With the rapid development of novel optoelectronic devices, an environmentally friendly and highly efficient polishing technology for SC-sapphire substrates is imminent. In this work, the micro-mechanism of Gly action in TCMP of SC-sapphire substrate is systematically studied by TCMP experiments and first-principles calculations. The results of TCMP experiments confirm that the maximum MRR of 5.37 μm/h with Ra of 0.42 nm can be attained at optimal concentration of Gly, without any acid or alkali corrosive solution. The first-principles calculations of the Gly/SC-sapphire heterostructure further reveal the reaction behavior of the -COOH functional group with and without lattice distortion. The results of both TCMP experiments and VASP simulations demonstrate that the incorporation of Gly can facilitate the friction-induced Gly/SC-sapphire reaction, which significantly enhances the processing surface quality and the processing efficiency of SC-sapphire substrates. Finally, based on the above research, a microscopic material removal model for the Gly-based SC-sapphire substrate TCMP is constructed. The above findings are of great significance in promoting the development of green ultra-precision polishing technology for semiconductor substrates.
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