Ball Grid Array Solder Research Articles

Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

The microstructure of electronic solder joints is generated by the solidification of a small volume of bulk undercooled liquid. Here, we study β-Sn dendrite growth in Sn–3Ag–0.5Cu in the specific geometry and nucleation conditions of ball grid array (BGA) solder joints by combining electron backscatter diffraction and imaging of microstructures. It is shown that, while ⟨110⟩\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\langle 110\\rangle$$\\end{document} is the preferred dendrite growth direction, out-of-plane branching and growth with ⟨11W⟩\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\langle 11W\\rangle$$\\end{document} directions are important for allowing dendrites to fan out into the spheroidal volume of BGA joints due to the low symmetry of β-Sn. We find that the crystallographic orientation of β-Sn at the nucleation point plays a strong role in subsequent dendrite growth. In single-grain joints, dendrites are often unfavorably oriented for growth, resulting in different types of zig-zag dendrite growth. In cyclic-twinned joints, it is shown how competitive out-of-plane trunk growth between three dendrite orientations produces {101} boundaries and the characteristic beachball microstructure.

Enhanced Mechanical Properties with Ag Addition in Electroplated Ni-Sn Solder Joints: Sub-10 Micron Bond Thickness

Keywords: Micro-bump; Microstructure; Intermetallic compounds; Mechanical properties; thermocompression bondingThe advancement of electronic devices has garnered more extensive attention towards three-dimensional integrated circuit (3D-IC) technology due to microbump size reduction and increased power density. Microbumps play an important role in driving the development of this technology, especially in 3D chip-stacking involving multiple reflow processes. The reduction in microbump height spotlights the presence of intermetallic compounds (IMCs). In comparison to traditional ball grid array (BGA) solder joints, microbumps with smaller solder volumes exhibit a predominant fraction of IMCs at solder joints, especially with microbump dimensions potentially shrinking to less than 10 micrometers.The interface reaction within confined spaces has become a critical concern. Mechanical properties will be dominated by IMC properties rather than solder characteristics. In conventional Cu/Sn/Cu solder joints, grain coarsening and prolonged reflowing times, which result in IMC collisions from opposing substrates, forming columnar grains with a uniform orientation, make the solder joint less reliable. Furthermore, the Cu3Sn layer in Cu/Sn/Cu microbumps presents another challenges, indicating the formation of Kirkendall voids, increasing the risk of brittle interface fractures.This study investigates the mechanical reliability and microstructure of two sub-10um sandwiched structures: Cu/Ni/Sn/Ni/Cu and Cu/Ni/Sn-3.5Ag/Ni/Cu. In the 3D-IC manufacturing process, solder joints will experience multiple reflow processing. Different reflow heat treatment process to achieve different fractions of Ni3Sn4 IMCs were performed on both sandwiched structure. Despite the formation of internal voids due to volume shrinkage in Ni/Sn solder joints, the addition of silver in the solder, forming Ag3Sn, effectively fills these voids. The long-time reflowed sample showed outstanding mechanical properties via the addition of silver in solder. In this study, the influence of silver addition on the microstructure and mechanical properties of the overall joints under identical reflow conditions, the fracture path observation after shear test were investigated. The growth mechanism of Ag3Sn and its distribution in the solder would be further explored and addressed. Figure 1

Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning

Abstract A deep learning-based nondestructive approach for void segmentation in BGA solder balls using 3D x-ray microscopy is presented.

Analytical solution for forced vibration of multilayer structures composed of plates with different geometric dimensions

Multilayer system composed of parallel plate components with different geometric dimensions is frequently used to describe engineering objects, such as electronic assembly. In this work, an analytical method was proposed for forced vibration of this type of multilayer system. The proposed method overcomes the limitation that the traditional wave method is only applicable to all plate components must have the same in-plane dimensions. The proposed analytical method has an efficiency advantages in parameter analysis than element-based methods such as finite element method (FEM). The connection joints between two adjacent plate components, such as ball grid array (BGA) solder interconnect, are represented by elastic springs. The vibration of each component are described in terms of general and physical analytical waves, respectively, and the dynamic coupling between them are established by an equivalent dynamic flexibility matrix. The forced responses of the multilayer system are analytically calculated by solving the system equation in wave space. In the numerical examples, the effectiveness of the proposed method is validated by comparing the present results with the FEM results. The influence of number of the defective solder joints on vibration response is also investigated.

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Abstract This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder joint reliability assessment, simulations consider lead-based (63Sn37Pb and 62Sn36Pb2Ag) and lead-free (SAC105, SAC305, and SAC405) solder alloys under temperature profiles: 0°C (Tmin) to 100°C (Tmax), −40°C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C. Results indicate that SAC305 exhibited the highest equivalent stress, while 63Sn37Pb demonstrated the highest plastic strain and creep strain energy density. SAC105 displayed the lowest stress and strain parameters. Moreover, increasing the thermal cycling temperature range intensifies stress, strain, and damage parameters, with −40 °C to 150 °C showing the highest magnitudes. SAC405 exhibited superior thermal fatigue life compared to other alloys, with its cycles to failure outperforming 63Sn37Pb, SAC105, 63Sn36Pb2Ag, and SAC305 by 16832, 11992, 6218, and 3601 cycles, respectively. Lower temperature ranges enhance thermal fatigue life, with 0 °C to 100 °C recording 8%, 33%, and 53% higher life than −40 °C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C, respectively. Notably, higher silver content and lower temperature ranges were associated with increased thermal fatigue life, providing valuable insights for BGA solder joint reliability enhancement.

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments. The effect of electron irradiation on the microstructure and mechanical properties of Sn3Ag0.5Cu (SAC305) Ball Grid Array (BGA) solder joints was investigated in this work. The results show that the central position of the SAC305 solder joint surface was damaged after electron irradiation. Then the surface of the solder joints was remelted. The shear strength of solder joints increases as the electron irradiation dose rises. When the electron irradiation dose reaches 80 Mrad, the shear strength of the solder joint is enhanced by 8.62% compared with that of the unirradiated sample. After irradiation, the number of dimples on the fracture surface of solder joints increases and the depth of dimples decreases. Geant4 simulation results show that the surface of solder joint is subject to more severe electron impact than the inside of solder joint is. The interaction between electrons and solder joints is the primary reason for the surface remelting of solder joints.

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

PurposeThis study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.Design/methodology/approachThe BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.FindingsThe study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.Practical implicationsInspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.Originality/valueLimited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Shock fatigue damage failure boundary study of BGA solder joints based on shock response spectrum

Multiple shock damage failure of ball grid array (BGA) solder joints is one of the important reasons for reusable spacecraft mission failure. Shock fatigue damage failure boundary of BGA solder joints is proposed based on shock response spectrum (SRS), which can be used to assess the damage failure state. Weibull distribution is employed to characterize the shock fatigue life for a specified SRS. A Bayesian estimation method based on the Bootstrap approach is proposed to estimate Weibull distribution parameters. By using the time-domain load synthesized method based on wavelet and the experimentally validated shock fatigue life model, the shock fatigue life data of BGA solder joints corresponding to different SRS are extended. The variation patterns of the scale and shape parameters with the SRS parameters is analyzed. Then the shock fatigue damage failure boundary based on SRS is determined for a given design life and reliability. The results show that the critical SRS amplitude increase with the rise of the inflection point frequency and the low-frequency slope, respectively. The developed method is expected to provide references for the environment-adaptive design of BGA solder joints in reusable spacecraft.

Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration.

We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position.

Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

Eutectic SnPb ball grid array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0, 50, 100, 150 and 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. After irradiation, β-Sn and Pb on the surface of the solder joint was oxidized to SnO2, PbO and PbO2, and an oxide layer covered with Cu oxide was formed on the surface of the solder joint. The formation process and mechanism of the oxide layer were analyzed. Sn and Pb depletion holes and Cu depletion areas appeared on the solder joint surfaces after various irradiation time. SnO2 nanocrystals and Sn wrinkles appeared in the FIB specimen after irradiation. After 200 h of irradiation, the melting temperature of the SnPb eutectic solder alloy decrease, and the shear force value of the solder joint first increase and then decrease.

A novel shock life model for BGA solder joints based on evolutionary power spectral density

Multiple shock damage of Ball grid array (BGA) solder joint is one of the important reasons for space mission failure. A novel shock life model is proposed for BGA solder joints to evaluate its life under shock loads based on the evolutionary power spectral density (EPSD). Considering the bandwidth and non-Gaussian features of the stress signals during different stages, the shock stress response was treated as a non-stationary and non-Gaussian stochastic process. EPSD of the shock stress response is derived in matrix form based on wavelet transforms. The weight coefficient and non-Gaussian damage factor are proposed to describe the influence of the bandwidth and non-Gaussian characteristics of shock response on fatigue damage, respectively. The damage values of different stress stages were calculated by weight coefficient and corrected using non-Gaussian damage factor. Then the shock life model is proposed based on damage accumulation theory. Tests for the BGA solder joints shock life were conducted, and the result shows that the proposed model is feasible. Therefore, the developed method in the paper is expected to provide reference for the prediction of BGA solder joint shock life in aerospace engineering.

Thermomigration-induced failure in ball grid array solder joint under high current stressing

Thermomigration-induced failure in ball grid array solder joint under high current stressing

TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling

TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling

Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability. This investigation qualifies the random vibration response of five essential solder compositions in ball grid array (BGA) solder joints used in safety-critical applications. The solder compositions are eutectic Sn63Pb37 and SnAgCu (SAC) 305, 387, 396, and 405. Computer-aided engineering (CAE) employing ANSYS finite element analysis and SolidWorks software is implemented in this investigation. The solder Sn63Pb37 deformed least at 0.43 µm, followed by SAC396 at 0.58 µm, while SAC405 deformed highest at 0.88 µm. Further analysis demonstrates that the possession of a higher elastic modulus and mass density culminates in lower solder joint deformation. Stress is concentrated at the periphery of the solder joints in contact with a printed circuit board (PCB). The SAC396 solder accumulates the lowest stress of 14.1 MPa, followed by SAC405 at 17.9 MPa, while eutectic Sn63Pb37 accrues the highest at 34.6 MPa. Similarly, strain concentration is found at the interface between the solder joint and copper pad on a PCB. SAC405 acquires the lowest elastic strain magnitude of 0.0011 mm/mm, while SAC305 records the highest strain of 0.002 mm/mm. These results demonstrate that SAC405 solder has maximum and SAC387 solder has minimum fatigue lives.

Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Sn3Ag0.5Cu (SAC305) Ball Grid Array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0 to 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. β-Sn interacted with O2 in the air and was oxidized to SnO2 on the solder joint surface after gamma irradiation. The oxidation initiated at the corners of the solder joint/pad interface, extended to the entire solder joint/pad interface, and finally occurred at the solder joint matrix. Microcracks usually grow around SnO2/β-Sn interfaces. The interaction of gamma rays with β-Sn and SnO2 is the primary reason for solder joint oxidation. Gamma irradiation generated atomic vacancies, breaking bonds, and dangling bonds in β-Sn and SnO2 crystals through the Compton Effect, which promoted the physisorption and chemisorption of O2 on their surfaces, as well as the oxidation of β-Sn and growth of SnO2. The interaction between the gamma irradiation and solder joints can be divided into two stages. SnO2 was nucleated at lattice defects induced by the interaction between gamma rays and β-Sn crystals in the first stage. The growth of the SnO2 nuclei resulting from a large number of crystal defects in SnO2 and the potential difference between SnO2 and the β-Sn surface induced by the Compton Effect occurred in the second stage. According to the differential scanning calorimetry (DSC) analysis, the melting temperature of the SAC305 solder alloy decreased with increasing irradiation time. According to the nanoindentation test results, with an increase in irradiation time, the microhardness of the solder joints first increased, then decreased, and finally increased again.

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

Process dependence and nucleus models of β-Sn grains in SAC305 freestanding solder balls and BGA solder joints

• Relationship between β-Sn grain morphology and process parameters was studied systematically. • Two nucleus models were proposed to explain the formation of β-Sn morphologies. • Relationship between spatial position of nucleus models and β-Sn orientation was established. • Large θ angle β-Sn grains were theoretically and experimentally proved to have a formation probability higher than 77 %. Due to the anisotropy characteristic of β-Sn grain, the microstructure and orientation of Sn-based solder joints are closely related to the reliability of the solder joints. In this paper, the effects of cooling rate and solder ball size on β-Sn morphology and orientation in Sn-3.0Ag-0.5Cu (SAC305) freestanding solder balls and SAC305/Cu ball grid array (BGA) solder joints were firstly investigated to reveal the process dependence of β-Sn grain features. Three dominant solidified morphologies, i.e., interlaced & beach ball-like grains with three orientations, multiple twin grains with three orientations and single grain with one orientation, were found in the solder balls/joints. Solder ball size showed more significant impact than cooling rate on the morphologies that interlaced & beach ball-like grains and multiple grains were mainly presented in small sized solder balls/joints (≤ 400 μm) and single grain was mainly presented in large sized solder balls/joints (≥ 700 μm). These three solidified morphologies were nucleated and developed from two nucleus model. That is, the interlaced & beach ball-like grains and multiple twin grains morphologies were attributed to {101} nucleus model, while the single grain morphology was attributed to single grain nucleus model. Regardless of whether the solder balls/joints nucleated and solidified based on the {101} or single grain nucleus model, large θ angle β-Sn grains were proved to have a formation probability higher than 77 % both theoretically and experimentally, and this formation probability had little relationship with interfacial Cu 6 Sn 5 grains, cooling rate and solder ball size.

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the reflow process profile. The effects of reflow cycles and aging time on the interfacial microstructure and growth behavior of intermetallic compounds, as well as the mechanical properties, were investigated. Pd-Au-Sn intermetallic compound (IMC) was formed at the Sn-58Bi/ENEPIG interface. With the increase in reflow cycles and aging time, the IMC grew gradually. After five reflow cycles, the shear strength of the Sn-58Bi/ENEPIG solder joints first decreased and then increased. After 500 h of aging duration under −40 °C, the shear strength of the Sn-58Bi/ENEPIG solder joints decreased by about 12.3%. The fracture mode transferred from ductile fracture to ductile and brittle mixed fracture owing to the fact that the fracture location transferred from the solder matrix to the IMC interface with the increase in reflow cycles and aging time.

Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste

In recent years, electronic technologies have been striving to minimize the use of lead in their manufacturing and production. As a result, the electronic packaging industry is slowly transitioning from lead solder to lead-free solder. Though environmentally lead-free solders are advantageous, there are still needs some work in meeting current technological demand and requirements. In this study, the microstructure analysis on lead-free Sn-Ag-Cu Ball Grid Array (BGA) and Sn10Cu solder paste was done. The main aim of this study is to investigate the effect of isothermal aging on the microstructure of the solder paste joint and evaluate the intermetallic compound (IMC) thickness on the solder joint reliability. Optical Microscope (OM) and ImageJ software have been utilized to study the bulk solder microstructure. The results show that the bulk microstructure consists of β-Sn and Cu6Sn5 / β-Sn eutectic phases. The IMC layer has undergone rapid growth with increasing aging temperature and time. The two main IMC layers (Cu3Sn and Cu6Sn5) grew thicker due to high temperature. The growth kinetic of Sn10Cu resulted in 16.70 kJ/mol activation level. Therefore, the significance of the findings from this study might provide a potential answer for future development for highly reliable solder joint applications.

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

PurposeThe purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean-time-to-failure (MTTF) equation when joints are subjected to coupling stress.Design/methodology/approachThe samples of the BGA package were subjected to a migration test at different currents and temperatures. Voltage variation was recorded for analysis. Scanning electron microscope and electron back-scattered diffraction were applied to achieve the micromorphological observations. Additionally, the experimental and simulation results were combined to fit the modified model parameters.FindingsVoids appeared at the corner of the cathode. The resistance of the daisy chain increased. Two stages of resistance variation were confirmed. The crystal lattice orientation rotated and became consistent and ordered. Electrical and thermal stresses had an impact on the void formation. As the current density and temperature increased, the void increased. The lifetime of the solder joint decreased as the electrical and thermal stresses increased. A modified MTTF model was proposed and its parameters were confirmed by theoretical derivation and test data fitting.Originality/valueThis study focuses on the effects of coupling stress on the void formation of the SAC305 BGA solder joint. The microstructure and macroscopic performance were studied to identify the effects of different stresses with the use of a variety of analytical methods. The modified MTTF model was constructed for application to SAC305 BGA solder joints. It was found suitable for larger current densities and larger influences of Joule heating and for the welding ball structure with current crowding.