The formation of a solute-depleted matrix and a precipitate phase as a duplex product behind a boundary advancing into a supersaturated matrix is termed as discontinuous precipitation (DP) [1]. The initiation of DP naturally involves the nucleation of heterogeneous grain boundary precipitates and the motion of these grain boundaries which act as the sweeping short-circuit paths for solute transport [1, 2]. These processes, in turn, depend on the structure of individual boundaries [1, 3-5]. Studies on grain boundary and interphase interface structures have indicated that the two may not be identical in nature [6-10]. Information on the relative effectiveness of different types of interfaces in initiating DP is, however, not well documented, and this has provoked the present investigation on a Cu-7 .7a t% Ag alloy. The proeutectic alloy [11] can provide a sample surface with or without strain, grain boundaries, eutectic boundaries with various curvature and discontinuous reaction fronts as the available sites for the onset of DP. Moreover, it is possible to generate artificial interfaces in this alloy quite easily, as follows. At the precipitation temperature (say, 400 ° C) the terminal solid solutions in the Cu-Ag system are almost pure copper or silver [11]. Thus, a coating of copper on a very large-grained polycrystalline specimen of copper-rich supersaturated solid solution may provide numerous grain boundaries at the precipitation temperature, whereas a similar coating with silver may generate incoherent precipitate-matrix type interfaces. It was also proposed to study the initiation of DP at these "synthetic interfaces" to obtain a better insight of the nucleation process. About 300g Cu-7.7at % Ag alloy was prepared from 99.99% pure copper and 99.99% pure silver by induction melting. A large-grained ingot of diameter 10 mm was grown from this alloy under argon atmosphere by the vertical Bridgeman technique. Semicircular discs of thickness 5 mm were cut from the ingot by a low-speed diamond saw, and these specimens were homogenized at 775 410 ° C for 5 h under protective cover before quenching in water at room temperature. The flat faces of these specimens were polished to 0.5/~m diamond followed by electropolishing in concentrated (about 85%) H3PO4 for 20rain, using a stainless steel cathode with a d.c. potential of 2 V, which eventually removed all traces of surface strain on the specimens. One of the two semicircular faces of a selected set of samples was cleaned with acetone and coated with pure copper (1.2 # thick) or pure silver (0.3 ~m thick) by a vapour deposition technique. The strain-free