance properties remains elusive due to the absence of a reliable and comprehensive network’s dataset to be investigated. In this study, we have created a dataset comprising multiple amorphous network structures of varying sizes, generated through a combination of the node disturbance method and Delaunay triangulation, to fine-tune an initially random network toward both increased and decreased thermal conductance C. The tuning process is guided by the simulated annealing algorithm. Our findings unveil that C is inversely dependent on the normalized average shortest distance Lnorm connecting heat source nodes and sink nodes, which is determined by the network topological structure. Intuitively, the amorphous network with increased C is associated with an increased number of bonds oriented along the thermal transport direction, which shortens the heat transfer distance from the source to sink node. Conversely, thermal transport encounters impedance with an augmented number of bonds oriented perpendicular to the thermal transport direction, which is demonstrated by the increased Lnorm. This relationship can be described by a power law C=Lnormα, applicable to the diverse-sized amorphous networks we have investigated.

Magnetron-Sputtered Long-Term Superhydrophilic Thin Films for Use in Solid-State Cooling Devices

Pulse-magnetron-sputtered long-term superhydrophilic coatings have been synthesized to functionalize the surfaces of solid-state cooling devices, e.g., electrocaloric heat pumps, where not only a complete wetting of the surface by a fluid is intended, but also fast wetting and dewetting processes are required. The coatings consist of a (Ti,Si)O2 outer layer that provides lasting hydrophilicity thanks to the mesoporous structure, followed by an intermediate WO3 film that enables the reactivation of the wettability through visible light irradiation, and a W underlayer which can work as a top electrode of the electrocaloric components thanks to its suitable electrical and thermal conductivity properties. Process parameter optimization for each layer of the stack as well as the influence of the microstructure and composition on the wetting properties are presented. Finally, water contact angle measurements, surface energy evaluations, and a contact line dynamics assessment of evaporating drops on the coatings demonstrate that their enhanced wetting performance is attributed not only to their intrinsic hydrophilic nature but also to their porous microstructure, which promotes wicking and spreading at the nanometric scale.

Experimental study on the effect of filament-extrusion rate on the structural, mechanical and thermal properties of material extrusion 3D-printed polylactic acid (PLA) products

AbstractMaterial extrusion (MEX), also commonly referred to as fused deposition modeling (FDM) or fused filament fabrication (FFF) is currently one of the most commonly used additive manufacturing techniques. The quality of the 3D-printed objects fabricated by MEX methods highly relies on various printing parameters, one of which is the so-called filament extrusion multiplier (k). In this study, 3D-printed parts were prepared by MEX technique during which the material feeding rate was adjusted by varying the extrusion multiplier in the range of 97–105% (k = 0.97–1.05). The fabricated parts were tested for their geometrical, structural, mechanical, and thermal conductivity properties. Based on computed tomographic analysis and scanning electron microscopic images, increasing the k parameter resulted in smaller voids, along with gradually decreasing porosity (from 5.82 to 0.05%). Parallel to the decreasing defects, the thermal conductivity of the parts improved from 0.157 to 0.188 W/mK as determined by light-flash analysis technique. On the other hand, when k was set to ≥ 1.03 the geometrical accuracy declined, the size of the specimens considerably increased relative to the nominal values, especially in the X–Y directions due to excess material getting “squeezed” on the sides of the specimens. This latter phenomenon also resulted in the formation of a number of stress concentration sites, which manifested in the decrease of mechanical properties. Accordingly, the tensile, flexural, and impact strength of the samples improved up to k = 1.03; however, above that it dropped considerably.

Effect of Cu addition on the thermal conductivity and mechanical properties of Mg–Zn-xCu-Ce alloys

Thermal conductivity and mechanical properties of Mg–Zn-xCu-Ce alloys with different Cu contents under low extrusion temperature were systematically investigated in this work. The results shows that MgZnCu and Ce-rich (Mg, Zn, Cu, Ce) phase were formed in Mg–Zn-xCu-Ce alloys with high Cu content, which have significantly effect on the thermal conductivity and dynamic recrystallization (DRX). The distribution of grain morphology and LAGBs indicates that CDRX is the main mechanism. The addition of Cu element has an inhibitory effect on the DRX behavior, greatly refining the DRXed grains. After extrusion, a large amount of nano-phase is dispersed in the MZEC alloy, which has a strong pinning effect on dislocations. The formation of MgZnCu phase with high thermal conductivity sacrifices the solute atoms of Zn and Cu in α-Mg matrix, which leads to reduction of lattice distortion of Mg matrix, thereby ensuring high thermal conductivity of Mg–Zn–Cu–Ce ternary magnesium alloys. With the increase of Cu content, the strength and thermal conductivity of the alloy gradually increases. When the Cu content is 3.6 wt%, UTS (ultimate tensile strength), YS (yield strength), EL (elongation) and thermal conductivity are 350 MPa, 317 MPa,15.8% and 135 W/m∙K, respectively.

High throughput screening of thermal interface materials by machine learning

Till now, it remains a challenge for effective prediction and screening of novel materials with high thermal conductivity, as well as further optimization of the interface thermal resistance. Normally, people have to spend long time on tedious calculations when predicting and screening these materials. In this paper, I combined machine learning with molecular dynamics simulations to investigate the thermal conductive properties of materials with the aim of significantly reducing computational consumption. I first applied molecular dynamics simulations to obtain the relevant properties of materials, then generated models for predicting physical properties by machine learning, and finally made predictions of thermophysical properties of materials. The use of machine learning significantly reduces the prediction time compared to direct molecular dynamics simulations. Especially when the XGBoost and the neural network models are employed, the prediction efficiency is significantly improved. This work guides a new way for the future screening of high-performance thermal interface materials.

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves-Branches Structure.

In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement approach for fabricating oriented thermal conductivity composites is introduced. Utilizing carbon fibers (CFs), known for their ultra-high thermal conductivity, as branches, this design ensures robust thermal conduction channels. Concurrently, boron nitride (BN) platelets, characterized by their substantial in-plane thermal conductivity, act as leaves. These components not only support the branches but also serve as junctions in the thermal conduction network. Remarkably, the composite achieves a thermal conductivity of 11.08 W/(m·K) with just an 11.1 wt% CF content and a 1.86 g/cm3 density. This study expands the methodologies for achieving highly oriented configurations of fibrous and flake materials, which provides a new design idea for preparing high-thermal conductivity and low-density thermal interface materials.

Effects of Superheating Treatment on the Microstructure, Tensile and Thermal Conductivity Properties of Fe-Bearing Al-10Si-Mg Casting Alloy

In this study, we designed and manufactured a new Fe-bearing Al-10Si-Mg casting alloy (F alloy) and investigated its microstructure, mechanical properties, and thermal conductivity. Two types of Fe-bearing Al-10Si-Mg alloys were used: the Conventional-F alloy, injected at 720 ℃ and cooled by water quenching, and the Superheated-F alloy, heated to 820 ℃ and maintained at that temperature for 1 hour. Subsequently, it underwent a degassing process at 720 ℃ before being cooled by water quenching. Both the Conventional-F alloy and the Superheated-F alloy exhibited dendritic microstructures and Fe-intermetallic compounds. The Secondary Dendrite Arm Spacing (SDAS) of the Conventional-F alloy measured 32.4 μm, whereas the Superheated-F alloy measured 28.6 μm. Additionally, the average eutectic Si sizes were 10.3 μm for the Conventional-F alloy and 7.7 μm for the Superheated-F alloy. Fe-rich IMCs were observed in the eutectic region, with their size decreasing due to the superheating treatment. Tensile tests at room temperature were conducted at a strain rate of 10<sup>-3</sup>/s. The Conventional-F alloy exhibited a yield strength (YS) of 93.4 MPa, ultimate tensile strength (UTS) of 183 MPa, and an elongation (El.) of 6.4%. Conversely, the Superheated-F alloy displayed a YS of 115.4 MPa, UTS of 218.2 MPa, and an El. of 5.1%. The mechanical properties notably improved with the superheating treatment. Regarding thermal conductivity, the Conventional-F alloy exhibited 114.9 W/m·K, while the Superheated-F alloy displayed 153.7 W/m·K. This represents a roughly 14% increase compared to the thermal conductivity of the commercial Al-10Si-Mg material (Silafont36: 135.1 W/m·K). The effects of the Superheating Treatment on microstructural characteristics, deformation behavior, and thermal conductivity of the Fe-bearing Al-10Si-Mg casting alloys were discussed.

Study the Effect of Hybrid Nanofillers Content on the X-ray Diffraction and Thermal Conductivity Properties of Epoxy-Based Nanocomposites

High-performance polymer nanocomposites utilizing different-sized nanofillers had a lot of interest recently. Due to their distinct structural, and thermal characteristics. Multi-wall carbon nanotubes (MWCNT) and nanoclay (NC) have the most interest among the numerous types of reinforcing as filler elements for a polymer. The formation of hybrid from MWCNT and NC at various loadings (0.5%, 1%, and 2wt%) on the characteristics of epoxy polymer have been assessed in this work. The specimens have been created using solution blending procedures with the addition of solvent ethanol at a ratio of 1:1 for dispersed nanofillers, and then they have been re-mixed with epoxy. Tests like X-Ray diffraction (XRD), and thermal conductivity were used to identify properties of epoxy. According to the test results, the thermal conductivity rise as the filler content rises at 1wt%, then start to decrease after 1wt%. The sample with the hybrid filler loading of 1 wt% produced the best performance. Since hybrid epoxy exhibits the best result of the thermal conductivity 135% over MWNT and NC nanocomposites of 1 wt.% reached 0.3568 W/m.K in the increased thermal conductivity property. By examining the EP nanocomposites XRD pattern. The hybrid of epoxy nanocomposites exhibits all of the NC and MWCNT characteristic peaks. Since interactions between the filler and the epoxy cause a shift in the peak location of 1wt%. Due to the homogeneity of the nanofillers entire epoxy matrix, there may be changes in the intensity or location of the peaks at 1% for 2θ= 20.13°, which corresponds to an interlayer distance of d=0.461nm.

Dielectric, electrical and thermal properties of Sodium Molybdate-hexagonal Boron Nitride composites enabled by cold sintering

Advances in 5G and 6G communication technologies and their applications are in part limited by the capabilities of current electronic packaging materials, as expanded bandwidth is a pressing need for novel dielectric substrates capable of co-firing into packages and devices, characterized by low dielectric loss and enhanced thermal conductivity. This investigation provides further characterization in the dielectric, electrical and thermal conductivity properties over previously reported cold sintered composite of Sodium Molybdate Na2Mo2O7 (NMO) with hexagonal Boron Nitride (hBN), such as relative permittivity (εr) and dielectric loss (tan δ) values at high frequencies of 75–110 GHz, electrical resistivity (ρ) fitting to percolation theory, Weibull statistical analysis of electrical breakdown strength (Eb) and its anisotropic thermal conductivity (κ) influenced by the filler's crystal structure. The cold sintered composites were systematically characterized with respect to filler volume fraction, temperature, and frequency. The findings in this analysis position engineered composites as a promising alternative for microwave substrate materials, with using a densification method that limits interactions and maximizes densification, hence the demonstration with cold sintering.

Highly thermally conductive multifunctional graphene-based composite membrane for remarkable passive heat dissipation and robust superhydrophobicity

Graphene membrane is considered the preferred item of thermal conductivity material for wearable devices due to its unique flexibility and high thermal conductivity. However, water condensation beads are easily generated on the surface of graphene membranes under high heat and humidity operating conditions. Water condensation beads not only reduce the thermal conductivity of the membrane but also may cause damage to electronic components. To address this issue, an anti-liquid film condensation function can be obtained by spraying an alumina/multi-walled carbon nanotubes/thermoplastic elastomer composite powder (Al2O3/MWCNTs/SEBS) modified by 1H, 1H, 2H, 2H-perfluorooctyltriethoxysilane (POTS) on graphene membranes. In addition, the obtained composite films have high thermal conductivity (up to 483.1 W/m·K), good superhydrophobicity and antifouling properties, and stable physicochemical properties. The hydrophobicity angle could reach 166 ± 3.3° and the rolling angle 7 ± 2.4°. Under 300 times of bending, it can still maintain its superhydrophobic performance. Therefore, the development of graphene-based composite membrane with high thermal conductivity, hydrophobicity and an excellent water-resistant condensation bead effect is expected to provide a new thermally conductive material solution for heat dissipation in electronic components.

Microstructure modification in Ba-doped SnO2-based ceramics with promising thermal conductivity and electrical properties

In this paper, the thermal conductivity of Ba-doped SnO2 varistors was tested using the heat flow method, and it was found that the thermal conductivity is related to the grain boundary barrier of the samples. Introducing the reduction of impurity phases and point defects is an effective method to enhance the thermal conductivity of SnO2-based varistors. Energy dispersive spectrograms indicate that the content of spinel Co2SnO4 doped with 1mol% Ba is the least when the arrester is operated at 40°C. The positive and negative charge defects are fully compensated, thereby reducing phonon scattering and improving the thermal conductivity of the samples. Spinel Co2SnO4 occupies the position of the effective grain boundary, so the reduction of Co2SnO4 and the compensation of positive and negative defects also effectively increase the grain boundary barrier. When the doping amount of Ba is 1mol%, the optimal potential barrier height is 1.48eV, the nonlinear coefficient is 45, the leakage current is 0.8μA/cm2 and the voltage gradient is 418V/mm.

Enhanced thermal conductivity and mechanical property via improvement of hydrogen bonding between hexagonal boron nitride and aramid copolymer

This study focuses on enhancing thermal properties of aramid copolymer nanocomposites by integrating hexagonal boron nitride (hBN). Pristine hBN (P-hBN) is first subjected to oxidative heat treatment at 900 °C, producing thermally treated hBN (T-hBN), which significantly improves thermal conductivity while also increasing the tensile properties of composites. The study further explores the effect of different diamine co-monomers, 3,4′- and 4,4′-oxydianiline (ODA), on the nanocomposite properties. Both types of ODA-based composite films show improvement in various properties containing T-hBN. With 20 wt% of T-hBN, the 3,4′-ODA and 4,4′-ODA-based films exhibit 33.2 % and 290 % increase in tensile strength and thermal conductivity, respectively. The functionalization of hBN by heat treatment enhances the interaction between aramid copolymer and hBN and prevents the aggregation of hBN. The rough interface was shown in fractured images for films with T-hBN, suggesting that the composite films with T-hBN withstand higher external forces. In addition, it was observed that T-hBN exhibits better dispersion compared to P-hBN. This is supported by molecular dynamics (MD) simulation, and, in addition, it also provides the underlying mechanism for the property differences between both types of co-monomers.

Thermo-mechanical behaviours investigation of Nano-Sized Al2O3, TiO2, and Graphene Nanoplatelet Reinforced Epoxy Composites

Composite materials find extensive applications in various industries, thanks to their remarkable properties. These sectors include energy, maritime, motor sports, aviation, space and defense. The materials commonly used in these sectors are fiber reinforced plastic (FRP) composite materials. Epoxy materials are commonly used as matrix in the production of FRP materials. This study delves into the enhancement of epoxy-based nanocomposites by using graphene nanoplatelets (GNP-5nm), TiO2 (13nm), and Al2O3 (8nm) nanoparticles. These nanoparticles were added at varying mass ratios into a commercial epoxy to investigate their effects on some chemical, thermal and mechanical properties. Meticulous mixing methodologies were used to reduce clumping effects and ensure even distribution during the process. The curing process was carried out in a PLC (Programmable Logic Controller) controlled hot air oven under isothermal conditions under the influence of 100 °C for 30 minutes. Tensile strength, elongation at break, toughness, resilience modulus, elasticity modulus, hardness, FTIR analysis and thermal conductivity properties were characterized to assess the nanoparticle influence on the epoxy matrix. The results showed that there were remarkable improvements in mechanical properties with nanoparticle reinforcement. Especially, 1.25% Al2O3 inclusion exhibited a substantial increase of 140.32% in tensile strength and a 7% rise in shore D hardness compared to pure epoxy. This enhancement was attributed to enhanced O-H bonding between 'O' atoms in Al2O3 nanoparticles and epoxy polymer chains, enhancing matrix-filler interactions. Additionally, the effect of 1.0% TiO2 led to plasticity, displaying a 32% rise in elongation at break, signifying improved deformation energy absorption compared to neat epoxy. In thermal conductivity measurements, the highest thermal conductivity was observed in the sample with 1.25% GNP added and it increased by 123.5% compared to neat epoxy. In TiO2 and Al2O3 added samples, an increase of 69% and 47%, respectively, was observed at 1.25% additive rates compared to neat epoxy. According to the results, thanks to the nanoparticle reinforcement added into the epoxy matrix, composite structures can be given new and superior properties specific to the applications.

A comparative study on the effects of multi-walled carbon nanotubes and graphene nanoplates incorporated for improved thermal conductivity and dielectric properties of polyvinyl chloride

In the present work, the improvement in the thermal conductivity and dielectric behavior in the frequency range of 0.025–5 MHz of polyvinyl chloride (PVC) films incorporated with graphene nanoplates (GNs) and multi-walled carbon nanotubes (CNTs) were investigated. The neat PVC and PVC composites consisting of different filler ratios of 0.25, 0.5, 0.75, and 1 wt% were synthesized using the casting technique. The increase in the concentration of GNs or CNTs up to 0.75 wt% enhanced the dielectric constant, ac conductivity, q-factor, F-factor, thermal conductivity, and total impedance of PVC composites. The values of the investigated parameters are slightly higher for PVC-CNTs composites compared to PVC-GNs composites. A further increase in concentration to 1 wt% reduces these parameters, but still more than PVC consisting of 0.5 wt% fillers. The mechanism of correlated barrier hopping (CBH) could be successfully used to describe the AC electrical conductivity of both PVC-GNs and PVC-CNTs composites thin films. Furthermore, the glass transition and decomposition temperatures were determined and found to be dependent on the filler ratio and type, and the thermal stability was increased after adding the GNs or CNTs nanofillers. These findings have drawn special attention to developing PVC composites that can be used in various industrial fields including flexible and wearable technologies, power devices, supercapacitors, electric vehicle battery systems, and aerospace components.

Eco-friendly preparation of polyimide/boron nitride composite films with excellent thermal conductivity and mechanical properties

Polyimide/hexagonal boron nitride (PI/BN) composite films have attracted interest as heat dissipation materials for advanced microelectronic devices. However, conventional preparations of PI/BN composite films employ harmful and expensive high-boiling organic solvents. In this work, thermally conductive PI/BN composite films were, for the first time, prepared using a nontoxic, eco-friendly, and inexpensive aqueous solvent. BN was ultrasonically exfoliated in a mixed solvent of water and tert-butanol to obtain aqueous BN suspensions, in which a poly(amic acid) salt (PAAS) was synthesized. The PAAS/BN suspensions were then drop-casted, and thermally imidized into PI/BN composite films. The PI/BN films exhibited excellent in-plane and out-of-plane thermal conductivities (up to 15.043 W/mK and 1.142 W/mK, respectively), which is attributed to the effective exfoliation and dispersion of BN in the aqueous solvent. Furthermore, these films exhibited high tensile strength, flexibility, and thermal stability.