Quad Flat Non-lead Packages Research Articles

An Wideband GaN Low Noise Amplifier in a 3×3 mm2Quad Flat Non-leaded Package

An ultra-compact and wideband low noise amplifier (LNA) in a quad flat non-leaded (QFN) package is presented. The LNA monolithic microwave integrated circuit (MMIC) is implemented in a 0.25 μm GaN IC technology on a Silicon Carbide (SiC) substrate provided by Triquint. A source degeneration inductor and a gate inductor are used to obtain the noise and input matching simultaneously. The resistive feedback and inductor peaking techniques are employed to achieve a wideband characteristic. The LNA chip is mounted in the 3×3-mmSUP2/SUP QFN package and measured. The supply voltages for the first and second stages are 14 V and 7 V, respectively, and the total current is 70 mA. The highest gain is 13.5 dB around the mid-band, and -3 dB frequencies are observed at 0.7 and 12 GHz. Input and output return losses (S11 and S22) of less than -10 dB measure from 1 to 12 GHz; there is an absolute bandwidth of 11 GHz and a fractional bandwidth of 169%. Across the bandwidth, the noise figures (NFs) are between 3 and 5 dB, while the output-referred third-order intercept points (OIP3s) are between 26 and 28 dBm. The overall chip size with all bonding pads is 1.1×0.9 mmSUP2/SUP. To the best of our knowledge, this LNA shows the best figure-of-merit (FoM) compared with other published GaN LNAs with the same gate length.

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip (SoC) or System-in-Package (SiP), which is identified as a requirement by the International Technology Roadmap for Semiconductors (ITRS). In the work presented here, a triple-axis Jordan Valley Bede D1 X-ray diffractometer is used to develop a novel lab-based technique called X-ray diffraction 3-dimensional surface modelling (XRD/3DSM) for non-destructive analysis of manufacturing process-induced stress/warpage inside completely encapsulated packaged chips. The technique is demonstrated at room temperature and at elevated temperatures up to 115°C by in situ XRD annealing experiments. The feasibility of this technique is confirmed through the characterisation of die stress inside encapsulated commercially available ultra-thin Quad Flat Non-lead (QFN) packages, as well as die stress in embedded QFN packages at various stages of the chip manufacturing process.

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, structural geometries, and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(38) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Analysis of variance (ANOVA) is carried out to examine the influence of factors on the thermal fatigue reliability and to find the significant factors. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element (FE) model. The modified Coffin–Manson model is employed to predict the fatigue life of solder joints. Results indicate that the coefficients of thermal expansion (CTE) of printed circuit board (PCB), the height of solder joint, and CTE of epoxy molding compound (EMC) have critical influence on thermal fatigue life of solder joints. The fatigue life of multirow QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after the optimized factor combination design based on the presented method.

Power and signal integrity co-design for quad flat non-lead package

The co-design of power and signal integrity issues on a quad flat non-lead (QFN) package is described. A novel decoupling capacitor is achieved by separating the die pad and footprint, coating a solder mask on the footprint and connecting the footprint to the printed circuit board power plane through a via. Large capacitance between power (footprint) and ground (die pad) resulted from the thin mask and large die pad lowering the input impedance of the power delivery network without parasitic effects at low frequency. A power bridge and a ground bridge are introduced to substitute the wire bond to decrease the inductance and hence the impedance magnitude up to 30%, thus enhancing the power integrity at high frequency. A modified design called hybrid power/ground exhibits great signal integrity by providing good reference for signals. The thermal dissipation is also better than the first design through direct contact of the die pad and the footprint ground regions. The overall design demonstrates excellent broadband performance for signal and power integrity.

The use of grey relational analysis to determine laser cutting parameters for QFN packages with multiple performance characteristics

This paper reports an application of the grey relational analysis (GRA) to directly optimize laser cutting of a quad flat non-lead (QFN) strip using six performance characteristics. The most important performance characteristics include the cutting depth, the width of heat affected zone (HAZ), and the width of cutting line for both epoxy and Cu+epoxy materials along the cutting path. During the GRA, higher grades are obtained from any of the deeper (more complete) cutting depth, reduced widths of the HAZ and reduced widths of the cutting line. From nine experiments based on the orthogonal array of L9(3 4), a current of 29 A, a frequency of 2 kHz, and a cutting speed of 2 mm/s were found to be the best parameters for laser cutting of a QFN strip with a thickness of 0.9 mm. Moreover, the analysis of variance (ANOVA) is also employed to determine the contribution of each control parameter on the cutting quality characteristics. The three largest measured contributions on the cutting quality in decreasing order are the frequency, the current, and the cutting speed. Compared with the Taguchi optimization method, the GRA approach is significantly simpler because it directly assigns appropriate weighting factors to the required qualities. Finally, confirmation experiments are performed to ensure the robustness of the GRA predicted optimal configuration for laser cutting a QFN strip.

Optimal laser-cutting parameters for QFN packages by utilizing artificial neural networks and genetic algorithm

In this paper, a multiple regression analysis (MRA) and an artificial neural network (ANN) were employed to build a predicting model for cutting Quad Flat Non-lead (QFN) packages by using a Diode Pumped Solid State Laser (DPSSL) System. The predicting model includes three input variables of the current, the frequency and the cutting speed, and six cutting qualities of depths of the cutting line, widths of heat affected zone (HAZ) and cutting line for epoxy and for copper-compounded epoxy. After the training process from 27 sets of training data including input data and its output qualities, the average training error is 0.822% by using a back-propagation (BP) neural network with Levenberg–Marquardt (LM) algorithm, which leads to the best results. The testing accuracy is then verified with extra 14 sets of experimental data and the average predicting error is 1.512%. The results show that the ANN model has the predicting ability to estimate the laser-cutting qualities of QFN packages. Finally, a genetic algorithm (GA) is applied to find the optimal cutting parameters that lead to least HAZ width and fast cutting speed with complete cutting. The optimal combination found is the current of 29 A, the frequency of 2.7 kHz and the cutting speed of 3.49 mm/s. The GA is helpful to determine the ideal laser-cutting parameters in order to meet the desired cutting qualities and to avoid unnecessary adjustments in the subsequent cutting process.

Hygrothermal Effect on Deformations of QFN Electronic Packaging

AbstractThe hygrothermal-mechanical behavior of a quad flat non-lead (QFN) package without a chip inside is investigated experimentally and numerically. The present study is focused on understanding the effect of the inherent hygrothermal behaviors of epoxy molding compound (EMC) on the deformations of QFN package. Prior to studying the package, the coefficient of moisture expansion for the EMC is measured experimentally. Full-field moiré and Twyman-Green interferometries are used for measuring the real-time in-plane and out-of-plane deformations of the specimen, respectively, under thermal and moisture loading. In addition, the finite element and theoretical analyses are adopted for validating the experimental observations and further understanding the hygrothermal mechanics of the specimen. The coefficient of moisture expansion of the EMC was experimentally obtained to be about 0.2. The experimental results of the full-field deformations of the specimen, due to temperature, moisture and a combination of both, are presented. The experimental observations are validated by the finite element and theoretical analyses. It was observed that the maximum moisture-induced deformation (strain) can be up to as large as 50% of the thermal deformation (strain) caused by ΔT = 50°C for the specimen. As a result, neglecting moisture-induced deformations (strains) would cause the significant amount of error in thermal deformation (strain) measurement of plastic packages. Furthermore, the present study has laid down the fundamental mechanics and approaches for the QFN packaging structural design and analysis in terms of hygrothermal effects.

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

In this paper, a comprehensive and integrated package stress model is established for quad flat non-lead package with detailed considerations of effects of moisture diffusion, heat transfer, thermo-mechanical stress, hygro-mechanical stress and vapor pressure induced during reflow. The critical plastic materials, i.e., moldcompound and die attach are characterized for hygroswelling and moisture properties, which are not easily available from material suppliers. The moisture absorption during preconditioning at JEDEC Level 1, and moisture desorption at various high temperatures are characterized. The moisture diffusivity is a few orders higher at reflow temperature than moisture preconditioning temperature. Due to coefficient of moisture expansion mismatch among various materials, hygro-mechanical stress is induced. The concept is analogous to coefficient of thermal expansion mismatch which results in thermo-mechanical stress. Thermal diffusivity is much faster than the moisture diffusivity. During reflow, the internal package reaches uniform temperature within a few seconds. The vapor pressure can be calculated based on the local moisture concentration after preconditioning. Results show that the vapor pressure saturates much faster than the moisture diffusion, and a near uniform vapor pressure is reached in the package. The vapor pressure introduces additional strain of the same order as the thermal strain and hygrostrain to the package. Subsequently, the interfacial fracture mechanics model is applied to study the effect of crack length on die/mold compound and die/die attach delamination.

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

For quad flat non-lead (QFN) packages, board-level solder joint reliability during thermal cycling test is a critical issue. In this paper, a parametric 3D FEA sliced model is established for QFN on board with considerations of detailed pad design, realistic shape of solder joint and solder fillet, and non-linear material properties. It has the capability to predict the fatigue life of solder joint during thermal cycling test within ±34% error. The fatigue model applied is based on a modified Darveaux’s approach with non-linear viscoplastic analysis of solder joints. A solder joint damage model is used to establish a connection between the strain energy density (SED) per cycle obtained from the FEA model and the actual characteristic life during thermal cycling test. For the test vehicles studied, the maximum SED is observed mostly at the top corner of peripheral solder joint. The modeling predicted fatigue life is first correlated to thermal cycling test results using modified correlation constants, curve-fitted from in-house QFN thermal cycling test data. Subsequently, design analysis is performed to study the effects of 17 key package dimensions, material properties, and thermal cycling test condition. Generally, smaller package size, smaller die size, bigger pad size, thinner PCB, higher mold compound CTE, higher solder standoff, and extra soldering at the center pad help to enhance the fatigue life. Comparisons are made with thermal cycling test results to confirm the relative trends of certain effects. Another enhanced QFN design with better solder joint reliability, PowerQFN, is also studied and compared with QFN of the same package size.

電子部品検査用メッシュプローブ

A membrane-type material used in electronic circuit inspections was developed. This material can be used to produce narrow pitches at a low cost. It has a durability under repeated tests, up to 1 million runs using a QFN (Quad Flat Non-leaded package) . When examined, the characteristics of electricity, conductor resistance, insulation resistance, withstand voltage and current-carrying capacity were tested. It was confirmed that the acceptable level was achieved without any problems as a contact probe.

Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications

The quad flat non-lead (QFN) package is a both chip scale package and plastic encapsulated package with a copper leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN packages for RF applications. Only short-path configuration was required for S-parameter measurement to achieve this purpose. Comparison of S 11 and S 21 between S-parameter measurement and optimized equivalent circuit model verified that those results were well matched and optimized. The parasitic parameters of the equivalent circuit were reliable up to 6 GHz. The methods proposed in this paper reduce the costs for samples preparation and chip simulation run time. In order to realize the package performance for higher frequency applications further, a 3D structure electromagnetic field simulator, HFSS, was used to simulate from 0.1 to 20 GHz for five modified package structures. Simulation results indicated that the QFN32 package that utilized the double bonding wires with a lower dielectric-constant molding compound and larger die-pad is the best structure for RF applications.