Prototype Heat Sink Research Articles

STUDY ON COOLING OF HIGH PERFORMANCE SIC FEATURES

High-performance electronic parts are vital features in almost all modern motorized machines. These silicon components are significantly minimised, especially in transportation branch. Concentration of performance requires perfect cooling conditions. A fluid flow cooling by an active cooling circuit with heat sinks is a commonly used principle. Sufficient cooling and uniform temperature field on heat transfer area are crucial parameters for the sustainable function of Silicon-Carbide components. Producer of electric vehicles induces research in the field of coolers due to the requirements of installed SiC features. This study uses advanced CFD methods to analyse the current state of commonly manufactured heat exchangers and provides new approaches by CFD optimisation in combination with 3D printed replacement parts. Approach based on 3D print also allows design inspiration in natural principles. Biomimetic inspiration shows a wide range of thousands of years lasting optimisation made by nature. Research in this field can help us with the evolution of enhanced heat transfer surfaces. Developed coolers were examined by CFD techniques. Simulations of heat transfer are verified by laboratory measurement of prototype heatsinks. These techniques are presented on the unique design of a heat sink which was simulated, manufactured, and measured. The study shows CFD approaches, describes details of prototype measurement, and also deals with negative issues of metal 3D print.

Experimental Examination on Forced Convection Heat Transfer in laterally Perforated finned Metal Matrix Composite Heat Sink

Day by day a huge measure of research is proceeding to discover the cooling solutions for electronics including various applications for CPU, LED coolers, relay cooling frameworks. The serious issue including electronic parts cooling is the structure of heat sinks and their compatibility with the electronics for the predefined applications. Likewise, the quick-paced progressions in computing driving for the production of superior processors with incorporated complex circuits for which the cooling turned into a troublesome task which became challenging the existing market. This study targets building up a metal matrix composite (MMC) heat sink for low coefficient of thermal expansion (CTE) in electronic parts. Aluminum nitrate (AlN) takes like 12.5% (wt/wt) and mixed Aluminum (Al) to form metal matrix composite (MMC) prototype heat sinks. Prototype metal matrix composite (MMC) properties were evaluated experimentally. The modeling of the laterally perforated finned heat sink (LA-PFHS) is done Solid-works. The sinks are fabricated by using CNC machining. Two configurations of circular piercings on the fins are used in which the diameter and the spacing between piercings vary. In a rectangular insulated duct, the experimental analysis on the three metal matrix composite (MMC) heat sinks was performed under the phenomenon of forced convection at varying heat fluxes and at ambient conditions of temperature 30°C, pressure 101.326 KPa and 45% humidity. From 1.0 m/s to 4.0 m/s wind velocities and with an interval of 1 m/s the experimentation were carried out. Results show that the model III prototype metal matrix composite (MMC) heat sink proposed in this study shows a decrease in thermal resistance (Rth) by 50.51 %.

Experimental characterization of a hybrid impinging microjet-microchannel heat sink fabricated using high-volume metal additive manufacturing

A high-performance water-cooled micro heat sink for the thermal management of high heat flux microelectronics was designed, fabricated, and tested. The heat sink design leverages a multi- metal electrodeposition additive manufacturing process to produce complex flow which are impossible to fabricate with traditional processes. A previous study employed simulation-driven design to develop and optimize micro heat sinks and is a hybrid of microchannels with an array of integrated microjets. In the present investigation, a prototype heat sink was fabricated and tested at heat fluxes up to and exceeding 1000 W/cm 2 . The results demonstrate reasonable agreement between the numerical predictions and experimental results, considering the complex geometry flow and conjugate heat transfer within the device. From a thermal–hydraulic performance standpoint, the heat exchanger achieved an estimated overall thermal conductance of ~330 kW/m 2 K with a pressure drop of 160 kPa (23 psi) for a flow rate of 0.5 L/min. For inlet water at 20 °C, this corresponded to a measured base temperature of 54 °C at an applied heat flux of 1000 W/cm 2 . The hybrid microchannel–microjet heat sink further exhibited an enhancement ratio of 6 when compared with a microchannel heat exchanger of commensurate design. To the extent of our knowledge, this microfluidic heat exchanger has achieved one of the highest effective thermal conductance levels reported in the literature and has done so at moderate pressure drop and flow rate.

Energy Efficient Heat Sink Design: Natural Versus Forced Convection Cooling

In highly efficient converter systems, the power consumption of the cooling system (fans) significantly influences the total system efficiency as well as the power density. This paper investigates the potential of free convection cooled heat sinks and compares their performance to forced convection cooled heat sinks on the basis of their volume and power consumption. Underlying theoretical concepts for both types of cooling systems are summarized and their application in an optimization procedure is presented. The theoretical concepts are validated with prototype heat sinks. Finally, at an example of a half-bridge converter, it is shown that by free convection cooling, not only the efficiency but also the power density can be increased. In this case, by paralleling semiconductor devices the losses decrease approximately by a factor of three while simultaneously the heat sink volume can be reduced by approximately 50%.

Experimental and numerical evaluation of an elongated plate-fin heat sink with three sections of stepwise varying channel width

The performance of a novel design of a three-section plate-fin heat sink employing channels of stepwise decreasing hydraulic diameter is numerically and experimentally evaluated. Prototype heat-sink and inlet–outlet manifold configurations have been manufactured and characterized, in terms of thermal resistance and induced pressure drop, in a closed fluid loop experimental rig and for flow rates in the range of 20–40mL/s. The flow development and particularly the secondary flow pattern inside the heat sink are investigated by means of a numerical three-dimensional model. The findings of the study establish that the induced pressure drop, which does not exceed 1000Pa for the considered flow rates, is primarily attributed to the flow friction in the third-heat sink section, which is of microscale dimensions and the effect of the inlet–outlet manifold system is very small (0.5% of the total). In terms of heat transfer, the effect of buoyancy in the first heat-sink section has a beneficial impact on thermal performance maintaining the thermal resistance constant, at a value approximately equal to 0.015K/W, regardless of the flow rate of the cooling fluid. Heat transfer is also enhanced in the successive sections due to the effect of contraction-induced longitudinal vortices. Finally, it is proven that the heat sink wall exhibits a more uniform temperature distribution with the decrease of the Reynolds number.

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate unmixed fluids to meet the cooling requirements of the chip with one fluid acting as a fluidic spreader dedicated to cooling the hot spots only, while the second fluid serves as both a coolant for the background heat fluxes and an on-chip regenerator for the hot spot fluid. In this paper the conceptual heat sink design is presented and its theoretical capabilities are explored through optimization calculations and computational fluid dynamics simulations. It has been shown that through close coupling of the two thermal fluids the proposed hybrid heat sink can theoretically remove hot spot heat fluxes on the order of 1 kW/cm2 and background heat fluxes up to 100 W/cm2 in one compact and efficient package. Additionally, it has been shown that the F2/S2 design can handle these thermal loads with a relatively small pressure drop penalty, within the realm of existing micropump technologies. Finally, the feasibility of the F2/S2 design was demonstrated experimentally by modifying a commercially available, air-cooled aluminum heat sink to accommodate an integrated hot spot cooling system and fluidic spreader. The results of these experiments, where the prototype heat sink was able to remove hot spot heat fluxes of up to 365 W/cm2 and background heat fluxes of up to 20 W/cm2, are reported.

Development of a high performance heat Sink Based on screen-fin technology

In this paper, a novel high-performance heat sink based on screen-fin technology is described. The structural features of the heat sink are presented. The apparatus to measure both the pressure drop and heat transfer performance are described. Correlation equations of friction factor and Colburn-j factor as a function of screen-fin orientation, coolant properties and flow rate through the mesh are formulated. A semi-empirical model is used to predict the heat exchanger pressure drop, thermal performance and to design prototype heat sinks. Prototypes are built and tested. By screen-fin technology, the best performance of this kind of heat sink with external dimensions: 76.2-mm-wide, 63.5-mm-deep with 38.1-mm-high screen-laminate fins is 4.3W//spl deg/C at 62.3-Pa pressure drop of air flow through the heat sink.