Short-pulse Propagation Technique Research Articles

Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies

A comprehensive overview is given of the strengths, limitations, and applicability of the short-pulse propagation technique (SPP). SPP is shown to be able to extract the broadband characteristics of a wide range of interconnect technologies found in digital computer applications and generate causal predictive models. Examples are given of such applications from on-chip wiring, ceramic and organic chip carrier, cards, boards, to cables, and structures with large inhomogeneities, such as found in differential and microstrip cases, irregularities (such as introduced by roughening of metallization), and various operating conditions, such as variable temperature and humidity. The use of SPP as a virtual test bench is explained and showcased through the analysis of the impact of manufacturing tolerances and via stub length on the electrical characteristics. The diverse versatility of the SPP method is discussed through many examples on practical interconnect structures with special emphasis on printed circuit board wiring.

Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

In this paper, the self-consistent, frequency-dependent dielectric constant epsivr(f) and dielectric loss tandelta(f) of several materials are determined over the range 2 to 30 GHz using a short-pulse propagation technique and an iterative extraction based on a rational function expansion. The simple measurement technique is performed in the time domain on representative printed circuit board wiring. Broadband, fully causal transmission-line models based on these results are generated up to 50 GHz for card wiring using low loss materials including BT, Nelco N4000-13, and Nelco N4000-13SI. Simulation and modeling results highlight the need for the accurate frequency-dependent dielectric loss extraction. Signal propagation based on these results shows very good agreement with measured step and pulse time-domain excitations and provides validation of the measurement and model generation technique

Electrical characteristics of interconnections for high-performance systems

A review is presented of the electrical characteristics of high-density, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.

Broadband characterization of low dielectric constant and low dielectric loss CYTUF cyanate ester printed circuit board material

Dielectric constant /spl epsi//sub r/ and broadband dielectric loss tan /spl delta/ measurements were performed for the thermoplastic toughened cyanate ester printed circuit board CYTUF material. Characterization of tan /spl delta/ over the 1-8 GHz frequency range was made using a simple short-pulse propagation technique. All the measurements were taken on four-metal-layer, 23/spl times/36 cm cards with representative transmission line structures. It was found the /spl epsi//sub r/=3.48-3.64 and tan /spl delta/=0.0095-0.01, which are much lower than for standard FR-4 material. The impact of improved characteristics on wireability is analyzed through simulations of representative printed circuit board interconnections.

Short-pulse propagation technique for characterizing resistive package interconnections : Alina Deutsch, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1034 (1992)

Short-pulse propagation technique for characterizing resistive package interconnections : Alina Deutsch, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1034 (1992)

Characterization of resistive transmission lines to 70 GHz with ultrafast optoelectronics

The complete characterization of resistive transmission lines with the short-pulse propagation technique is extended to 70 GHz. The wide-frequency coverage is made possible by the use of ultrafast photoconductive switches for pulse generation and sampling. The picosecond optoelectronic sampling oscilloscope is described and results of measurements on thin-film strip transmission lines are presented.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Short-pulse propagation technique for characterizing resistive package interconnections

A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin-film package interconnection structure. The measured line characteristics are then used in a transient circuit analysis program to predict output waveforms generated by logiclike signals. In the absence of modeling capabilities, the measured results can be used directly as input to circuit simulation programs. The authors illustrate this with the response of a 9.65-cm-long thin-film line to logiclike signals. >