Photonic Integrated Circuit Architecture Research Articles

Two-layer integrated photonic architectures with multiport photodetectors for high-fidelity and energy-efficient matrix multiplications.

Photonic integrated circuits (PICs) are emerging as a promising tool for accelerating matrix multiplications in deep learning. Previous PIC architectures, primarily focusing on the matrix-vector multiplication (MVM), have large hardware errors that increase with the device scale. In this work, we propose a novel PIC architecture for MVM, which features an intrinsically small hardware error that does not increase with the device scale. Moreover, we further develop this concept and propose a PIC architecture for the general matrix-matrix multiplication (GEMM), which allows the GEMM to be directly performed on a photonic chip with a high energy efficiency unattainable by parallel or sequential MVMs. This work provides a promising approach to realize a high fidelity and high energy efficiency optical computing platform.

Design and manufacture of an all-polymeric integrated multimode interferometer for visible photonics.

This work demonstrates an integrated multimode interferometer (MMI) based on a fully polymeric platform and optimized for visible range operation. The dimensions of a 2×2 MMI are first calculated analytically and simulated using finite elements method. The devices are manufactured using two layers of negative tone photoresists. The top layer is patterned by e-beam lithography demonstrating the adaptability of this material, naturally designed to respond to UV radiation. Fabrication tolerance was smaller than 100 nm. Devices were optically characterized with a 635 nm input source and the best performance for a 3 dB power splitter was found at an interferometric cavity dimension of 10.5 × 190.68 µm. Other interferometric lengths were characterized to establish a process design kit that allows future use of this platform in more complex photonic integrated circuits architectures.

Waveguide-integrated mid-infrared photodetection using graphene on a scalable chalcogenide glass platform

The development of compact and fieldable mid-infrared (mid-IR) spectroscopy devices represents a critical challenge for distributed sensing with applications from gas leak detection to environmental monitoring. Recent work has focused on mid-IR photonic integrated circuit (PIC) sensing platforms and waveguide-integrated mid-IR light sources and detectors based on semiconductors such as PbTe, black phosphorus and tellurene. However, material bandgaps and reliance on SiO2 substrates limit operation to wavelengths λ ≲ 4 μm. Here we overcome these challenges with a chalcogenide glass-on-CaF2 PIC architecture incorporating split-gate photothermoelectric graphene photodetectors. Our design extends operation to λ = 5.2 μm with a Johnson noise-limited noise-equivalent power of 1.1 nW/Hz1/2, no fall-off in photoresponse up to f = 1 MHz, and a predicted 3-dB bandwidth of f3dB > 1 GHz. This mid-IR PIC platform readily extends to longer wavelengths and opens the door to applications from distributed gas sensing and portable dual comb spectroscopy to weather-resilient free space optical communications.

Recent progress of silicon integrated light emitters and photodetectors for optical communication based on two-dimensional materials

Van der Waals materials are expected to meet the miniaturization and integration challenges in photonic integrated circuits (PIC) as active devices for optical communication. Recently, ultralow threshold lasers, ultra-sensitive or large bandwidth photodetectors have been demonstrated on silicon photonics platforms that are compatible with the state-of-the-art CMOS process. Here we summarize the characteristics of these hetero-integrated light-emitting and photodetecting devices, with focuses on materials, physical mechanisms, and device performances. We also discuss the strategies of future PIC architectures for valley-photonics, hybrid and 3D integrations. This review aims to summarize the most recent progress and to help identify the challenges and opportunities in this rapidly developing area.

Universal programmable photonic architecture for quantum information processing

We present a photonic integrated circuit architecture for a quantum programmable gate array (QPGA) capable of preparing arbitrary quantum states and operators. The architecture consists of a lattice of phase-modulated Mach-Zehnder interferometers, which perform rotations on path-encoded photonic qubits, and embedded quantum emitters, which use a two-photon scattering process to implement a deterministic controlled-$\sigma_z$ operation between adjacent qubits. By appropriately setting phase shifts within the lattice, the device can be programmed to implement any quantum circuit without hardware modifications. We provide algorithms for exactly preparing arbitrary quantum states and operators on the device and we show that gradient-based optimization can train a simulated QPGA to automatically implement highly compact approximations to important quantum circuits with near-unity fidelity.

Component-wise testing of laser-written integrated coupled-mode beam splitters.

Photonic integrated circuits (PICs) are important enabling technologies for the developments of areas such as quantum information processing (QIP). Coupled-mode integrated beam splitters (IBS) are widely used in many PICs, so direct and accurate testing of individual IBSs inside a PIC is increasingly desirable, as the development of PICs for QIP is scaled up. Here we demonstrate a solution for component-wise testing of coupled-mode IBSs without limitations on component location and PIC architectures. The method is based on the imaging of an individual IBS with a custom-built multifunctional adaptive optical microscope, combined with the calculation of its beam-splitting ratio through numerical modelling.

Canceling Thermal Cross-Talk Effects in Photonic Integrated Circuits

Thermal actuators are among the most consolidated and widespread devices for the active control of photonic integrated circuits (PICs). As a main drawback, mutual thermal crosstalk among actuated devices integrated onto the same photonic chip can affect the working point of the PIC and can reduce the efficiency of automated tuning and calibration procedures. In this paper, a strategy to cancel out the effects of the phase coupling induced by thermal crosstalk is presented. In our technique, we named thermal eigenmode decomposition (TED), all the actuators of the PIC are controlled simultaneously according to the eigensolution of the thermally coupled system. The effectiveness of the TED method is validated by numerical simulations and experiments carried out on coupled microring resonator and switch fabrics of Mach–Zehnder interferometers. With respect to individual control of phase actuators, where thermal crosstalk can hinder the convergence of automated tuning algorithms, with the TED technique convergence is always reached, requires a lower number of iterations, and is less sensitive to the initial state of the PIC. The proposed TED method can be applied to generic tuning and locking algorithm, can be employed in arbitrary PIC architectures and its validity can be extended to systems where phase coupling is induced by other physical effects, such as mutual mechanical stress and electromagnetic coupling among RF lines.

Monolithically Integrated Perovskite Semiconductor Lasers on Silicon Photonic Chips by Scalable Top-Down Fabrication.

Metal-halide perovskites are promising lasing materials for the realization of monolithically integrated laser sources, the key components of silicon photonic integrated circuits (PICs). Perovskites can be deposited from solution and require only low-temperature processing, leading to significant cost reduction and enabling new PIC architectures compared to state-of-the-art lasers realized through the costly and inefficient hybrid integration of III-V semiconductors. Until now, however, due to the chemical sensitivity of perovskites, no microfabrication process based on optical lithography (and, therefore, on existing semiconductor manufacturing infrastructure) has been established. Here, the first methylammonium lead iodide perovskite microdisc lasers monolithically integrated into silicon nitride PICs by such a top-down process are presented. The lasers show a record low lasing threshold of 4.7 μJcm-2 at room temperature for monolithically integrated lasers, which are complementary metal-oxide-semiconductor compatible and can be integrated in the back-end-of-line processes.

A photonic circuit for complementary frequency shifting, in-phase quadrature/single sideband modulation and frequency multiplication: analysis and integration feasibility

A novel photonic integrated circuit architecture for implementing orthogonal frequency division multiplexing by means of photonic generation of phase-correlated sub-carriers is proposed. The circuit can also be used for implementing complex modulation, frequency up-conversion of the electrical signal to the optical domain and frequency multiplication. The principles of operation of the circuit are expounded using transmission matrices and the predictions of the analysis are verified by computer simulation using an industry-standard software tool. Non-ideal scenarios that may affect the correct function of the circuit are taken into consideration and quantified. The discussion of integration feasibility is illustrated by a photonic integrated circuit that has been fabricated using ‘library’ components and which features most of the elements of the proposed circuit architecture. The circuit is found to be practical and may be fabricated in any material platform that offers a linear electro-optic modulator such as organic or ferroelectric thin films hybridized with silicon photonics.

Universal discrete Fourier optics RF photonic integrated circuit architecture.

This paper describes a coherent electro-optic circuit architecture that generates a frequency comb consisting of N spatially separated orders using a generalised Mach-Zenhder interferometer (MZI) with its N × 1 combiner replaced by an optical N × N Discrete Fourier Transform (DFT). Advantage may be taken of the tight optical path-length control, component and circuit symmetries and emerging trimming algorithms offered by photonic integration in any platform that offers linear electro-optic phase modulation such as LiNbO3, silicon, III-V or hybrid technology. The circuit architecture subsumes all MZI-based RF photonic circuit architectures in the prior art given an appropriate choice of output port(s) and dimension N although the principal application envisaged is phase correlated subcarrier generation for all optical orthogonal frequency division multiplexing. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. Implementation is found to be practical.

Cascade photonic integrated circuit architecture for electro-optic in-phase quadrature/single sideband modulation or frequency conversion.

A photonic integrated circuit architecture for implementing frequency upconversion is proposed. The circuit consists of a 1×2 splitter and 2×1 combiner interconnected by two stages of differentially driven phase modulators having 2×2 multimode interference coupler between the stages. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. The intrinsic conversion efficiency of the proposed design is improved by 6 dB over the alternative functionally equivalent circuit based on dual parallel Mach-Zehnder modulators known in the prior art. A two-tone analysis is presented to study the linearity of the proposed circuit, and a comparison is provided over the alternative. The proposed circuit is suitable for integration in any platform that offers linear electro-optic phase modulation such as LiNbO(3), silicon, III-V, or hybrid technology.

Heterodyne receiver PICs as the first monolithically integrated tunable receivers for OFDM system applications

The state of the art in the fabrication of heterodyne receiver photonic integrated circuits (PICs) is described and in particular the results and experiences of the first fabrication of polarization-insensitive heterodyne receiver PICs are emphasized. The fabrication is based on a versatile integration concept with the potential also to fabricate other PIC architectures with different functionalities by only a single fabrication process.