Printed Circuit Board Emissions Research Articles

Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages

A full-wave electromagnetic analysis for characterizing typical electromagnetic shielding practices in ceramic electronic packages is presented. Typically in printed circuit board emissions, the power plane emissions, and exposed surface nets are considered, however, the signal interconnect from the PCB to an electronic package can also be a significant source of radiation and hence an electromagnetic interference (EMI) issue. In this paper we describe electromagnetic radiation mechanisms resulting from high-frequency and high-speed applications in ceramic multilayer electronic packages and review the typical practice of implementing via fences to mitigate and reduce the EMI risk within a package substrate and also for the case when the package is part of a package/board configuration.

단일 비아 위치를 이용한 PCB의 복사성 방사 성능 향상

본 논문은 신호 전송용 비아가 있는 4층 PCB(Printed Circuit Boards)의 P/G(power/ground)면 사이에서 발생되는 공진을 상쇄시켜 복사성 방사(RE: Radiated Emission) 성능을 개선할 수 있는 기법을 제안하였다. 면간 공진 상쇄를 확인하기 위하여 비아가 있는 4층 PCB에서 신호 전송 선로의 전송 특성, PCB 개방 모서리를 통한 방사(radiation)와 RE 세기를 계산하고, 측정하여 제안된 기법의 타당성을 입증하였다. The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.

Net and partial inductance of a microstrip ground plane

A knowledge of the net inductance of the ground plane can aid in the analysis and investigation of printed circuit board emissions. In this paper, we present a method, based on the concept of partial inductance, to determine the net inductance of the ground plane associated with a microstrip line. This method is based on a previously derived expression for the current density on the ground plane. We show calculations for the net, self-partial, and mutual-partial inductance of the ground plane for various trace geometries of practical interest. We also illustrate how the classical transmission line inductance of a microstrip line can be obtained from the concept of partial inductance. Comparisons to different experimental results are also given.