Suitability Of Phase Change Materials Research Articles

Climatic and seasonal suitability of phase change materials coupled with night ventilation for office buildings in Western China

Phase change material (PCM) coupled with night ventilation (NV) is regarded as a promising cooling strategy. The suitability of PCM coupled with NV in transition and hot seasons of 10 cities in Western China was investigated based on a non-air-conditioned office building. The optimum phase change temperature (PCT) and the cooling potential of PCM coupled with NV in transition and hot seasons were determined by numerical investigations using EnergyPlus. The results showed that the optimum PCT for the 10 selected cities varied from 23 °C to 29 °C. PCM coupled with NV was suitable for application in all of the selected cities, but the PCM strategy was the best choice for the transition season in cities in severe cold zone. Applying PCM coupled with NV strategy could reduce the discomfort hours in the transition season by at least 16% compared with NV alone. In addition, the favorable outdoor air dry-bulb temperature (Tout) for the application of PCM coupled with NV was obtained for the selected cities in Western China, which had the following characteristics: (1) the diurnal temperature difference (ΔT) exceeded 6.8 °C, (2) the average value (Tave) was close to 27 °C, (3) the minimum value (Tmin) was 2.7 °C lower than the optimum PCT and the maximum value (Tmax) was 1.7 °C higher than the optimum PCT.

On the Suitability of Phase Change Material (PCM) for Thermal Management of Electronic Components

Objectives: To review the suitability of Phase Change Material (PCM) for the thermal management of electronic components. Methods/analysis: Day by day, physical world has been changing to digital world by involving electronic components such as computers, digital meters, smart phones, high sensitive sensors, high precision devices etc. One of the important issues pertaining to smooth running of electronic components is their thermal management. Electronic components generate heat during operation and this heat has to be driven out to safeguard the equipment. Researchers have proposed various methods such as heat sinks, nano-fluids, micro-channels etc to reduce and dissipate heat from the components. The requirement for the usage of miniaturization of electronic components has further increased the complexity to effectively dissipate the heat from the confined space of these electronic components. Various techniques provide their own set of benefits and trade-offs for thermal management of electronics to reduce operating temperatures, dissipate excess heat and long-term reliability. The present study aims to address the usage of PCMs with their advantages and disadvantages for the thermal management of electronic components. Findings: PCM based heat sinks can be an alternative technique for effective dissipation of heat and maintain safer temperature range for the electronic devices. Novelty/improvement: The study provides an insight about the applicability of PCM especially for the thermal management of electronic components such as computer processors, IC boards etc. to maintain with in maximum allowable temperature range. Based on the study it can be suggested that the usage of PCM can satisfy the present demand of cooling system.