With the widespread application of electromagnetic technology, the significance of intelligent electronic devices in modern communication is increasingly prominent. Despite this, the public focuses more on the harm caused by electromagnetic pollution. However, traditional EMI shielding materials struggle to meet the diverse and dynamic application requirements. Hence, developing materials capable of adjusting EMI shielding has become imperative to satisfy various scenarios. This paper presents the composite film TAPU-MXene, which is capable of adjustable EMI SE under self-fixed deformation. Introducing tannic acid increases the innermolecular interactions of TAPU. This enhancement leads to remarkable improvements in mechanical performance, achieving a stress level of 36.6 MPa at a strain of 560 %. Furthermore, the catechol groups can establish non-covalent interactions with multiple substrates, endowing the TAPU film with remarkable adhesion and self-healing capabilities. By combining the highly conductive nano-filler MXene with TAPU, the EMI shielding composite film TAPU-MXene is obtained. The EMI SE of TAPU-MXene was up to 56.7 dB when MXene loading was 3 mg cm−2. Most importantly, TAPU-MXene exhibits the ability to adjust the EMI shielding effectiveness from 56.7 dB to 2.75 dB under self-fixing deformation through shape memory mechanism, demonstrating promising applications in the field of adjustable EMI shielding materials.