Preparation Of Copper Powder Research Articles

Clogging of the delivery tube during preparation of copper powder by vacuum atomisation: coupling analysis of flow resistance and heat transfer

ABSTRACT During the production of micro-fine powders using gas atomization technology, the problem of clogging of the delivery tube is often encountered. Flow resistance inside the delivery tube and heat transfer of the delivery tube is one of the critical factors causing the clogging of the delivery tube. In this paper, the volume of the fluid model (VOF) coupled with the discrete phase model (DPM) were used to simulate the delivery tube-clogging process of the delivery tube involved in atomizing copper powder. The results indicate that, with the increase in the length of the delivery tube, the flow resistance increased; Shortening the length of the tube reduces the flow resistance and increases the superheat of the melt, the atomization process is uninterrupted. The atomized powder was qualitatively determined by standard deviation to determine the number of satellite balls. This research has guiding value in understanding the continuity of the atomization process.

The Synthesis of CuO/Polystyrene Nanocomposite Superhydrophobic Layer using The Spin Coating Method

This paper shows the synthesis of CuO/Polystyrene(PS) nanocomposite superhydrophobic layer using the spin coating method. The objective of this study was to determine the effect of calcination temperature on the contact angle, morphology, and energy gap of the CuO/PS nanocomposite thin layer. Preparation of copper powder into copper oxide (CuO) nanoparticles using the method of High Energy 3 Dimensional Milling (HEM-3D) for 20 hours. The calcination temperature variations used were 100◦C , 150◦C, 180◦C, 200◦C, and 300◦C. In this study, sample analysis was performed using X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and Ultraviolet-Visible (UV-Vis) Spectrophotometry. The contact angle was determined using the sessile drop method. The findings indicate that the calcination temperature affects the contact angle of the nanocomposite thin films the highest contact angle was obtained at 162◦ at a temperature of 200◦C. The results of SEM analysis obtained that at a temperature of 200◦C, the particle size was 62.91 nm and the particles were evenly distributed in the composite layer. The energy gap at 200◦C is 2.03 eV. We found that CuO/PS synthesized at a temperature of 200◦C was superhydrophobic.

电解法制备铜粉工艺研究

电解法制备铜粉工艺研究

Production of Copper Powder from Ores by Elecrodeposition Process

This paper studies the preparation of Copper powder from copper sulphate aqueous solution (CuSO4.5H2O), sulfuric acid (H2SO4) and copper chloride (CuCl2.2H2O) by using the process of electrodeposition. Process of Powder deposition has been investigated for copper powder; it is a fine layer on cathode electrode by using the value of different from time of deposition (15, 30, 45, and 60) min. it is noticed the weight of the powder rises with the rise of time of depostion.
 Diffractions of X-ray (XRD) revealed high crystallinity and pure copper powder not contain impurity or oxides. Optical microscopes have revealed the particles of copper have dendritic shapes. The size of Particles analyzer measured the size of a particle which is about (4.645) μm.

The preparation of copper powder using solvothermal process and its application as EMI shielding agent

Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from <TEX>$CuSO_4$</TEX>, NaOH, Glucose, mixed solvent (<TEX>$H_2O$</TEX>: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.

Preparation of copper powder by glycerol process

A simple, least energy intensive, efficient, low temperature chemical process for the production of copper powder of narrow size distribution is described. It involves reduction of copper salts by glycerol under atmospheric conditions at a temperature below 240°C. The powders produced by this process have been characterized by X-ray diffraction, chemical composition, BET surface area analysis and scanning electron microscopy. The powder is well crystalline and contains oxygen, carbon, and hydrogen as impurity elements. The purity of the powder produced by the process depends on the starting compound of copper. The glycerol process using copper acetate as starting compound yields copper powder having a purity of 99.7%.

Preparation of copper powder by precipitation from aqueous solutions : R.Golen et al. (Akademia Gorniczo-Hutnicza, Krakow, Poland.) Metall. Proszkow, vol 29, no 3/4, 1996, 10–17. (In Polish.)

Preparation of copper powder by precipitation from aqueous solutions : R.Golen et al. (Akademia Gorniczo-Hutnicza, Krakow, Poland.) Metall. Proszkow, vol 29, no 3/4, 1996, 10–17. (In Polish.)

Synthesis of nanocrystalline and monodispersed copper particles of uniform spherical shape

Abstract The preparation of copper powders most suitable for thick-film conductors was investigated. Reaction of CuCl with ethylenediamine at room temperature gives spherical polymodal copper powder with particle diameters of 0.79 ± 0.35 μm. Characterizations of the as-prepared samples by XRD, SEM, TEM are reported.

Homogeneous catalysis in the hydrometallurgical method for the preparation of copper powder

We have found that catalytic methods may be used for the preparation of copper powder which permit the reaction under mild conditions. Cupric oxide is reduced by CO in the presence of a homogeneous catalytic system monoethanolamine and a rhodium complex, namely, L3RhCI, L2Rh(CO)CI, LRh(DMGH)2CI, or LRh(CO)(8-ox), where L is diphenyl-m-sulfophenylphosphine, DMGH 2 is dimethylglyoxime, and 8-ox is H-8-oxyquinoline. This reaction is presumably quite similar to the conversion of water gas on this catalytic system described in our previous work [2]. CO + CuO ~ CO~ + Cu; CO + H20 ~ CO~ + H ~

Statistical analysis of conditions of preparation of copper powder

1. Statistical mathematical models have been obtained describing the dependence of the particle size (amount of the+0.045-mm fraction) and apparent density of copper powders on the basic parameters of the electrodeposition process. 2. The mathematical models provide a close approximation to the real industrial process within the process parameter ranges for which they were obtained. 3. The properties of electrodeposited copper powders can be controlled, and a suitable method has been developed for the selection of process parameters enabling copper powders of predetermined properties to be obtained. The method has been tested under pilot-plant conditions and adopted at the Uralelektromed' Combine.

Disintegration of a metal jet by a gas stream

1. Calculations have been performed to determine the critical comminution velocities of molten copper particles between 50 and 500μ in size for atomization with cold and hot air, as well as for the case of overheating of the metal being atomized. 2. Areas of application have been established for atomizing units with the usual converging nozzle and with the Laval nozzle, which guarantees a supersonic gas outlet velocity. 3. Empirical dimension less relationships have been proposed, permitting determination of atomization parameters for the preparation of copper powder of the required particle size.

Preparation of Copper Powder by Electrodeposition

Preparation of Copper Powder by Electrodeposition