Standard electronic modules can be made more reliable by decreasing module temperature. This may be accomplished by increasing the thermal contact conductance of the junction between the frame guide ribs and chassis card rails. Soft metallic coatings for the card rails would deform readily under pressure, thereby increasing the actual contact area and associated conductance. This investigation evaluated the conductance enhancement provided by vapor deposited, electroplated, and flame-sprayed silver coatings. Experimental measurements of thermal contact conductance were performed for anodized aluminum 6101-T6 and electroless nickel-plated copper C11000-H03 frame materials injunction with uncoated and silver-coated A356-T61 card rail material. Baseline conductance data for the anodized aluminum 6101 to uncoated aluminum A356 varied from 25 to 91 W/m 2K (4.4 to 16 Btu/h ft20F), and values for the nickel-plated copper to uncoated aluminum A356 ranged from 600 to 2800 W/m2K (106 to 493 Btu/h ft2°F) for contact pressures of 172-862 Kpa (25 to 125 psi) and mean junction temperatures of 20-100°C (68-212°F). Experimental conductance data for vapordeposited, electroplated, and flame-sprayed silver-coated aluminum A356 demonstrated thermal enhancement factors of 1.44-2.14, 1.78-15.2, and 1.00-2.30, respectively, for junctions with anodized aluminum 6101, and 0.76-2.19, 1.06-2.83, and 0.45-0.75, respectively, for junctions with nickel-plated copper. The vapor deposited and thinner flame-sprayed coatings were susceptible to galvanic corrosion. All electroplated and the thicker flame-sprayed coatings exhibited excellent corrosion resistance.