We use laser-induced plasma shock waves to remove Al nanoparticles from a smooth silicon substrate. Our experimental results show that the removal mechanism varies for different substrate regions. We examine the factors influencing particle removal by evaluating the shock-wave spatial distribution and the removal mechanisms. Further, we evaluate the influence of the gap between the laser focus and substrate on the removal results. The effects of the laser focus and substrate particle sizes are also investigated, and the optimum removal conditions are obtained. Our study can aid in better understanding the mechanisms of particle removal from surfaces.