Substances In Electronic Equipment Research Articles

The Role of Pb Impurity in SAC Solder Alloy

The European Union and Japan initiated the issue of RoHS, the directive about the restriction of hazardous substances, which prohibits certain hazardous substances in electronic equipment - including lead - application. Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of contamination may be appear under technological process. The lead impurity has significant effect on microstrucutre and lifetime so it is necessary to carry out detailed examinations. In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles test-subjected, Sn-Ag-Cu (SAC) solder alloy is demonstrated

Getting the Lead Out of Electronics

The electronics industry is learning to do without: it is having to abandon one of its long-time staples, lead–tin solder. For decades lead–tin solder has been used to attach electronic components to printed wiring boards. However, with the body of evidence pointing to serious adverse health effects of lead, the search for a replacement has spawned intense effort in the electronics industry and in universities. Now scientists think they may have found some promising leads: solders made of alternative alloys and polymer formulations known as electrically conductive adhesives (ECAs).