Printed Circuit Board Research Articles

High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards

The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub is proposed, with 3D full-wave numerical simulation used for modeling and simulation. Results show that this scheme optimizes the return loss and insertion loss while making the signal eye diagram more ideal, which can improve the transmission effect of high-speed signals.

Removal of arsenic and fluoride ions from aqueous solutions using electronic waste-derived adsorbent

Printed Circuit Boards are the fundamental component of almost every electronic device with usage intensifying at an average rate of 8.7 %. However, this leads to a generation of 45 million tons of electronic waste (E-waste) annually posing significant and concerning environmental risks. Recycling these waste printed circuit boards (PCBs) is vital, in terms of environmental pollution, prevention and resource recycling. Activating these non-metallic fractions of the printed circuit boards results in the development of unique textural properties and functionalities which resemble aluminosilicates; confirmed by FTIR, XRD, XPS, XRF, and TGA and could potentially be applied for the uptake of Fluoride and Arsenate. In this study, Activated Non-metallic fraction of the Printed Circuit Boards (A-NMP) was used to investigate various physio-chemical parameters, including contact time, pH, adsorbent dose, and initial concentration to optimize the reaction conditions for the uptake of F− and As(V) from aqueous solutions and, compared its adsorption capacity with other natural and synthetic aluminosilicate. The maximum adsorption capacity comes out to be 4.33 mg g−1 and 4.65 μg g−1 for F− and As(V) and best fit to Langmuir and Freundlich adsorption isotherms, respectively. Kinetic modelling reveals that the adsorption of F− follows pseudo-first-order kinetics whereas, As(V) follows pseudo-second-order kinetics. Moreover, Intra-particle diffusion revealed a chemisorption-controlled process for both the adsorbates. Furthermore, in a binary component system the F− and As(V) showed the maximum percentage removal of 92 % and 76 %, respectively at pH 5, and best fit to Langmuir adsorption isotherm.

YOLO-RRL: A Lightweight Algorithm for PCB Surface Defect Detection

Printed circuit boards present several challenges to the detection of defects, including targets of insufficient size and distribution, a high level of background noise, and a variety of complex types. These factors contribute to the difficulties encountered by PCB defect detection networks in accurately identifying defects. This paper proposes a less-parametric model, YOLO-RRL, based on the improved YOLOv8 architecture. The YOLO-RRL model incorporates four key improvement modules: The following modules have been incorporated into the proposed model: Robust Feature Downsampling (RFD), Reparameterised Generalised FPN (RepGFPN), Dynamic Upsampler (DySample), and Lightweight Asymmetric Detection Head (LADH-Head). The results of multiple performance metrics evaluation demonstrate that YOLO-RRL enhances the mean accuracy (mAP) by 2.2 percentage points to 95.2%, increases the frame rate (FPS) by 12%, and significantly reduces the number of parameters and the computational complexity, thereby achieving a balance between performance and efficiency. Two datasets, NEU-DET and APSPC, were employed to evaluate the performance of YOLO-RRL. The results indicate that YOLO-RRL exhibits good adaptability. In comparison to existing mainstream inspection models, YOLO-RRL is also more advanced. The YOLO-RRL model is capable of significantly improving production quality and reducing production costs in practical applications while also extending the scope of the inspection system to a wide range of industrial applications.

Enhancing Flexible Neural Probe Performance via Platinum Deposition: Impedance Stability under Various Conditions and In Vivo Neural Signal Monitoring.

Monitoring neural activity in the central nervous system often utilizes silicon-based microelectromechanical system (MEMS) probes. Despite their effectiveness in monitoring, these probes have a fragility issue, limiting their application across various fields. This study introduces flexible printed circuit board (FPCB) neural probes characterized by robust mechanical and electrical properties. The probes demonstrate low impedance after platinum coating, making them suitable for multiunit recordings in awake animals. This capability allows for the simultaneous monitoring of a large population of neurons in the brain, including cluster data. Additionally, these probes exhibit no fractures, mechanical failures, or electrical issues during repeated-bending tests, both during handling and monitoring. Despite the possibility of using this neural probe for signal measurement in awake animals, simply applying a platinum coating may encounter difficulties in chronic tests and other applications. Furthermore, this suggests that FPCB probes can be advanced by any method and serve as an appropriate type of tailorable neural probes for monitoring neural systems in awake animals.

An Improved SPWM Strategy for Effectively Reducing Total Harmonic Distortion

In the inverter circuit, the speed at which the MOSFET is impacted by the presence of a parasitic inductor within the printed circuit board (PCB) leads to a delay in the switching process. Furthermore, the parasitic inductor within the circuit can easily form an LC oscillation with the parasitic capacitor of the MOSFET. These two issues result in an inconsistency between the actual output of the MOSFET and the driving signal waveform, leading to distortion in the sinusoidal pulse width modulation (SPWM) waveform and an increase in total harmonic distortion (THD). It is a common practice to mitigate gate oscillation by introducing a resistor at the gate of the MOSFET. However, elevating the resistance leads to deceleration in the charging process of the MOSFET’s parasitic capacitor, consequently causing an increase in the switching delay, and thereby increasing THD. Therefore, an effective strategy to reduce THD is proposed in this paper, while augmenting the gate resistance, computing the MOSFET switching delay, and applying corrective compensation. In this way, the inherent issues of the switch are addressed, resulting in inverter output waveforms that closely resemble sine waves and reduced THD. Through a combination of simulation and empirical experimentation, the efficacy of the proposed approach in significantly reducing THD in the inverter’s output waveform has been empirically substantiated.

Soldering Defect Segmentation Method for PCB on Improved UNet

Despite being indispensable devices in the electronic manufacturing industry, printed circuit boards (PCBs) may develop various soldering defects in the production process, which seriously affect the product’s quality. Due to the substantial background interference in the soldering defect image and the small and irregular shapes of the defects, the accurate segmentation of soldering defects is a challenging task. To address this issue, a method to improve the encoder–decoder network structure of UNet is proposed for PCB soldering defect segmentation. To enhance the feature extraction capabilities of the encoder and focus more on deeper features, VGG16 is employed as the network encoder. Moreover, a hybrid attention module called the DHAM, which combines channel attention and dynamic spatial attention, is proposed to reduce the background interference in images and direct the model’s focus more toward defect areas. Additionally, based on GSConv, the RGSM is introduced and applied in the decoder to enhance the model’s feature fusion capabilities and improve the segmentation accuracy. The experiments demonstrate that the proposed method can effectively improve the segmentation accuracy for PCB soldering defects, achieving an mIoU of 81.74% and mPA of 87.33%, while maintaining a relatively low number of model parameters at only 22.13 M and achieving an FPS of 30.16, thus meeting the real-time detection speed requirements.

Iterative Placement of Decoupling Capacitors using Optimization Algorithms and Machine Learning

Abstract. In this work, an approach for optimum placement of on-board decoupling capacitors (decaps) is presented, which aims at reducing transient noise in power delivery networks (PDNs). This approach is based on a genetic algorithm (GA) and accelerated by the use of an artificial neural network (ANN) as surrogate model to efficiently determine the fitness of a decap design, i.e., of a particular choice for the position and the type of the decaps to integrate in the printed circuit board (PCB). The ANN is trained by a suitable set of reference designs labeled by the impedance at the power pin of the integrated circuit (IC), which is computed by commercial simulation software. Several iterative runs of the GA are performed with an increasing number of decaps to identify a design with the least number of decaps necessary to reduce the distance of the frequency domain input impedance of the considered point-to-point connection from a desired target impedance as far as possible. This approach is successfully applied to generate an optimum decap design for a PDN with 52 possible decap positions and decaps chosen from three types.

Selective adsorption of gold ion in wastewater with competing cations by novel thiourea-reduced graphene oxide

In this study, selective adsorption experiments of Au were carried out using graphene oxide (GO) and thiourea-reduced GO (TU-rGO). Adsorption experiments using Au, Cu, Pb, and Zn were performed with GO and TU-rGO in order to selectively adsorb Au from simulated waste electric and electronic equipment leachate or printed circuit board wastewater. Optimal adsorption conditions were determined, adsorption isotherm models were fitted, and desorption and regeneration experiments were performed. Additionally, GO and TU-rGO were characterized to better understand the material and propose the adsorption and desorption mechanisms for TU-rGO. It was found that TU-rGO could selectively adsorb Au, achieving a high efficiency of 95‒99% at initial Au concentrations of 0.1‒10 mg L−1 with little to no adsorption of Cu, Pb, and Zn. Moreover, the desorption efficiency of Au by ammonium thiosulfate reached 94% with the adsorption efficiency of TU-rGO decreasing from 99 to 78% after five adsorption and desorption cycles. Isotherm adsorption experiments indicated that the Langmuir model better fitted the adsorption of Au than the Freundlich model. This implied that the adsorption process was mainly controlled by monolayer coverage, with a high Au adsorption capacity of approximately 833 mg g−1 for TU-rGO.

The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure

AlN ceramic is the potential substrate for high-performance printed circuit board with the rapid development of electronic industry due to the superior thermal and electrical property, while its metallization still faces the issues of thermal stress and weak interface bonding with existing technology. Herein, a convenient design is proposed to achieve the Cu deposition on the surface of AlN substrate, the TiO2 containing photocatalytic intermediate layer is prefabricated on AlN substrate with silica and titania mixed sol, and induces the autocatalytic deposition of electroless copper plating under ultraviolet irradiation. Compared with Cu deposition with Pd activation treatment, the bonding strength between Cu layer and AlN substrate is significantly enhanced with the intermediate layer, this is ascribed to the formed nano-porous microstructure of the sintered intermediate layer facilitating the penetration of plating bath, and the mechanical anchoring effect derived from the interlocking microstructure between Cu layer and intermediate layer contributes to the improved bonding strength. This new method realizes the metallization of AlN ceramic with high interfacial bonding strength and low cost compared with the traditional joining technology, and provides a potential reference for the surface metallization of inert material.

Wideband 2×2 antenna-in-package based on magneto-electric dipole array antenna for 5G mmWave applications

This paper presents an antenna-in-package (AiP) design realised with the conventional multi-layer printed circuit board manufacturing method. The design consists of a wideband 2×2 magneto-electric dipole array antenna operating from 24.25−29.5 GHz and a wideband transition from the analogue beamformer integrated into the proposed MED array antenna (IMED). The IMED array antenna has been fabricated with two distinct NXP analogue beamformer chips, i.e., MMW 9004 KC and MMW 9002 KC covering the N257 and the N258 band, respectively. The measured effective isotropic radiated power at P1dB was 35.3 dBm and 35.1 dBm for the IMED with the MMW 9004 KC and the MMW 9002 KC analogue beamformer chip, respectively. Our proposed antenna demonstrates the feasibility of designing a single wideband AiP that can be integrated with different analogue beamformers operating within the frequency band of the proposed antenna. This is true, provided the RFIC used for integration has the same footprint for RF ports, serial peripheral interface control ports, and DC power supply ports. The primary benefit of the proposed technique is the design antenna can adapt the operating frequency to different frequency standards by incorporating additional analogue chips without increasing the design complexity. This feature enables the antenna manufacturer to tailor the antenna products to different frequency standardisations depending on where the antenna will be employed. The AiP operates at 5G millimeter-wave (mmWave) frequencies, with the potential for Internet of Things applications. Furthermore, from our simulation results, the proposed IMED can potentially be extended as a phased array antenna with 2D scanning.

Defect detection of printed circuit board assembly based on YOLOv5

Detection of printed circuit board assembly (PCBA) defects is crucial for improving the efficiency of PCBA manufacturing. This paper proposes PCBA-YOLO, a YOLOv5-based method that can effectively increase the accuracy of PCBA defect detection. First, the spatial pyramid pooling module with cross-stage partial structure is replaced in the neck network of YOLOv5 to capture the resolution features at multiple scales. Second, large kernel convolution is introduced in the backbone network to obtain larger effective receptive fields while reducing computational overhead. Finally, an SIoU loss function that considers the angular cost is utilized to enhance the convergence speed of the model. In addition, an assembled PCBA defect detection dataset named PCBA-DET is created in this paper, containing the corresponding defect categories and annotations of defect locations. The experimental results on the PCB defect dataset demonstrate that the improved method has lower loss values and higher accuracy. Evaluated on the PCBA-DET dataset, the mean average precision reaches 97.3%\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\%$$\\end{document}, achieving a real-time detection performance of 322.6 frames per second, which considers both the detection accuracy and the model size compared to the YOLO series of detection networks. The source code and PCBA-DET dataset can be accessed at https://github.com/ismh16/PCBA-Dataset.

Feasibility and Structural Transformation of Electrodeposited Copper Foils for Graphene Synthesis by Plasma‐Enhanced Chemical Vapor Deposition: Implications for High‐Frequency Applications

AbstractLarge‐area graphene is typically synthesized on rolled‐annealed copper foils, which require transferring to other substrates for applications. This study examines large‐area graphene growth on electrodeposited (ED) copper foils—used in lithium‐ion batteries and printed circuit boards—via plasma‐enhanced chemical vapor deposition (PECVD). It reveals that, for a set plasma power, a minimum growth time ensures full graphene coverage, leading to monolayer and then multilayer graphene, showing PECVD growth on ED copper is not self‐limited. The process also beneficially modifies the ED copper substrate, like removing the surface zinc layer and changing copper grain size and orientation, thus improving graphene growth. Additionally, the study includes high‐frequency scattering parameter (S‐parameter) measurements in a coplanar waveguide (CPW) system. This involves graphene on a sapphire substrate with a silver electrode. The S‐parameter data indicate that the CPW with graphene shows reduced insertion losses in high‐frequency circuits compared to those without graphene. This underscores graphene's role in reducing insertion losses between metallic and dielectric layers in high‐frequency settings, offering valuable insights for industrial and technological applications.

A wearable, rapidly manufacturable, stability-enhancing microneedle patch for closed-loop diabetes management

The development of a wearable, easy-to-fabricate, and stable intelligent minisystem is highly desired for the closed-loop management of diabetes. Conventional systems always suffer from large size, high cost, low stability, or complex fabrication. Here, we show for the first time a wearable, rapidly manufacturable, stability-enhancing microneedle patch for diabetes management. The patch consists of a graphene composite ink-printed sensor on hollow microneedles, a polyethylene glycol (PEG)-functionalized electroosmotic micropump integrated with the microneedles, and a printed circuit board for precise and intelligent control of the sensor and pump to detect interstitial glucose and deliver insulin through the hollow channels. Via synthesizing and printing the graphene composite ink, the sensor fabrication process is fast and the sensing electrodes are stable. The PEG functionalization enables the micropump a significantly higher stability in delivering insulin, extending its lifetime from days to weeks. The patch successfully demonstrated excellent blood glucose control in diabetic rats. This work may introduce a new paradigm for building new closed-loop systems and shows great promise for widespread use in patients with diabetes.

Organ chips with integrated multifunctional sensors enable continuous metabolic monitoring at controlled oxygen levels

Despite remarkable advances in Organ-on-a-chip (Organ Chip) microfluidic culture technology, recreating tissue-relevant physiological conditions, such as the region-specific oxygen concentrations, remains a formidable technical challenge, and analysis of tissue functions is commonly carried out using one analytical technique at a time. Here, we describe two-channel Organ Chip microfluidic devices fabricated from polydimethylsiloxane and gas impermeable polycarbonate materials that are integrated with multiple sensors, mounted on a printed circuit board and operated using a commercially available Organ Chip culture instrument. The novelty of this system is that it enables the recreation of physiologically relevant tissue-tissue interfaces and oxygen tension as well as non-invasive continuous measurement of transepithelial electrical resistance, oxygen concentration and pH, combined with simultaneous analysis of cellular metabolic activity (ATP/ADP ratio), cell morphology, and tissue phenotype. We demonstrate the reliable and reproducible functionality of this system in living human Gut and Liver Chip cultures. Changes in tissue barrier function and oxygen tension along with their functional and metabolic responses to chemical stimuli (e.g., calcium chelation, oligomycin) were continuously and noninvasively monitored on-chip for up to 23 days. A physiologically relevant microaerobic microenvironment that supports co-culture of human intestinal cells with living Lactococcus lactis bacteria also was demonstrated in the Gut Chip. The integration of multi-functional sensors into Organ Chips provides a robust and scalable platform for the simultaneous, continuous, and non-invasive monitoring of multiple physiological functions that can significantly enhance the comprehensive and reliable evaluation of engineered tissues in Organ Chip models in basic research, preclinical modeling, and drug development.

A 27 ​GHz, simple 2-bit 1×8 phased array

This study demonstrates a simple 2-bit phased array operating at 27 ​GHz that supports one-dimensional beam scanning with left-handed circular polarization (LHCP). The antenna is constructed using a compact four-layer printed circuit board (PCB) structure, consisting of a 90° phase shifter layer with microstrip structures, a ground (GND) layer, a direct current (DC) control layer, and a circularly polarized annular radiation patch layer with 1-bit phase shifting. Based on the proposed unit structure, a 1×8 array with half-wavelength inter-element spacing was designed and validated. Experimental results show that the array achieves a peak gain of 10.23 dBi and is capable of beam scanning within ±50°.

Electrosynthesis of tunable NiO/CuO-printed circuit board electrodes for glucose sensing

In this research work, a copper-based printed circuit board (Cu-PCB) was used as an electrode substrate. Alloyed copper-nickel oxides were synthesized on the surface of the Cu-PCB electrode by the two stages: In the first step, the electrodeposition of copper-nickel alloy on the surface of the Cu-PCB electrode was carried out by cyclic chronopotentiometric method (8 cycles) at the optimized conditions. In the second step, the Ni/Cu-PCB electrode was immersed in 1 M NaOH electrolyte solution, followed by the electrochemical synthesis of the alloyed copper-nickel oxides by repetitive cyclic voltammetry (40 cycles) and subsequently, the NiO/CuO-PCB electrode was obtained. The surface structure and morphology of NiO/CuO-PCB and Cu-PCB electrodes were comparatively investigated by SEM, EDX, and XRD techniques. Moreover, the electrochemical behavior and electrocatalytic properties of NiO/CuO-PCB electrode have been effectively investigated. To study the electrocatalytic efficiency of the NiO/CuO-PCB electrode, the measurement of glucose as a biological target was studied by cyclic voltammetry (CV) and amperometry approaches as well. The limit of glucose detection (LOD) and sensitivity of the proposed method in glucose assay were calculated as 5.4 and 1.1 µM, and 118.14 and, 112.08 mA/M by CV and amperometry approaches, respectively. Two-segment calibration graphs were found over the range 1.4–120 mM by CV, and 0.14–180 mM by hydrodynamic amperometry techniques. The fabricated sensor was successfully used to measure glucose in blood serum and human plasma samples.

Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate

This work studies the leaching of copper contained in waste printed circuit boards (PCB) with ferric sulfate, with the aim of improving the results found in the literature for an industrial application of the process. For this purpose, temperatures and concentrations of ferric ion higher than those of previous works (up to 60 °C and 40 g/L) are used. Furthermore, ferric sulfate can be continuously regenerated by ferro-oxidizing bacteria immobilized in a bioreactor, avoiding physical contact between waste and microorganisms to optimize independently operation conditions. A kinetic model was developed for the interpretation of the experimental results validated at different conditions. The model was based on a shrinking core model limited by mass transfer inside the PCB where the geometry and structure of the PCB has been considered and an excellent fit of the model to the experimental data was obtained. The connection with the bioreactor for biooxidation of the generated ferrous ion allows maintaining high concentrations of ferric when operating at high solid concentrations (5–10 %). In all the cases studied, more than 99 % of the copper contained in the non-pulverized PCB parts was dissolved in less than 24 h, with an average copper extraction rate of 0.6 g/L·h higher than those found in previous works.

Design of Three-Dimensional Magnetic Probe System for Space Plasma Environment Research Facility (SPERF).

A three-dimensional magnetic probe system has been designed and implemented at the Space Plasma Environment Research Facility (SPERF). This system has been developed to measure the magnetic field with high spatial and temporal resolution, enabling studies of fundamental processes in space physics, such as magnetic reconnection at the Earth's magnetopause, on the basis of SPERF. The system utilizes inductive components as sensors, arranged in an array and soldered onto a printed circuit board (PCB), achieving a spatial resolution of 2.5 mm. The system's electrical parameters have been measured, and its amplitude-frequency response characteristics have been simulated. The system has demonstrated good performance with response capabilities below 50 kHz. The experimental setup and results are discussed, highlighting the system's effectiveness in accurately measuring weak magnetic signals and its suitability for magnetic reconnection experiments.

Filter cable design with defected conductor transmission structures

Electrical cables, as the industry’s blood vessels and nervous system, require evolving distributed filtering for complex electromagnetic environment adaptability. This article introduces a filter cable design featuring an insulated cylinder coated with a defected conductor transmission structure (DCTS). The DCTS, with a well-designed etched pattern, functions as a boundary condition for transmitting specific frequency electromagnetic waves, similar to a lumped filter circuit. To validate this method, a low-pass filter cable is proposed with six-slot-ring defected structures, utilizing polytetrafluoroethylene as the inner dielectric, encased within a flexible printed circuit board (FPCB)-manufactured DCTS. The proposed cable, with precise dimensions (2.4 mm diameter, 340 mm length), demonstrates minimal insertion loss ( < 0.38 dB below 6 GHz) in the passband and rejection exceeding 23 dB at 7.7-25 GHz in the stopband. Further enhancements achieve attenuation exceeding 50 dB in the stopband (7.1 GHz to 20 GHz). Compared to traditional cables, this filter cable addresses electromagnetic compatibility (EMC) by cutting off the interference coupling path.

Succinimide-Functionalized Reduced Graphene Oxide Nanosheets: A High-throughput Resistive Sensing Platform for Age-Related Macular Degeneration Biomarker Determination Using Human Tears.

Age-related macular degeneration (AMD) is a well-recognized affliction among the elderly, causing vision impairment ranging from blurred vision to complete blindness. This underscores the critical need for accurate, precise, and early detection methods. Herein, we developed a noninvasive, label-free electrical biosensor, constructed on an economical printed circuit board (PCB) substrate, designed specifically for the precise quantification of AMD biomarker: complement component III (C3). The hydrothermally reduced graphene oxide (rGO) was deposited between gold-interdigitated microelectrodes, forming a conductive channel. The fabricated C3 biosensor exhibits a low detection limit of 0.4342 ng/mL and an impressive sensitivity of 9.238 ((ΔR/R)/ng.mL-1)/cm2 with a regression coefficient of 0.9815 calibrated within the clinical C3 range of 10-30 ng/mL. This excellent performance is ascribed to the synergistic effects of 1-pyrenebutanoic acid succinimidyl ester (PBASE) linker and conducting properties of rGO as they generate large active sites for higher anti-C3 antibody immobilization, thereby enhancing sensitivity and specificity. Furthermore, the performance of this proposed C3 sensor chip was validated with enzyme-linked immunosorbent assay (ELISA) using five human tear samples exhibiting an outstanding correlation of a regression value of 0.9774. The unparalleled merits of this newly crafted C3 biosensor transcend those of preceding platforms, boasting superior accuracy and precision in quantifying C3 levels in human tears, accelerated operational speed with results attainable within a mere 15 min, cost-effectiveness, and excellent sensitivity.