Photonic Integrated Circuit Technology Research Articles

Photonic integrated interrogators for wearable fiber-optic sensing

Wearable technology, thanks to its substantial economic and social impact, has garnered widespread public attention. For a long time, the commercialization of wearable fiber-optic sensing has been limited by the cost and size of bulky optics-based optical interrogators, which serve to measure and analyze optical signals. This limitation can be addressed by introducing photonic integrated circuit (PIC) technology to develop optical interrogators, which can be referred to as photonic integrated interrogators. A gap exists between these two domains: fiber-optic sensing researchers lack familiarity with PICs, and conversely, PIC researchers may not be well-versed in fiber-optic sensing. The objective of this review is to bridge and minimize this knowledge gap. A brief summary of different sensing principles is provided. The recent progress and advantages of photonic integrated interrogators and their applications in wearable fiber-optic sensing systems are summarized herein. An overview of different strategies for photonic integrated interrogators including polarimetric, spectroscopic, and hybrid-measurement ones, is presented. We also introduce how light sources and photodetectors can be integrated with photonic integrated interrogators to achieve more compact, lower-cost devices. Moreover, the challenges of photonic integrated interrogators used in wearable fiber-optic sensing systems are briefly discussed and highlighted.

Low-power, agile electro-optic frequency comb spectrometer for integrated sensors.

Sensing platforms based upon photonic integrated circuits have shown considerable promise; however, they require corresponding advancements in integrated optical readout technologies. Here, we present an on-chip spectrometer that leverages an integrated thin-film lithium niobate modulator to produce a frequency-agile electro-optic frequency comb for interrogating chip-scale temperature and acceleration sensors. The chirped comb process allows for ultralow radiofrequency drive voltages, which are as much as seven orders of magnitude less than the lowest found in the literature and are generated using a chip-scale, microcontroller-driven direct digital synthesizer. The on-chip comb spectrometer is able to simultaneously interrogate both an on-chip temperature sensor and an off-chip, microfabricated optomechanical accelerometer with cutting-edge sensitivities of ≈5µK⋅Hz−1/2 and ≈130µm⋅s−2⋅Hz−1/2, respectively. This platform is compatible with a broad range of existing photonic integrated circuit technologies, where its combination of frequency agility and ultralow radiofrequency power requirements are expected to have applications in fields such as quantum science and optical computing.

Curved GaAs cantilever waveguides for the vertical coupling to photonic integrated circuits.

We report the nanofabrication and characterization of optical spot-size converter couplers based on curved GaAs cantilever waveguides. Using the stress mismatch between the GaAs substrate and deposited Cr-Ni-Au strips, single-mode waveguides can be bent out-of-plane in a controllable manner. A stable and vertical orientation of the out-coupler is achieved by locking the spot-size converter at a fixed 90 ∘ angle via short-range forces. The optical transmission is characterized as a function of temperature and polarization, resulting in a broad-band chip-to-fiber coupling extending over 150 nm wavelength bandwidth at cryogenic temperatures, with the lower bound for the coupling efficiency into the TE mode being 16±2% in the interval 900-1050 nm. The methods reported here are fully compatible with quantum photonic integrated circuit technology with quantum dot emitters, and open opportunities to design novel photonic devices with enhanced functionality.

(Invited) Optical Biosensors in Photonic Integrated Circuits for Smart System Integration

Photonic integrated circuits (PIC) are like electronic integrated circuits drivers of communication systems. Moreover, state-of-the-art technologies enable the fabrication of electronic-photonic integrated circuits (ePIC), which allows for example the cointegration of ultra-fast BiCMOS devices with high speed photo detectors. Besides that, this technology provides an attractive platform for biosensors. They open the door for label-free detection of various analytes with high specificity and in real-time. This gives perspective to highly scalable and cost effective technologies for smart system integration of biosensors and electronic readouts to realize a true lab-on-a-chip application.We present the integration of optical biosensors in a Si-based PIC-technology. This comprises a front-end of line with optical waveguides, an integrated Ge-photodiode and a complete back-end of line consisting of three thin and two thick aluminum metal layers. The optical biosensor is integrated by opening the optical waveguide from the backside of the chip. In particular, we released a Si-based slot waveguide, which provides an enhanced evanescent field to interact with the analyte and hence to increase the sensitivity. The slot waveguide is incorporated in a ring resonator and we analyzed the wafer-level performance using the full width at half maximum, which allows us to assess the optical losses. Thermal sensing in a wide temperature range is investigated. In addition, a simple and cost-effective microfluidic is realized and we show initial results of the surface functionalization. Our work demonstrates the compatibility of a photonic biosensor with a photonic integrated circuit technology without any restriction to the standard FEOL and BEOL processing on the wafer front-side, while it keeps the inherent high sensitivity of evanescent-field sensing and opens a route towards smart system integration. Figure 1

Semi-Analytical Approach versus Finite Element Method for Analysis of Propagation Properties in Rectangular Waveguides: Silica-Titania Technological Platform

This work explicitly demonstrates a semi-analytical effective index approximation (EIA) approach for the description of the propagation properties of rib and ridge waveguides. By using the example of waveguides realized on a low-cost silica-titania (SiO2:TiO2) technological platform, we present that EIA may be successfully applied for the approximate determination of modal effective indices and single mode propagation conditions. All obtained results have been confirmed to be convergent with the finite element method (FEM) simulations at low relative error. Due to the tremendously fast execution time of EIA simulations in comparison with the FEM solver, we believe that the presented approach may be applied in a preliminary step of designing functional blocks in new and existing photonic integrated circuit technologies, which often require complex and multi-parameter calculations.

Scalable photonic integrated circuits for high-fidelity light control

Advances in laser technology have driven discoveries in atomic, molecular, and optical (AMO) physics and emerging applications, from quantum computers with cold atoms or ions, to quantum networks with solid-state color centers. This progress is motivating the development of a new generation of optical control systems that can manipulate the light field with high fidelity at wavelengths relevant for AMO applications. These systems are characterized by criteria: (C1) operation at a design wavelength of choice in the visible (VIS) or near-infrared (IR) spectrum, (C2) a scalable platform that can support large channel counts, (C3) high-intensity modulation extinction and (C4) repeatability compatible with low gate errors, and (C5) fast switching times. Here, we provide a pathway to address these challenges by introducing an atom control architecture based on VIS-IR photonic integrated circuit (PIC) technology. Based on a complementary metal–oxide–semiconductor fabrication process, this atom-control PIC (APIC) technology can meet system requirements (C1)–(C5). As a proof of concept, we demonstrate a 16-channel silicon-nitride-based APIC with (5.8±0.4)ns response times and >30dB extinction ratio at a wavelength of 780 nm.

Discretely Tunable (2594, 2629, 2670 nm) GaSb/Si3N4 Hybrid Laser for Multiwavelength Spectroscopy

AbstractA discrete, tunable photonic integrated laser is showcased for multiwavelength spectroscopy of CO2, H2S, and H2O. The laser combines an AlGaInAsSb/GaSb type‐I quantum well‐reflective semiconductor optical amplifier with a Si3N4 photonic integrated circuit (PIC). Operating at room temperature, the laser emits at 2670.42, 2629.12, and 2594.27 nm, with mW‐level average powers. The PIC employs a novel approach for achieving switching between three distinct emission wavelengths by using two cascaded tunable Mach–Zehnder interferometers (MZIs) that are connected to three spiral‐shaped narrow‐band distributed Bragg reflectors (DBRs). Phase tuning the arms of the MZIs allows the laser emission wavelength to be switched between the DBRs, while the DBRs themselves offer fine‐tuning of the emission wavelength. This design enables a simpler tuning mechanism with fewer control variables compared to hybrid PIC‐based lasers using Vernier architectures or a combination of multiple semiconductor amplifiers. Low‐loss and broadband MZIs are achieved by employing two interconnected directional couplers, which utilize asymmetric waveguides in the coupling region to effectively control the phase. Besides achieving state‐of‐the‐art performance for Si3N4‐based integrated lasers at 2.6 µm wavelength region, the demonstrated performance of passive components, including MZIs and spiral DBRs, opens new possibilities for mid‐infrared PIC technology.

High-performance, intelligent, on-chip speckle spectrometer using 2D silicon photonic disordered microring lattice

High-performance integrated spectrometers are highly desirable for applications ranging from mobile phones to space probes. Based on silicon photonic integrated circuit technology, we propose and demonstrate an on-chip speckle spectrometer consisting of a 15×15, 2D disordered microring lattice. The proposed 2D, disordered microring lattice was simulated by the transfer-matrix method. The fabricated device featured a spectral resolution better than 15 pm and an operating bandwidth larger than 40 nm. We also demonstrated that, based on the speckle patterns, our device can perform a spectrum classification using machine learning algorithms, which will have a huge potential in fast, intelligent material and chemical analysis.

System design of segmented planar imaging system

Based on photonic integrated circuit (PIC) technology and synthetic aperture technology, the advanced technology of segmented planar imaging, which can be used to realize ultrathin and high-resolution imaging, is proposed. We develop a sampling lens array structure that combines coherent detection and traditional imaging; it can improve the sampling of low- and medium-frequency information. Based on the proposed lens array structure, a full-chain simulation model of the segmented planar imaging system is established. Under the premise of similar imaging quality, compared with the existing sampling lens structures, the proposed lens array has a simpler structure, lower processing difficulty, and lower cost. The simulation analyses of the duty ratio of the lens array, the light splitting number of PIC arrayed waveguide gratings, and the radius of the single lens are carried out. The simulation results provide a certain reference value for the optimal design of the segmented planar optical imaging system and further prove the advantages of the proposed structure.

C-band operating plasmonic sensor with a high Q-factor/figure of merit based on a silicon nano-ring.

In this paper, we take advantage of the high refractive index property of silicon to design a practical and sensitive plasmonic sensor on a photonic integrated circuit (PIC) platform. It has been demonstrated that a label-free refractive index sensor with sensitivity up to 1124nm/RIU can be obtained using a simple design of a silicon nano-ring with a concentric hexagonal plasmonic cavity. It has also been shown that, with optimum structural parameters, a quality factor (Q-factor) of 307 and a figure of merit (FOM) of 234R I U -1 can be achieved, which are approximately 8 times and 5 times higher than the proposed sensors counterparts, respectively. In addition, the resonance mode of the hexagonal cavity with Si nano-ring (HCS) sensor can be adjusted to operate in the C-band, which is a highly desirable wavelength range in terms of compatibility with devices in PIC technology.

Photon-pair generation in a lossy waveguide

Abstract An on-chip quantum light source based on spontaneous four-wave mixing is an essential element for developing quantum photonic integrated circuit technology, which has the advantage of no connection loss owing to the integration of the source into photonic circuits. The waveguide-based quantum light source inevitably causes propagation loss owing to imperfections in the fabrication process, but the propagation loss effects on photon-pair generation have not been extensively studied. In this study, propagation loss effects were examined using theoretical and experimental methods. In theory, the performance of quantum light sources, such as brightness, heralding efficiency, and coincidence-to-accidental ratio, strongly depend on propagation loss. We fabricate several waveguides with a moderate propagation loss of 2.2 dB/cm to investigate the loss dependence and ascertain that the brightness, heralding efficiency, and coincidence-to-accident ratio strongly correlate with the length of the optical waveguide. The maximum coincidence-count brightness occurred at an optimization length of 1/α, where α is the absorption coefficient. In contrast, the single-count brightness shows slightly different waveguide length dependence owing to loss-induced one-photon states. We expect that the results obtained in this study will greatly assist in determining the proper waveguide length for photon-pair generation according to the source’s application fields. The results will be helpful in the development of a quantum light source suitable for practical and quantum optical integrated circuits and will lead to the development of high-fidelity quantum technologies.

From Lab-on-chip to Lab-in-App: Challenges towards silicon photonic biosensors product developments

This work presents and evaluates different approaches of integrated optical sensors based on photonic integrated circuit (PIC) technologies for refractive index sensing. Bottlenecks in the fabrication flow towards an applicable system are discussed that hinder a cost-effective mass-production for disposable sensor chips. As sensor device, a waveguide coupled micro-ring based approach is chosen which is manufactured in an 8” wafer level process. We will show that the co-integration with a reproducible, scalable and low-cost microfluidic interface is the main challenge which needs to be overcome for future application of silicon technology based PIC sensor chips.

Photonic integrated circuit-based fiber-optic temperature and strain sensing system.

A low-cost, multi-function fiber-optic sensing system is highly desirable for physical security monitoring. Using the silicon photonic integrated circuit technology, we propose and demonstrate a compact fiber-optic sensing system which can simultaneously measure the temperature and strain information. A key enabler of the proposed system is an on-chip optical interrogator consisting of a two-dimensional grating coupler, four microring resonators, and four on-chip photodetectors. The interrogator conveys the temperature and strain information via measuring the center wavelength of a fiber Bragg grating and the polarization state of back-reflected light through a single-mode fiber.

Surface Plasmon Resonance (SPR) Spectroscopy and Photonic Integrated Circuit (PIC) Biosensors: A Comparative Review.

Label-free direct-optical biosensors such as surface-plasmon resonance (SPR) spectroscopy has become a gold standard in biochemical analytics in centralized laboratories. Biosensors based on photonic integrated circuits (PIC) are based on the same physical sensing mechanism: evanescent field sensing. PIC-based biosensors can play an important role in healthcare, especially for point-of-care diagnostics, if challenges for a transfer from research laboratory to industrial applications can be overcome. Research is at this threshold, which presents a great opportunity for innovative on-site analyses in the health and environmental sectors. A deeper understanding of the innovative PIC technology is possible by comparing it with the well-established SPR spectroscopy. In this work, we shortly introduce both technologies and reveal similarities and differences. Further, we review some latest advances and compare both technologies in terms of surface functionalization and sensor performance.

Surface Plasmon Resonance Imaging (SPRi) and Photonic Integrated Circuits (PIC) for COVID-19 Severity Monitoring

Direct optical detection methods such as surface plasmon resonance imaging (SPRi) and photonic-integrated-circuits (PIC)-based biosensors provide a fast label-free detection of COVID-19 antibodies in real-time. Each technology, i.e., SPRi and PIC, has advantages and disadvantages in terms of throughput, miniaturization, multiplexing, system integration, and cost-effective mass production. However, both technologies share similarities in terms of sensing mechanism and both can be used as high-content diagnostics at or near to point of care, where the analyte is not just quantified but comprehensively characterized. This is significant because recent results suggest that not only the antibody concentration of the three isotypes IgM, IgG, and IgA but also the strength of binding (affinity) gives an indication of potential COVID-19 severity. COVID-19 patients with high titers of low affinity antibodies are associated with disease severity. In this perspective, we provide some insights into how SPR and PIC technologies can be effectively combined and complementarily used for a comprehensive COVID-19 severity monitoring. This opens a route toward an immediate therapy decision to provide patients a treatment in an early stage of the infection, which could drastically lowers the risk of a severe disease course.

Integrated Microwave Photonic Spectral Shaping For Linearization and Spurious-Free Dynamic Range Enhancement

Integrated microwave photonics (MWP) is a fast growing area where high frequency microwave signals are processed in the optical domain, merging key advantages of both microwave photonics and photonic integrated circuits (PICs) technologies including low-loss, reconfigurability, advanced functionality, enhanced stability, and reduced footprint. Plenty of functionalities have been demonstrated in integrated MWP, especially based on spectral shaping technique, where the phase and amplitude of the optical spectrum is precisely tailored by PICs. However, on-chip linearization is lagging behind and has not been investigated deeply. It is crucial and urgent to study on-chip linearization methods, which will lead to advanced integrated MWP systems with large spurious-free dynamic range (SFDR). In this paper, we present two novel techniques for on-chip linearization of microwave photonic links. The first technique is based on line-by-line complex spectral shaping using a series of ring resonators. The second technique relies on spatial separation to achieve parallel spectral shaping in two complementary spatial channels. Both methods are demonstrated in low-loss programmable silicon nitride circuits that can already host a number of advanced functionalities. Our results point to the great potential of integrating advanced functionalities and linearization in the same integrated platform.

Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies

Optical links are moving to higher and higher transmission speeds while shrinking to shorter and shorter ranges where optical links are envisaged even at the chip scale. The scaling in data speed and span of the optical links demands modulators to be concurrently performant and cost-effective. Silicon photonics (SiPh), a photonic integrated circuit technology that leverages the fabrication sophistication of complementary metal-oxide-semiconductor technology, is well-positioned to deliver the performance, price, and manufacturing volume for the high-speed modulators of future optical communication links. SiPh has relied on the plasma dispersion effect, either in injection, depletion, or accumulation mode, to demonstrate efficient high-speed modulators. The high-speed plasma dispersion silicon modulators have been commercially deployed and have demonstrated excellent performance. Recent years have seen a paradigm shift where the integration of various electro-refractive and electro-absorptive materials has opened up additional routes toward performant SiPh modulators. These modulators are in the early years of their development. They promise to extend the performance beyond the limits set by the physical properties of silicon. The focus of our study is to provide a comprehensive review of contemporary (i.e., plasma dispersion modulators) and new modulator implementations that involve the integration of novel materials with SiPh.

Silicon nitride PIC-based multi-color laser engines for life science applications.

We implement a multi-color laser engine with silicon nitride photonic integrated circuit technology, that combines four fluorophore excitation wavelengths (405 nm, 488 nm, 561 nm, 640 nm) and splits them with variable attenuation among two output fibers used for different microscope imaging modalities. With the help of photonic integrated circuit technology, the volume of the multi-color laser engine's optics is reduced by two orders of magnitude compared to its commercially available discrete optics counterpart. Light multiplexing is implemented by means of a directional coupler based device and variable optical attenuation as well as fiber switching with thermally actuated Mach-Zehnder interferometers. Total insertion losses from lasers to output fibers are in the order of 6 dB at 488 nm, 561 nm, and 640 nm. Higher insertion losses at 405 nm can be further improved on. In addition to the system level results, spectrally resolved performance has been characterized for each of the developed devices.

Fiber-to-chip light coupling using a graded-index lensed fiber collimator

Fiber-to-chip light coupling using a graded-index (GRIN) fiber collimator is investigated. Our experiments with grating couplers and strip waveguides fabricated in a photonic integrated circuit technology reveal that the peak coupling efficiency of a GRIN fiber collimator is 7.8 dB lower than that of a single-mode fiber. However, the 3-dB alignment tolerance is improved by a factor of about 5.7 giving rise to pluggable sensor solutions. This work opens a path toward a cost-effective and portable sensor platform based on pluggable photonic biosensors using GRIN fiber collimators.

Kicking the habit/semiconductor lasers without isolators.

In this paper, we propose and demonstrate a solution to the problem of coherence degradation and collapse caused by the back reflection of laser power into the laser resonator. The problem is most onerous in semiconductor lasers (SCLs), which are normally coupled to optical fibers, and results in the fact that practically every commercial SCL has appended to it a Faraday-effect isolator that blocks most of the reflected optical power preventing it from entering the laser resonator. The isolator assembly is many times greater in volume and cost than the SCL itself. This problem has resisted a practical and economic solution despite decades of effort and remains the main obstacle to the emergence of a CMOS-compatible photonic integrated circuit technology. A simple solution to the problem is thus of major economic and technological importance. We propose a strategy aimed at weaning semiconductor lasers from their dependence on external isolators. Lasers with large internal Q-factors can tolerate large reflections, limited only by the achievable Q values, without coherence collapse. A laser design is demonstrated on the heterogeneous Si/III-V platform that can withstand 25 dB higher reflected power compared to commercial DFB lasers. Larger values of internal Qs, achievable by employing resonator material of lower losses and improved optical design, should further increase the isolation margin and thus obviate the need for isolators altogether.