Pulse Current Electrodeposition Research Articles

Pulse current electroforming of Ni-PTFE nanocomposite mold insert with long-lifetime and anti-adhesive properties

Polymeric micro features tend to deform and break under the demolding force during injection molding process, which becomes a bottleneck problem limiting its precision manufacturing. To reduce the polymer-mold interfacial adhesion, nickel-polytetrafluoroethylene (Ni-PTFE) nanocomposite molds with low surface adhesion and high wear resistance were manufactured via pulse current electroforming. The electrodeposited Ni-PTFE nanocomposite showed a good hydrophobic property and low friction coefficient (between 0.1 and 0.3) than pure nickel (0.78). Compared with direct current, pulse current electrodeposition was beneficial to reduce the crystallite size and internal stress, thus improving the wear resistance and reducing the cracking defects. The hardness of pulse current electrodeposited Ni-PTFE reached 442.3 HV, which was 51.7 % higher than that of pure nickel. Compared to nickel mold, Ni-PTFE nanocomposite mold significantly improved the dimensional accuracy of molded microfluidic chips. This study systematically investigates the Ni-PTFE nanocomposite electroforming process under both direct and pulse currents, which provides a new approach for the manufacturing of high-performance precision injection mold insert.

Wheatstone bridge sensor arrays in foil by robust μ-via technology combining femtosecond-laser drilling and pulsed electrodeposition

Flexible sensor arrays with multilevel circuits typically require complex production cycles leading to high costs and reliability issues. For establishing flexible arrays of strain sensors in Wheatstone bridge configurations structures on different levels within flexible films have to be connected by robust μ-via technology. Usually, dry etching is used to establish via-holes and direct current (DC) electrodeposition is used to fill them with copper. However, dry etching can lead to damages in the underlying electrode or incomplete removal of polymeric material, as inhomogeneities of polymeric foil thicknesses cannot completely be eliminated. This affects the quality of the plating and the reliability of the μ-via connections. It is aggravated by the fact that DC electroplated copper is often weakened by various defects, such as small voids. This article describes a reliable and less complex fabrication process for a Wheatstone bridge sandwich structure consisting of five polymer interlayers separating four metal layers. The femtosecond-laser μ-via drilling proved to be fast, material selective and therefore tolerant to inhomogeneities of polymeric foil thicknesses. Moreover, pulsed current (PC) electrodeposition significantly improved the quality of the copper filling. No voids were found using electron microscopy. Finally, the respiration monitoring sensors produced using this method were subjected to repetitive cycles of bending and relaxation. At a frequency of five cycles per second, reproducible cycles of signal changes were obtained, indicating the usefulness for detecting respiratory cycles of premature infants.

Electrodeposition of nanocrystalline Ni and NiCr alloy coatings: Effects of Cr content on microhardness and wear resistance improvement

The safety and reliability of high-speed trains depend on the brake disc. In order to improve the lifetime of brake disc and reduce the waste of resources, a coating with higher microhardness and well wear resistance is urgently needed. The effect of chromium content on the microstructure, microhardness and wear resistance of NiCr coating has been studied. Nano-crystalline Ni and NiCr coatings with superior mechanical properties were successfully prepared on the 30CrNiMo steel substrate by pulse current electrodeposition method. The inclusion of formic acid and sodium citrate was found to significantly expedite the co-deposition of Ni and Cr. The NiCr coatings with various Cr contents were prepared at current densities ranging from 200 to 300 mA/cm2. These coatings significantly enhance microhardness and wear resistance of the substrate. The microhardness of the NiCr coating increased to 603 HV, outperforming pure Ni coating by 119 HV. Additionally, the wear rate of the NiCr coating decreased by 50% at a load of 10 N in comparison to the Ni coating. The high microhardness is attributed to grain refinement and solution strengthening. This study successfully addresses the challenges associated with electrodepositing Ni-based coatings on 30CrNiMo steel substrate and lays a theoretical foundation for the utilization of Ni-based coatings to enhance the tribological properties of materials used in high-speed train brake disc.

Synthesis of nanocrystalline nickel via pulsed current electrodeposition in additive-free deposition bath and comparison of nanoscale characterization

An experimental investigation on synthesis of nanocrystalline nickels by pulsed current electrodeposition has been carried out in an additive-free Watts bath employing nickel-sulphate solution with similar nickel ion concentrations. Aluminum was used as a substrate. It demonstrated the advantage of easier removal process of electrodeposited nanocrystalline nickel from its substrate. Whereas the use of high-purity nickel anode was intended to replace nickel ions, which decreased during electrodeposition. Different peak current densities of 450, 750 and 1000 mA/cm2 were applied. A pulsed current was set at a similar pulse pattern of on-time and off-time of 1 ms and 9 ms respectively. The shorter on-time demonstrated the ability to limit ion deposition, which was related to the formation of finer grains. The off-time arrangement was targeted to ensure that the ion mobility had completely stopped. Higher current density demonstrated a dominant impact on deposits, generating a higher nucleation rate that is related to depositing nanocrystalline nickel. A peak current density of 1000 mA/cm2 produced grain sizes in the nanoscale regime. Without any additional additive, nanocrystalline nickel was successfully yielded. Investigation of grain size obtained from the 1000 mA/cm2 has been conducted by extracting full width at half maximum peak intensity (FWHM) revealed from X-ray diffraction (XRD) and Transmission Electron Microscopy (TEM) exhibited consistent results of 22 nm and 25.4±3.4 nm, respectively. It is also evidence of the significant role of pulsed current density. In inclusion, nanocrystalline nickel can be synthesized in an electrodeposition bath without any addition of additives

Fabrication of Ag-Bi Alloy Films from an Iodide-Tartrate Bath via Current Pulse Electrodeposition

Abstract Ag-Bi alloy films containing less than 1 mass% Bi were produced using an iodide-tartrate bath without cyanide ions by electrodeposition. Such films could have applications as electrical connectors in quick chargers intended for electric vehicles. The electrodeposition characteristics of these alloys were studied by electrochemical measurements in conjunction with both direct current (DC) and current pulse (CP) plating. The waveform associated with the CP plating incorporated both low and high current densities. The electrodeposition potential of Bi was found to be more negative than that of Ag and the electrodeposition of Bi on Ag was evidently inhibited compared with that on Bi. Aeration increased the limiting current density during the electrodeposition of the Ag-Bi alloys. Alloy specimens having powder morphologies could be electrodeposited using the DC plating process while CP plating generated films. Optimization of the waveform gave Ag-Bi alloy films containing less than 1 mass% Bi and having a maximum hardness of 102 HV.

Development of gold nanospikes-modified quartz crystal microbalance biosensor for prostate specific antigen detection

Prostate-specific antigen (PSA) screening is vital for the early detection and assessment of prostate cancer treatment efficacy. Integrating nanotechnology into biosensor development allows for targeted biomarker detection. In this study, we present the fabrication of gold nanospikes (AuNS) structures on a quartz crystal microbalance (QCM) using the pulse current electrodeposition (PCD) technique. By varying the duty cycles of PCD, we achieved the desired nanostructure. The characteristics of the AuNS-modified QCM electrode were thoroughly investigated using various micro-structural characterization techniques such as x-ray diffraction (XRD), field emission scanning electron microscope (FESEM), atomic force microscope (AFM), X-ray photoelectron spectroscopy (XPS) and cyclic voltammetry (CV). Prior to biomolecule immobilization, each chemical treatment was verified through contact angle and FT-IR analyses. The performance of the developed QCM biosensor was evaluated using PSA at various concentrations. The results revealed that the frequency variation of the QCM biosensor was directly proportional to the PSA concentration. Notably, the AuNS-modified QCM biosensor exhibited the highest frequency shift at a 20 % duty cycle, demonstrating a linear detection range of 0.1–100 ng mL−1 and a limit of detection (LOD) of 24 pg mL−1. The developed QCM biosensor significantly enhances detection efficiency by increasing the number of binding sites for biomolecules through an enlarged surface area. The demonstrated sensitivity of the AuNS-modified QCM biosensor indicates its potential to address the increasing demand for early diagnosis and screening in healthcare systems. This innovative biosensor technology holds promise for improving prostate cancer detection and has broader implications for the development of highly sensitive biosensors for various biomarkers.

Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour

In this work we present the pulsed current (PC) electrodeposition of Sn-Cu-Ni alloy as lead-free solder candidate, from choline chloride – ethylene glycol eutectic mixtures (1:2 molar ratio) onto copper metallic substrates. Electrolytes containing Sn2+, Cu2+ and Ni2+ salts in the selected deep eutectic solvent have been considered. The effect of the applied frequency of PC on the morphology, composition and melting point of the alloy is discussed and compared to the ones obtained using direct current (DC) plating mode. A refinement of the grain size and lower melting temperature of the alloy were noticed when pulsed current was applied.A comparative analysis of the electrochemical corrosion behaviour at macro- and micro- scale has been performed in 0.5 M and 0.1 M NaCl solutions involving potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS) and scanning vibrating electrode (SVET) techniques. Furthermore, an analysis after 96 h of exposure to salt mist test simulating a corrosive attack in harsh environment is presented, too. The obtained results showed enhanced corrosion resistance of the ternary alloys electrodeposited under PC conditions (the best for 1.67 Hz frequency) as compared to those using DC. Additionally, Raman spectroscopy evidenced the presence of tin oxi/hydroxy chloride and tin oxides as surface corrosion products. A corrosion mechanism has been proposed.

Deposition of Ni-W-Mo ternary alloy coating on copper via pulsed current electrodeposition with enhanced corrosion resistance and mechanical properties

Nickel-tungsten-molybdenum (Ni-W-Mo) alloy coatings have been used extensively in micro-electro-mechanical systems (MEMS) because of their thermal stability, superior toughness, and corrosion resistance in extreme environments. The aim of the present study is to characterize the corrosion resistance and mechanical performance of Ni-W-Mo ternary alloy coating on Cu substrate. Meanwhile, the Mo element was co-deposited in the Ni-based plating to enhance the toughness of the coating layer owing to its self-lubricant performance. The Ni-W-Mo coating was successfully fabricated on Cu substrate by pulse electro-deposition via pulse currents of 9.0 and 4.5 A/dm2. X-ray diffraction (XRD) and Scanning electron microscopy (SEM) equipped with X-ray energy dispersive spectroscopy (EDS) were used to investigate the microstructure, morphology, rupture surface, and chemical composition of the Ni-W-Mo ternary alloy coating. A higher Mo content (27 wt%) and presence of nodules were obtained at a pulse current of 9.0 A/dm2. The nodules of the Ni-W-Mo ternary alloy coatings were observed using SEM, and a crack-free coating was confirmed to be completely bonded with the Cu substrate via scribe-grid testing. The corrosion resistance of the Cu substrate with and without the Ni-W-Mo ternary alloy coatings was evaluated in brine (3.5 wt% NaCl) via potentiodynamic polarisation testing in ambient temperature. The results showed that the alloy coating increased the corrosion resistance of the Cu substrate in brine. The quasi-crystal structure of the proposed alloy coating enhanced the micro-hardness and tensile resistance of the Cu substrate, which were evaluated in the ambient air and brine using the slow strain rate test (SSRT). The tensile strength of the specimen with the Ni-W-Mo ternary alloy coating (current density 9.0 A/dm2) increased by approximately 22 MPa compared with that of the Cu substrate in ambient air. These results confirm that the corrosion resistance and toughness of the Ni-W-Mo ternary alloy coatings deposited using the electrodeposition technique with pulsed-current power are superior to those of the Cu substrate.

A Suitable Porous Micro/Nanostructured Cu and Cu–Ni Film: Evaluation of Electrodeposition Behavior, Electrocatalytic Activity, and Surface Characterization of Porous Film

Selecting an appropriate catalyst with a high surface area and proper electron transfer ability can accelerate improved hierarchical catalysts. In this research, an appropriate porous film was formed by the dynamic hydrogen bubble template (DHBT) method with a pulse current (PC) electrodeposition. CH3COOH was added to the Cu electrodeposition bath as a non-ionic surfactant, CTAB was added as a cationic surfactant, and Ni was added as an alloying element. Results show the formation of a nano-dendritic porous Cu film. The presence of surfactants, especially CTAB, causes dendritic arms to be more elegant and denser, with more round voids. Furthermore, adding Ni sulfate to the bath containing both surfactants resulted in a porous Cu film with the most improved HER behavior by decreasing the overpotential (η 10) from 389 to 195 mV RHE−1 and the Tafel slope from 174 to 93 mV dec−1 in a 1.0 M KOH solution. According to the results of the electrochemical active surface area (ECSA), normalized LSV curves, and charge transfer resistances, the co-deposition of Cu and Ni revealed more active surface area and improved intrinsic HER catalytic activity. Therefore, these properties can convince researchers to utilize an improved porous Cu–Ni electrode for energy applications.

Enhanced Methanol Oxidation in Alkaline Media on Electrodeposited Ni Electrodes by Morphological and Crystallographic Evolution

This research aims at exploiting the electrocatalytic behaviour of nano-crystalline nickel electrodes electrodeposited by different techniques including direct current (DC), pulse current (PC), or pulse reversal current (PRC) for methanol electrooxidation in alkaline solutions. We understand that PC electrodeposition forms pyramidal shaped grains with a preferential Bragg diffraction peak of (111), whereas PRC produced refined spherical grain morphology with a strong (200) diffraction peak. However, DC electrodeposition exhibits an intermediate morphology and crystalline structure. Cyclic voltammetry (CV), and electrochemical impedance spectroscopy (EIS) show that PRC electrodeposition develops Ni electrodes with better electrocatalytic activity for methanol electrooxidation than other two nickel electrodes. Based on the CV curve, the current density for Ni prepared by PRC electrodeposition methods is about 75.26 mA.cm−2, which is higher than those of DC and PC methods. This higher activity of PRC electrodeposited nickel is attributed to the low charge transfer resistance confirmed by Nyquist plots. We attributed this behavior to the (200)-oriented crystallographic texture, spherical grain morphology, and consequently the high electrochemical active surface area of this nickel electrode. This work reveals the importance of surface morphology and crystallography on the electrocatalytic behaviour of nickel electrodes for electrochemical energy devices.

Characterization and corrosion behavior of Ni-Cr coatings by using pulse current electrodeposition

PurposeThe purpose of this paper is to study the effect of chromium content on the microstructure and corrosion resistance of Ni-Cr coating.Design/methodology/approachNi-Cr coating was prepared by pulse current electrodeposition with trivalent chromium. On the basis of studying effect of electroplating parameters on composition and morphology, Ni-Cr alloy coatings with various chromium contents were obtained. The microstructure was characterized by scanning electron microscopy, X-ray diffractometer and transmission electron microscopy. Corrosion behavior was studied by potentiodynamic polarization and electrochemical impedance spectroscopy techniques.FindingsElectrodeposited chromium was solidly dissolved in nickel and refined the grain of the coating. With the increase of Cr content, the corrosion resistance of Ni-Cr coating was enhanced, which is due to the formation of continuous nickel hydroxide and compact chromium oxide passive films.Originality/valueNi-Cr alloy coating without penetration crack was prepared in trivalent chromium electrolyte, and the mechanism of its excellent corrosion resistance was proposed.

Pulsed current electrodeposition of gold nanostructures on ITO: Control of particle density and optical transmission

With the advance in the plasmonics and metamaterials research field, it has become increasingly crucial to fabricate thin Au metal films cost-effectively and reliably. Here, we study the deposition of gold nanostructures onto the ITO surfaces, using the pulsed current electrodeposition (PED) method, with a pre-seeding step. It was demonstrated that Au nanostructure (AuNS) particle lateral sizes, when deposited onto ITO surfaces, are influenced by deposition current. The lateral size of the particles was found to affect the AuNS density and final form of the film. The study's findings also show that dense films (c.a. 75 %) of Au nanostructures with a thickness of around 5 nm can be formed using the PED method with an optimum current density of 2 A/dm2. Furthermore, the AuNS density has been shown to have a strong influence upon the resulting electrical conductivity and transmittance of the films in the visible and near-infrared wavelength.

Tuning residual stress in electrodeposited nickel films via pulse current

The pulse current electrodeposition has proved to be effective in the preparation of metal films with a low residual stress, while the formation mechanism of residual stress under the pulse current remains unclear. In this study, in situ measurements of residual stress in electrodeposited nickel films was performed. Nickel films with the lowest average stress were obtained under the frequency of 800 Hz, average current density of 1 A/dm2 and duty cycle of 50%. Based on X-ray diffraction and TEM analysis, the relationship between dislocation density and residual stress was studied, revealing that a high dislocation density contributed to the formation of cross slip, as well as the release of residual stress. Furthermore, charge time of the electric double layer was measured by multi-current step tests, and the possible mechanism for residual stress formation under pulse currents was proposed. The results indicated the stress was modulated by two competing factors: overpotential and fraction of the charge time. The overpotential played a leading role on average stress at low frequency and high current density, while fraction of the charge time played a dominant role at high frequency and low current density (less than 1 A/dm2). Our study provides a valuable insight to understand how pulse current parameters influence the residual stress in electrodeposited nickel films.

Effects of annealing on the structure and microhardness of nanocrystalline Ni–Mn electrodeposits

Nanocrystalline pure nickel and Ni-Mn alloy with 1.2 at% Mn deposits were obtained via pulse current electrodeposition. To understand the effects of annealing on their structure and microhardness, the surface morphology, crystal structure, grain size, microhardness and microstructure of the obtained Ni-Mn and pure Ni deposits were investigated. The results indicated that Ni-Mn alloy exhibited a similar face-centered cubic structure with a strong (111) preferred orientation to that of Ni deposits, but as-deposited Ni–Mn had a smaller crystallite size and substantially higher microhardness compared to as-deposited Ni deposit. During annealing, the crystal grains of Ni deposits grew sharply, resulting in a great decrease in their microhardness, while Ni-Mn deposits showed good thermal stability and annealing induced hardening at 300 °C and 350 °C. Neither precipitate nor clear segregation of Mn was observed on annealed deposits; however, a number of twin boundaries were found. It is suggested that the thermal stability of Ni-Mn was mainly derived from the formation of twin boundaries and the annealing-induced hardening could be ascribed to grain boundary relaxation and annealing twin strengthening.

Effect of rare–earth (Ce, La) compounds on the microstructure, mechanical and electrochemical corrosion characteristics of electroplated Ni films

For optimizing the microstructure and performance of Ni–electroplating film, the soluble rare–Earth (RE) compounds CeCl3 or LaCl3 were introduced, which were electrodeposited on Cu substrate by direct current (DC) and pulse current (PC) methods, respectively. The surface characteristics of morphology, composition, and phase of obtained different deposits were investigated, and the relationship between the structure and the performance of internal stress, hardness, and electrochemical responses was discussed. The results show that both RE compounds were conducive to eliminating the surface pits by inhibiting the hydrogen evolution reaction, while did not co–deposit into the Ni film. Moreover, the preferred orientation of Ni (111) crystalline plane was altered into Ni (200) by LaCl3, and its combination with PC–electrodeposition further had a better grain refinement effect than CeCl3. Due to the formation of a relatively dense and fine deposit, the PC–electrodeposited Ni/LaCl3 film exhibited the highest hardness of 320 HV, lowest tensile stress of 55 MPa, and best electrochemical passivation protection, which effectively improved the comprehensive performance of Ni film and demonstrated a good prospect for industrial applications.

Effect of SiC Nanoparticle content on the properties of Ni-W-SiC nanocomposite thin films deposited by pulse current electrodeposition

In this study, pulse current electrodeposition (PC) was used to fabricate Ni-W-SiCthin films on mild steel plates, by utilizing a Watts-type Ni liquid that contained SiC nano-particles (NPs). The films deposited with 9 g/L SiC NP showed a smooth, finely granular, and remarkably homogeneous surface structure. All films showed SiC NPs equally distributed on the Ni-W-SiC-NPs surface regardless of the starting SiC NP content. The calculations revealed that the thicknesses of Ni-W-SiC-NPs films deposited at 9 and 12 g/L were ≈ 27.3 and ≈ 22.2 µm, respectively. Moreover, the crystallite sizes decreased as the SiC NPs’ level was changed up to 9 g/L. Film particles became smaller (≈66 nm) but enlarged to 85 nm when SiC NPs level was changed from 9 g/L to 12 g/L, respectively. The deposited layer demonstrated an increase in microhardness from 490.2 HV to 881.5 HV with the addition of SiC nanoparticles. However, the hardness values of the Ni-W-SiC-NPs films became lower as the SiC NPs levels were changed from 9 to 12 g/L. Additionally, films fabricated using 9 g/L of SiC NP level demonstrated a minimal corrosion current (equal to 1.536 ×10−6 µA/cm2). The corrosion resistance of the film deposited at 9 g/L was about 5.3 times that of the film obtained at 0 g/L, indicating an excellent corrosion resistance. The study can provide the corrosion protection for water or oil pipes, metal containers and agricultural machinery.

Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition

Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition

Pulse Electrodeposited Super-Hydrophobic Ni-Co/WS2 Nanocomposite Coatings with Enhanced Corrosion-Resistance

The hydrophobicity and corrosion resistance of composite coatings can be effectively improved by changing the electrodeposition method and adding inorganic nanoparticles. In this work, the incorporation of WS2 nanoparticles significantly increased the surface roughness of Ni-Co coatings. The best hydrophobicity and corrosion resistance of the Ni-Co/WS2 nanocomposite coatings (water contact angle of 144.7°) were obtained in the direct current electrodeposition mode when the current density was 3 A/dm2 and the electrodeposition time was 50 min. Compared with direct current electrodeposition, the pulsed current electrodeposition method was more conducive to improving the electrodeposition performance of the nanocomposite coatings. Under the conditions of a current density of 3 A/dm2, pulse duty cycle of 70%, and pulse frequency of 1000 Hz, the nanocomposite coatings reached a superhydrophobic state (water contact angle of 153.8°). The nanocomposite coatings had a slower corrosion rate and larger impedance modulus in this state, and thus the corrosion resistance was superior. The wetting state of the Ni-Co/WS2 nanocomposite coating surface was closer to the Cassie–Baxter model. The protective air layer formed by the layered rough microstructures significantly reduced the actual contact area between the liquid and the substrate, achieving excellent hydrophobic and corrosion resistance properties.

A comparison between growth of direct and pulse current electrodeposited crystalline SnO2 films; electrochemical properties for application in lithium-ion batteries

Tin oxide (SnO2) films were electrodeposited on graphite substrates using direct and pulse current electrodeposition techniques. The influence of applied current density on the morphological properties, crystal structure, and electrochemical behavior of the resulting films were studied by scanning electron microscope, X-ray diffraction spectroscopy, Mott–Schottky analysis, cyclic voltammetry, and electrochemical impedance spectroscopy techniques. The results showed that pulse electrodeposited films have porous flower-like morphology with smaller crystallite size and high donor density in comparison with direct current electrodeposited films that include equiaxed particles in their morphologies, such characteristics give them better electrochemical performance (higher degree of reversibility, higher specific capacitance, and faster lithium-ion diffusion) than those films that were synthesized by conventional direct current electrodeposition method. Furthermore, using higher applied current densities leads to the improvement of SnO2 films’ electrochemical performance due to the formation of the films with finer morphology that include more porosity and oxygen vacancies in their respective crystal structure.

Fabrication of a Potential Electrodeposited Nanocomposite for Dental Applications

In the present study, a nanocrystalline Ni-Fe matrix with reinforced TiO2 nanoparticles as a functional nanocomposite material was fabricated by pulsed current electroforming in UV-LIGA (lithography, electroplating, and molding). The influences of TiO2 nanoparticles on the Ni-Fe nanocomposite deposition were also investigated using scanning electron microscopy, transmission electron microscopy, and in vitro cytotoxicity assay. It was found that the Ni-Fe nanocomposite with 5 wt.% TiO2 nanoparticles showed a smooth surface and better dispersion property. When the Ni-Fe nanocomposite is combined with 20 wt.% TiO2, it resulted in congeries of TiO2 nanoparticles. In addition, TiO2 nanoparticles possessed better dispersion properties as performed in pulse current electrodeposition. The microstructure of the electrodeposited Ni-Fe-TiO2 nanocomposite was a FeNi3 phase containing anatase nano-TiO2. Moreover, the electrodeposited Ni-Fe-5 wt.% TiO2 nanocomposite exhibited a smooth surface and structural integrity. Cytotoxicity assay results also proved that the Ni-Fe nanocomposite with different concentrations of TiO2 nanoparticles had good biocompatibility. Therefore, the optimization of pulse current electroforming parameters was successfully applied to fabricate the Ni-Fe-TiO2 nanocomposite, and thus could be used as an endodontic file material for dental applications.