Photonics-electronics Convergence System Research Articles

High-Density Silicon Photonics Integrated Technology for Photonics-Electronics Convergence System

High-Density Silicon Photonics Integrated Technology for Photonics-Electronics Convergence System

Optical Characteristics of a Multichannel Hybrid Integrated Light Source for Ultra-High-Bandwidth Optical Interconnections

The optical characteristics of a multi-channel hybrid integrated light source were described for an optical interconnection with a bandwidth of over 10 Tbit/s. The power uniformity of the relative intensity of a 1000-channel light source was shown, and the minimum standard deviation s of the optical power of the 200 output ports at each 25-channel laser diode (LD) array was estimated to be 0.49 dB. This hybrid integrated light source is expected to be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.

First Demonstration of Athermal Silicon Optical Interposers With Quantum Dot Lasers Operating up to 125 °C

We previously proposed a photonics-electronics convergence system to solve bandwidth bottleneck problems among large-scale integrations (LSIs) and demonstrated a high bandwidth density with silicon optical interposers at room temperature. For practical applications, the interposers should be usable under high-temperature conditions or rapid temperature changes so that they can cope with the heat generated by the mounted LSIs. We designed and fabricated athermal silicon optical interposers integrated with temperature-insensitive components on a silicon substrate. An arrayed laser diode (LD) chip was a flip-chip bonded to the substrate. Each LD had multiple quantum dot layers with a 1.3-μm lasing wavelength. The output power was higher than 10 mW per channel up to 100 °C. Silicon optical modulator and germanium photodetector (PD) arrays were monolithically integrated on the substrate. The modulators were structured as symmetric Mach-Zehnder interferometers, which were inherently insensitive to temperature and wavelength. The phase shifters composed of p-i-n diodes were stable against temperature change under a constant bias-current condition. The PD photocurrent was also temperature insensitive, and the photo-to-dark current ratio was higher than 30 dB up to 100 °C. We achieved error-free data links at 20 Gbps and a high bandwidth density of 19 Tbps/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> operating up to 125 °C without adjusting the LDs, modulators, or PDs. The interposers are tolerant of the heat generated by the mounted LSIs and usable over the extended industrial temperature range without complex monitoring or feedback controls. The bandwidth density is sufficient for the needs of the late 2010s.

Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate.

One of the most serious issues in information industries is the bandwidth bottleneck in inter-chip interconnects. We propose a photonics-electronics convergence system to solve this issue. We fabricated a high density optical interposer to demonstrate the feasibility of the system by using silicon photonics integrated with an arrayed laser diode, an optical splitter, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on a single silicon substrate. Error-free data transmission at 12.5 Gbps and a transmission density of 6.6 Tbps/cm2 were achieved with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.

First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate

Engineers are currently facing some technical issues in support of the exponential performance growths in information industries. One of the most serious issues is a bottleneck of inter-chip interconnects. We propose a new "Photonics-Electronics Convergence System" concept. High density optical interconnects integrated with a 13-channel arrayed laser diode, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on single silicon substrate were demonstrated for the first time using this system. A 5-Gbps error free data transmission and a 3.5-Tbps/cm(2) transmission density were achieved. We believe that this technology will solve the bandwidth bottleneck problem among LSI chips in the future.