RE–Ba–Cu–O (REBCO, where RE = Y, Gd, Sm, and other rare earth elements) coated conductor (CC) tapes exhibit considerable potential for application within the domains of high-energy physics and high-field science. Nevertheless, weak interfacial properties pose a significant obstacle, impeding the progress and practical implementation in high-field scenarios. The anvil tension method has been extensively employed for the assessment of transverse delamination strength of REBCO CC tapes. However, the outcomes derived from anvil tension exhibit severe dispersion, thereby impeding its efficacy in evaluating material performance. The underlying cause of this phenomenon remains unidentified. In this study, error analysis of anvil measurement method in determining the transverse tensile delamination strength (TTDS) of REBCO CC tapes was conducted based on finite element (FE) numerical simulations. A two-dimensional multilayer elastic-plastic delamination FE model with main layers of REBCO CC tapes, solder connecting layers and anvil materials were developed based on the bilinear cohesive zone model. The effects of anvil test conditions and the structural configuration of the conductor itself on the test results were discussed. Simulation results show that localized premature cracking of the interface due to stress concentration and plastic yielding of the CC tape around the loading boundary is the root reason for the discrepancy between the anvil test results and the true interfacial strength. Therefore, anvil test conditions (including top anvil dimensions, soldering conditions, loading eccentricity angle, and anvil material properties) as well as the structural configuration of the conductor itself (including edge initial crack length, edge encapsulation width, and stabilizer thickness) have a significant impact on anvil test-based TTDS results.
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