The surface quality of wire-saw cut monocrystalline silicon is affected by its anisotropy. This work investigates the effect of anisotropy on the surface quality of monocrystalline silicon (100), (110), and (111) crystalline surfaces in wire-saw cutting processing. The material properties of monocrystalline silicon in different crystal directions are analyzed, and the expressions of elastic modulus of monocrystalline silicon (100), (110), and (111) crystal surfaces are derived, and the influences of material properties and process parameters on macroscopic sawing force and material removal are investigated. The single abrasive grains scratching the surface of monocrystalline silicon and the wire saw cutting and processing process were simulated, and the diamond wire saw cutting and processing of monocrystalline silicon experiment was carried out. The experiment results show that: When the wire saw cuts and processes the (100), (110), and (111) crystal surfaces, the cutting angle with better sawing performance is 30°. The macroscopic normal and tangential average sawing forces on the crystalline surface of monocrystalline silicon (110) differed by 7.22N and 2.54N. The average error between the experiment value of surface warpage and the simulation value is 5.47 %, which indicates the accuracy of the surface morphology prediction model.
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