Sensor For Real-time Measurement Research Articles

Roller sliding in engine valve train: Effect of oil film thickness considering lubricant composition

In roller follower valve train, proper rolling of roller reduces the chances of fatigue failure and power losses. During engine operation, the roller does slip on the camshaft surface. The oil film thickness plays an important role on the roller sliding which necessitates experimental investigations.A modern gasoline engine valve train has been instrumented using advanced sensors for real time measurement of oil film thickness and roller slip, simultaneously. Rise in oil film thickness at cam/roller interface increased the tendency of roller slip. Drag due to shear of lubricant and rise in contact loading at very high camshaft speeds resulted in reduction of roller sliding. Presence of anti-wear agents and friction modifiers increased the tendency of roller sliding.

PERANCANGAN ALAT UKUR TDS (TOTAL DISSOLVED SOLID) AIR DENGAN SENSOR KONDUKTIVITAS SECARA REAL TIME

An experiment was done to design of conductivity sensor for real time measurement of TDS (Total Dissolved Solid) in water. The instrument system incluedes hardware and software systems. The hardware system consist conductivity sensor, microcontroller arduino uno, and a PC. While the software system covers the procces and making on display measurement result based on LabVIEW. TDS information is displayed in the form of digital, analog and graph in real time. Another advantage of this measurement system is that the TDS data can be stored in file format xlxs. The measurement data is done by comparing the system is designed with a standard measuring instrument that is TDS EZDO E 7200. The data obtained through measurement errors were analyzed using the theory and methods of the graph. Based on the analysis conducted found the output voltage of the conductivity sensor rises with the increase in water with a sensitivity of 0,924 mV/ppm. The instrument of TDS measurement data has an accuracy rate of 97.17 % Keyword: microcontroller, water, TDS, LabVIEW

Design and implementation of an identification productivity recording and breeding system for the sheep industry

This paper presents a new system architecture and test-bed application implementation called sheep manager. Sheep manager system uses near field communication (NFC) technology and custom NFC data exchange format records for the identification and attributes recording of sheep inside a flock. Sheep manager system also utilises sensors for real-time measurements and recording of raw milk extraction per ewe. All recorded information are then stored into an application server following an HTTP representational state transfer protocol specification. The authors also propose an algorithm for sheep breed selection that uses feedback information from past successful breeds in order to increase herd milk productivity.

In vitro monitoring of goat-blood glycemia with a microwave biosensor

We used an electromagnetic microwave cavity sensor for real time measurement of the glycemia in goat-blood for three animals. We could determine the concentration of d-glucose in blood in the range of 90–550 mg/dl at the resonance frequency near 4.76 GHz with a bandwidth of 300 MHz. The change in microwave reflection coefficient S11 (due to the variation of d-glucose concentration in blood) was about 16.33 dB, 23.92 dB, 7.66 dB and resonance frequency shift was about 21.78 MHz, 36.29 MHz, 20.77 MHz, respectively, for the three different samples. The in vitro results show the measured signal-to-noise ratio of about 32 dB, and the minimum detectable signal level of about 0.025 dB/(mg/dl). The results clearly show the sensitivity and usefulness of this microwave sensor for these types of biological investigations. This proposed system provides a unique approach for real contactless glucose monitoring and, it may serve as a bloodless glucometer for the calibration of different glucose levels.

Thin film thermal sensor for real time measurement of contact temperature during ultrasonic wire bonding process

Abstract The slender, thin film, K-type thermocouple, fabricated through sputtering deposition, is employed to probe the contact temperature of the frictional interfaces during the ultrasonic wire bonding process. This thin film sensor is of thickness of 1 μm and with three different line widths that are 100, 80 and 20 μm, respectively. Contents of the sensor were demonstrated to be similar to the original K-type targets. Comparison of the thermoelectric relation of the sensor before and after the bonding processes ensured that the sensor operated appropriately during the bonding process. To help the analysis, modeling the temperature variation of the sensor based on a lumped system was also presented and discussed. Results show the currently fabricated sensor worked very well for the contact temperature measurement during the bonding process. For the same bonding condition, the recorded temperature increased with the reduction of the line width of the thermal sensor. The lumped system analysis indicated this increasing was mainly contributed by the reduction of the thermal inertia in the junction region that resulted from the decrease of the line width. With the advantage of the thin film thermal sensor, more sensitive and less invasive, the current measurement acquires temperature rise up 300 °C at the duration of bonding that, at least, is 150 °C higher than the available data in the literatures. Measurement result obtained by the present slender, thin film, thermal sensor is believed more close to true contact temperature.

Rapid thermal multiprocessing for a programmable factory for adaptable manufacturing of ICs

This paper presents an overview of research at Stanford University on the development of concepts of a programmable factory, based on a new generation of flexible multifunctional equipment implemented in a smaller flexible factory. This approach is demonstrated through the development of a novel single wafer Rapid Thermal Multiprocessing (RTM) reactor with extensive integration of sensors, computers and related technology for specification, communication, execution, monitoring, control, and diagnosis to demonstrate the programmable nature of the RTM. The RTM combines rapid thermal processing and several other process environments in a single chamber, with applications for multilayer in-situ growth and deposition of dielectrics, semiconductors and metals. Because it is highly instrumented, the RTM is very flexible for in-situ multiprocessing, allowing rapid cycling of ambient gases, temperature, pressure, etc. It allows several processing steps to be executed sequentially in-situ, while providing sufficient flexibility to allow optimization of each processing step. This flexibility is partially the result of a new lamp system with three concentric rings each of which is independently and dynamically controlled to provide for better control over the spatial and temporal optical flux profile resulting in excellent temperature uniformity over a wide range of process conditions namely temperatures, pressures and gas flow rates. The lamp system has been optimally designed through the use of a newly developed thermal simulator. For equipment and process control, a variety of sensors for real-time measurements and a model based control system have been developed. >