Photonic Wire Research Articles

Cryogenic optical-to-microwave conversion using Si photonic integrated circuit Ge photodiodes

Integrated circuit technology enables the scaling of circuit complexity and functionality while maintaining manufacturability and reliability. Integration is expected to play an important role in quantum information technologies, including in the highly demanding task of producing the classical signals to control and measure quantum circuits at scales needed for fault-tolerant quantum computation. Here, we experimentally characterize the cryogenic performance of a miniaturized photonic integrated circuit fabricated by a commercial foundry that downconverts classical optical signals into microwave signals. The circuit consists of waveguide-integrated germanium PIN photodiodes packaged using a scalable photonic wire bonding approach to a multi-channel optical fiber array that provides the optical excitation. We find the peak optical-to-microwave conversion response to be ∼150 ± 13 mA/W in the O-band at 4.2 K, well below the temperature the circuit was designed for and tested at in the past, for two different diode designs. The second diode design operates to over 6 GHz of 3 dB bandwidth, making it suitable for controlling quantum circuits, with improvements in bandwidth and response expected from improved packaging. The demonstrated miniaturization and integration offers new perspectives for wavelength-division multiplexed control of microwave quantum circuits and scalable processors using light delivered by optical fiber arrays.

In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization.

Femtosecond laser two-photon polymerization (TPP) technology, known for its high precision and its ability to fabricate arbitrary 3D structures, has been widely applied in the production of various micro/nano optical devices, achieving significant advancements, particularly in the field of photonic wire bonding (PWB) for optical interconnects. Currently, research on optimizing both the optical loss and production reliability of polymeric photonic wires is still in its early stages. One of the key challenges is that inadequate metrology methods cannot meet the demand for multiphysical measurements in practical scenarios. This study utilizes novel in situ scanning electron microscopy (SEM) to monitor the working PWBs fabricated by TPP technology at the microscale. Optical and mechanical measurements are made simultaneously to evaluate the production qualities and to study the multiphysical coupling effects of PWBs. The results reveal that photonic wires with larger local curvature radii are more prone to plastic failure, while those with smaller local curvature radii recover elastically. Furthermore, larger cross-sectional dimensions contribute dominantly to the improved mechanical robustness. The optical-loss deterioration of the elastically deformed photonic wire is only temporary, and can be fully recovered when the load is removed. After further optimization based on the results of multiphysical metrology, the PWBs fabricated in this work achieve a minimum insertion loss of 0.6 dB. In this study, the multiphysical analysis of PWBs carried out by in situ SEM metrology offers a novel perspective for optimizing the design and performance of microscale polymeric waveguides, which could potentially promote the mass production reliability of TPP technology in the field of chip-level optical interconnection.

An 8-channel narrow linewidth multi-wavelength laser hybrid integrated by photonic wire bonding structures for DWDM systems

An 8-channel monolithically integrated narrow linewidth multi-wavelength laser array (NL-MLA) combined with the commercial 8 × 1 planar lightwave circuit (PLC) coupler by the photonic wire bonding (PWB) technique is demonstrated in this paper. A distributed feedback (DFB) laser with the high-reflection and anti-reflection coatings (HR-AR) and the tapered asymmetric corrugation-pitch-modulated (TACPM) grating structure is proposed. The TACPM grating is achieved by the reconstruction equivalent chirp (REC) technique, which is low-cost and of high wavelength accuracy. According to the numerical simulation results, under the unavoidable impact of the facet phase of the HR end, the TACPM DFB laser suppresses the longitudinal spatial hole burning (LSHB) effect significantly, while having better single-mode performance and control of wavelength compared with the conventional HR-AR DFB laser. An 8-channel HR-AR TACPM DFB NL-MLA is fabricated with the 0.8 nm wavelength spacing design. The hybrid integration between the 8-channel NL-MLA and the PLC chip is achieved using the PWB technique. Both good single-mode performance and accurate wavelength interval of 0.8 nm can be obtained when all channels work simultaneously. The laser linewidth is below 273.8 kHz with good uniformity, and the relative intensity noise is under −159.6 dB/Hz for each channel.

One-dimensional photonic wire as a single-photon source: Implications of cavity QED to a phonon bath of reduced dimensionality

One-dimensional photonic wire as a single-photon source: Implications of cavity QED to a phonon bath of reduced dimensionality

Influence of discontinuities on photonic waveguides.

Fabrication-induced imperfections in photonic wire waveguides, such as roughness, stitching errors, and discontinuities, degrade their performance and thereby lower the yield of large-scale systems. This degradation is primarily due to the high insertion losses induced by imperfections, which scale nonlinearly with the index contrast in wire waveguides. Here we investigate the influence of discontinuities in photonic waveguides and later show a platform that is robust to fabrication imperfections. Our platform is based on an array of silicon nano-pillars, arranged to form a sub-wavelength (SW) grating waveguide. We focus on investigating the robustness by considering an abrupt break in the waveguide, as an extreme case of discontinuity. We show that sub-wavelength silicon waveguides are robust against unwanted large discontinuities relative to the operating wavelength. We measure a transmission loss of <2.2 dB at 1550 n m, for a discontinuity of length 2.1 μ m, when compared to more than 7 d B of loss in conventional silicon wire waveguides for the same discontinuity. Our results show that this mode of protection is broadband, covering the entire telecommunication band (λ =1500-1600 nm). We believe that this investigation of the influence of discontinuities in photonic waveguides could be a step toward the realization of low-loss optical waveguides.

The Construction of Multichromophoric Assemblages: A Booming Field

The field of molecular photonics has witnessed significant advancements in the construction of multichromophoric assemblages, which play a crucial role in guiding and manipulating light energy at the molecular level. This paper provides an overview of the strategies and techniques employed in the design and synthesis of such assemblies, with a focus on covalent buildings. The concept of molecular photonic wires is introduced, where chromophores passively guide excitations between functional units. Various examples of covalent structures, including multiporphyrinic architectures, are presented, demonstrating precise control over energy transfer and propagation. Additionally, the polymerization of rigid porphyrinic precursors is explored as an alternative approach. The challenges and potential applications of these multichromophoric assemblies in the field of molecular photonics are discussed. The study highlights the importance of understanding the interactions between chromophores and offers insights into the applicative potential of organic compounds for emerging technologies.

Single-drive electro-optic frequency comb source on a photonic-wire-bonded thin-film lithium niobate platform.

Stable pulse and flat-top frequency comb generation are an indispensable component of many photonic applications, from ranging to communications. Lithium niobate on insulator is an excellent electro-optic (EO) platform, exhibiting high modulation efficiency and low optical loss, making it a fitting candidate for pulse generation through electro-optic modulation of continuous-wave (CW) light, a commonly utilized method for generating ultrashort pulses. Here, we demonstrate an on-chip electro-optic comb generation module on thin-film lithium niobate (TFLN) consisting of a Mach-Zehnder interferometer (MZI) amplitude modulator (AM) and a cascaded phase modulator (PM) system driven by a single-electrode drive. We show that when operated in the correct regime, the lithium niobate chips can generate frequency combs with excellent spectral power flatness. In addition, we optically package one of the pulse generator chips via photonic wire bonding. The pulses generated by the photonic-wire-bonded device are compressed to 840 fs pulse duration using an optical fiber and show extremely stable operation.

Enhanced self-collimation effect by low rotational symmetry in hexagonal lattice photonic crystals

In this study, we present the design of a photonic crystal (PC) structure with a hexagonal lattice, where adjustments to the PC unit cell symmetry reveal an all-angle self-collimation (SC) effect. By optimizing opto-geometric parameters, such as the rotational angle of auxiliary rods and adjacent distances, we analyze the SC property in detail, leveraging group velocity dispersion (GVD) and third-order dispersion (TOD) characteristics. We also investigate the relationship between symmetry properties and their influence on dispersion characteristics. Through symmetry manipulation, we gain a comprehensive understanding of the underlying mechanisms governing light collimation and confinement in the proposed configurations. The PC structure with a C1 symmetry group exhibits all-angle SC effect within the range of a/λ = 0.652 and a/λ = 0.668 normalized frequencies, with a bandwidth of Δω/ω c =2.4% Further breaking the symmetry, transforming from C1 to C2 group symmetry enhances the SC bandwidth to Δω/ω c =6.5% and reveals the perfect linear equi-frequency contours (EFC) at two different frequency bands: all angle SC between a/λ = 0.616 and a/λ = 0.344 normalized frequencies in the 4th transverse magnetic (TM) band and between a/λ = 0.712 and a/λ = 0.760 in the 5th TM band. Here, GVD and TOD values of the TM 4th band vary between 7.3 (a/2πc2)–254.3 (a/2πc2) and 449.2 (a2/4π 2c3)–1.3×105 (a2/4π 2c3), respectively. Also, GVD and TOD values of the TM 5th band vary between 182.5 (a/2πc2)–71.3 (a/2πc2) and −24380(a2/4π 2c3)–−9619 (a2/4π 2c3) values, respectively. Additionally, we propose a composite/hybrid PC structure resembling C2 group symmetry, where two auxiliary rods are replaced by rectangular photonic wires with the same refractive index and width equal to the diameter of auxiliary rods. This hybrid structure exhibits an all-angle SC effect with an operating bandwidth of Δω/ω c =11.7%, which displays near-zero GVD and TOD performance and offers enhanced robustness against potential fabrication precision issues.

Photonic convolution accelerator based on a hybrid integrated multi-wavelength laser array by photonic wire bonding for real-time image classification.

We propose and experimentally demonstrate a compact and efficient photonic convolution accelerator based on a hybrid integrated multi-wavelength DFB laser array by photonic wire bonding. The photonic convolution accelerator operates at 60.12 GOPS for one 3 × 3 kernel with a convolution window vertical sliding stride of 1 and generates 500 images of real-time image classification. Furthermore, real-time image classification on the MNIST database of handwritten digits with a prediction accuracy of 93.86% is achieved. This work provides a novel, to the best of our knowledge, compact hybrid integration platform to realize the optical convolutional neural networks.

Hybrid integrated optical chaos circuits with optoelectronic feedback

A chip-scale chaotic laser system with optoelectronic delayed feedback is proposed and analyzed by numerical simulation. This chip eliminates the need for bulky delay components such as long optical fibers, free propagation and external cavities, relying solely on internal devices and waveguides to achieve feedback delay. This approach simplifies integration, maintaining a compact chip size. According to the results, the chip-scale system exhibits rich dynamics, including periodicity, quasi-periodicity, and chaotic states. Chaos resembling Gaussian white noise is achieved with picosecond-level delay time, highlighting the complexity of chip-scale signals. Furthermore, time delay signature (TDS) concealment is enhanced with a short delay comparable to the inverse bandwidth τ, albeit at a cost of sacrificing chaotic signal complexity. Applying the photonic integrated circuits to practical applications, 1 Gbps back-to-back communication transmission is feasible. Results demonstrate low bit error rates (BERs) for authorizers (&lt;10−6) and high BERs for eavesdroppers (&gt;10−2), ensuring communication confidentiality and chaotic synchronization. Lastly, preliminary experiments validate the feasibility. Our theoretical work has demonstrated the feasibility of hybrid integrated optical chaos circuits with optoelectronic feedback based on photonic wire bonding, which can provide a stable and flexible integrated chaos source.

Multitap microwave photonic filter based on a DFB laser array using photonic wire bonding

We propose and experimentally demonstrate a multitap microwave photonic filter (MPF) based on a distributed feedback (DFB) laser array using photonic wire bonding (PWB). Through the application of the PWB technique, an eight-wavelength DFB laser array with wavelength spacing of 400 GHz was hybrid-integrated with an arrayed waveguide grating multiplexer. Remarkably, the insertion losses of all eight channels are maintained below 5 dB. In the experiments, the larger wavelength spacing allowed us to achieve a sinc MPF with a lower 3 dB bandwidth of 0.22 GHz using only eight taps. Further, Gaussian apodization enabled the out-of-band rejection of the filter to reach 24 dB. These results indicate that the proposed scheme could provide a promising guideline for the MPFs that demand high reconfigurability and greatly reduced size and complexity.

Efficient light couplers to topological slow light waveguides in valley photonic crystals.

We numerically and experimentally demonstrate efficient light couplers between topological slow light waveguides in valley photonic crystals (VPhCs) and wire waveguides. By numerical simulations, we obtained a high coupling efficiency of -0.84 dB/coupler on average in the slow light regime of a group index ng = 10 - 30. Experimentally, we fabricated the couplers in a Si slab and measured the transmitted power of the devices. We realized a high coupling efficiency of approximately -1.2 dB/coupler in the slow light region of ng = 10 - 30, which is close to the result from the numerical simulations. These demonstrations will lay the groundwork for low-loss photonic integrated circuits using topological slow light waveguides.

On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding.

This paper presents a novel co-packaging approach through on-chip hybrid laser integration with photonic circuits using photonic wire bonding. The process involves die-bonding a low-cost semiconductor distributed-feedback (DFB) laser into a deep trench on a silicon-on-insulator (SOI) chip and coupling it to the silicon circuitry through photonic wire bonding (PWB). After characterizing the power-current-voltage (LIV) and optical spectrum of the laser, a wavelength-current relationship utilizing its tunability through self-heating a swept-frequency laser (SFL) is developed. Photonic integrated circuit (PIC) resonators are successfully characterized using the SFL method, demonstrating signal detection with a quality factor comparable to measurements conducted with an off-chip benchtop laser.

Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology

Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology

Theoretical study on on-chip gain characteristics of Er3+ in LiNbO3-on-insulator photonic wire pumped at 980 nm wavelength

Theoretical study on on-chip gain characteristics of Er3+ in LiNbO3-on-insulator photonic wire pumped at 980 nm wavelength

Cryogenic optical packaging using photonic wire bonds

The widespread adaptation of systems relying on optically controlled quantum information will require reliable and efficient multi-channel fiber-to-chip connections that function at cryogenic temperatures. Here we demonstrate low loss (2 dB per channel) connections between a single mode fiber array and tapered silicon waveguides down to 5 K using polymer based photonic wire bonds (PWBs). A method is described for assembling the silicon chip and fiber array such that the PWB connections are robust to temperature cycling and cryostat bakeout. The threshold power handling capability of the PWBs is greater than 4 dBm, sufficient to demonstrate optical bistability in silicon microring resonators coupled to the waveguides at 5 K.

Plug‐and‐Play Fiber‐Coupled Quantum Dot Single‐Photon Source via Photonic Wire Bonding

AbstractThe collection of single‐photon emission from a quantum dot (QD) in a Bragg waveguide through a photonic wire bond (PWB) via free‐space resonant frequency pumping at 1.6 K is demonstrated. The in‐fiber single photons show a small multiphoton contribution, quantified by a low second order photon autocorrelation value of (background‐corrected) or (raw data). The decay time of the QD is measured to be ps. The PWB obviates the need for in‐cryostat alignment of the single‐photon source with an optical fiber and thus offers a route to scalable integration of quantum photonic devices in a cryogenic environment. Uniquely, the approach combines the QD‐waveguide technique, enabling resonant driving of individual QDs without the need for cross‐polarization filtering, and the PWB for deterministic, alignment‐free coupling of single‐photon sources to optical fibers.

Thermal Imaging of Polymer-Based Photonic Wire Bond Through Thermoreflectance Microscopy

Thermal Imaging of Polymer-Based Photonic Wire Bond Through Thermoreflectance Microscopy

Optical Amplification in Er-Doped LiNbO3-on-Insulator Photonic Wire Pumped at 1480 nm Wavelength

Optical Amplification in Er-Doped LiNbO₃-on-Insulator Photonic Wire Pumped at 1480 nm Wavelength

Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb

Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. External feedback circuits can be efficiently implemented using low-loss silicon nitride (Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> ) waveguides, which do not suffer from two-photon absorption and can thus handle much higher power levels than conventional silicon photonics. However, co-integrating III-V-based gain elements with tunable external feedback circuits in chip-scale modules still represents a challenge, requiring either technologically demanding heterogeneous integration techniques or costly high-precision multi-chip assembly, often based on active alignment. In this work, we demonstrate Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> -based hybrid integrated ECL that exploit 3D-printed structures such as intra-cavity photonic wire bonds and facet-attached microlenses for low-loss optical coupling with relaxed alignment tolerances, thereby overcoming the need for active alignment while maintaining the full flexibility of multi-chip integration techniques. In a proof-of-concept experiment, we demonstrate an ECL offering a 90 nm tuning range (1480 nm–1570 nm) with on-chip output powers above 12 dBm and side-mode suppression ratios of up to 59 dB in the center of the tuning range. We achieve an intrinsic linewidth of 979 Hz, which is among the lowest values reported for comparable feedback architectures. The optical loss of the intra-cavity photonic wire bond between the III-V gain element and the Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> -based tunable feedback circuit amounts to approximately (1.6 ± 0.2) dB. We use the ECL as a tunable pump laser to generate a dissipative Kerr soliton frequency comb. To the best of our knowledge, our experiments represent the first demonstration of a single-soliton Kerr comb generated with a pump that is derived from a hybrid ECL.