The growth rates of the individual layers in sulphide scales on Cu-Ni alloys have been studied in order to attempt to determine the controlling processes. Parabolic kinetics are obeyed by each layer in scales on Cu−20% Ni and Cu−50% at 718 K. The variations in the layer growth rates with alloy composition at 718 K and the variations for Cu−50% Ni between 653 K and 770 K are also assessed. The growth rate of the outer, CuS, layer decreases with increasing temperature, essentially because of its decreasing thermodynamic stability. The variation of the growth rate of each phase with alloy composition and temperature is interpreted in terms of cation diffusion, growth of both copper and nickel sulphides apparently being controlled by ionic diffusion across the NiS layer. The effects of alloy-scale separation on both scale morphologies and layer growth rates are examined.